HP VMware ESXi management environment integration note

30
Data source HP SIM vCenter Server and vSphere Client
package type
 Fan collection health status
 Fan redundancy set, number of fans,
associations with individual fan members,
and redundancy status
Power
Supply
Subsystem
 Individual power supply type, physical
power supply location and health status
 Individual power supply module removal
conditions and package type
 Power supply collection health status
 Power supply redundancy set, number of
power supplies, associations with individual
power supply members, and redundancy
status

Power supply temperature exceeded normal
operating range
 Power supply temperature returned to
normal operating range
 Individual and overall power
supply health status
Memory
Subsystem,
Version 2.0
only
 System memory capacity, starting and
ending address, and health status
 Individual memory module manufacturer,
part number, serial number, removal
conditions, data and total width, capacity,
speed, type, position, form factor, bank
label, SPD byte, location and health status
 Individual memory board package type,
removal conditions, hosting board, locked
state, number of sockets, available memory
size, total memory size, location and health
status
 Individual memory module slot connector
layout, gender and description, location,
and health status
 Version2.0: memory redundancy set type,
load balance algorithm, operating speed,
available and total memory size, current,
target and available configurations, and
redundancy status
 Version2.0: memory collection health status

Memory module has failed or is predicted
to fail
 Memory board error
 Memory redundancy degraded
 Memory recovered from degraded
redundancy
 Overall memory health status,
and total physical system memory