HP SureStore E Disk Array FC60 Service Manual hpHH Edition E0900 Printed in U.S.A.
Notice Safety Notices © Hewlett-Packard Company, 1999, 2000. All rights reserved. Hewlett-Packard Company makes no warranty of any kind with regard to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. HewlettPackard shall not be liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material.
Format Conventions Denotes WARNING A hazard that can cause personal injury Caution A hazard that can cause hardware or software damage Note Significant concepts or operating instructions this font Text to be typed verbatim: all commands, path names, file names, and directory names this font Text displayed on the screen Printing History 1st Edition - May 2000 2nd Edition - September 2000 3
About This Book This guide is intended for use by system administrators and others involved in operating and managing the HP SureStore E Disk Array FC60. It is organized into the following chapters and section. Chapter 1, Product Description Describes the features, controls, and operation of the disk array. Chapter 2, Topology and Array Planning Guidelines for designing the disk array configuration that best meets your needs. Chapter 3, Installation Instruction for moving the disk array.
Related Documents and Information The following items contain information related to the installation and use of the HP SureStore E Disk Array and its management software. • HP SureStore E Disk Array FC60 Advanced User’s Guide - this is the expanded version of the book you are reading. Topics that are discussed in more detail in the Advanced User’s Guide are clearly identified throughout this book. !"Download: www.hp.
1 Product Description Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Operating System Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Management Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Dynamic Capacity Expansion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 2 Topology and Array Planning Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Array Design Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Array Hardware Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Electrical Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Power Distribution Units (PDU/PDRU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Installing PDUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Recommended UPS Models. . . . . . . . . . . . . .
Adding Disk Enclosures to Increase Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 General Rules for Adding Disk Enclosures to the Disk Array . . . . . . . . . . . . . 174 Step 1. Plan the Expanded Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 Step 2. Backup All Disk Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176 Step 3. Prepare the Disk Array for Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . .
Disk Array Installation/Troubleshooting Checklist . . . . . . . . . . . . . . . . . . . . . . . . . 211 Power-Up Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 Controller Enclosure Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215 Controller Enclosure LEDs . . . . . . . . . . . . .
Disk Enclosure SC10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304 Front Cover Door Removal/Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 308 Top Cover Removal/Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 310 Power Button Assembly Removal/Replacement . . . . . . . . . . . . . . . . . . . . . . . . 312 Backplane/Mezzanine Removal/Replacement . . . . . . . . . . . . . . . . . . . . . . . . . .
A5636A Disk Enclosure SC10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 363 Disk Array FC60 Upgrade and Add-On Products . . . . . . . . . . . . . . . . . . . . . . . . 364 Weight: Contents PDU/PDRU Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365 Replaceable Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Harmonics Conformance (Japan). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386 Class A Warning Statement (Taiwan). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 386 Spécification ATI Classe A (France Seulement) . . . . . . . . . . . . . . . . . . . . . . . . . 387 Product Noise Declaration (For Germany Only) . . . . . . . . . . . . . . . . . . . . . . . . 387 Geräuschemission (For Germany Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PRODUCT DESCRIPTION Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disk Enclosure Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Array Controller Enclosure Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Disk Array High Availability Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Product Description The HP SureStore E Disk Array FC60 (Disk Array FC60) is a disk storage system that features high data availability, high performance, and storage scalability. To provide high availability, the Disk Array FC60 uses redundant, hot swappable modules, which can be replaced without disrupting disk array operation should they fail.
Product Description Array Controller FC60 SureStore E Disk System SC10 Figure 1 HP SureStore E Disk Array FC60 (Controller with Six Disk Enclosures) Product Description 17
Operating System Support The Disk Array FC60 is currently supported on the following operating systems: • Windows NT 4.0 • Windows 2000 Management Tools The following tools are used to manage the Disk Array FC60 on Windows NT and Windows 2000. This tool is not included with the disk array, but must be ordered separately as product A5628A.
Product Description Scalable Storage Capacity The Disk Array FC60 is designed to provide maximum scalability, simplifying the process of adding storage capacity as required. Storage capacity can be added in three ways: – By adding additional disk modules to a disk enclosure – By adding additional disk enclosures to the array – By replacing existing disk modules with higher capacity modules The controller enclosure supports up to six disk enclosures.
Disk Enclosure Components The SureStore E Disk System SC10, or disk enclosure, is a high availability Ultra2 SCSI storage product. It provides an LVD SCSI connection to the controller enclosure and ten slots on a single-ended backplane for high-speed, high-capacity LVD SCSI disks. Six disk enclosures fully populated with 9.1 Gbtye disks provide 0.54 Tbytes of storage in a 2-meter System/E rack. When fully populated with 73 Gbyte disks, the array provides over 3 Tbytes of storage.
Product Description BCC Modules Power Supply Modules Fan Modules Disk Modules Chassis (and Backplane) (Front Door Not Shown) Figure 2 Disk Enclosure Components, Exploded View Disk Enclosure Components 21
Operation Features The disk enclosure is designed to be installed in a standard 19-inch rack and occupies 3.5 EIA units (high). Disk drives mount in the front of the enclosure. Also located in the front of the enclosure are a power switch and status LEDs. A lockable front door shields RFI and restricts access to the disk drives and power button (Figure 3 on page 23). BCCs are installed in the back of the enclosure along with redundant power supplies and fans.
Product Description A B C D E F G H I J K Figure 3 system LEDs power button disk module disk module LEDs door lock ESD plug mounting ear power supply BCCs fans component LEDs Disk Enclosure Front and Back View Power Switch The power switch (B in Figure 3) interrupts power from the power supplies to the disk enclosure components. Power to the power supplies is controlled by the power cords and the AC source.
Disk Enclosure SC10 Modules The disk enclosure hot-swappable modules include the following: • • • Disks and fillers Fans Power supplies Disks and Fillers Hot-swappable disk modules make it easy to add or replace disks. Fillers are required in all unused slots to maintain proper airflow within the enclosure. Figure 4 illustrates the 3.5-inch disks in a metal carrier. The open carrier design allows ten half height (1.6 inch) disks to fit the 19-inch width of a standard rack and meet cooling needs.
Product Description A B C D Figure 4 bezel handle cam latch carrier frame standoffs E circuit board F insertion guide G capacity label Disk Module Disks fit snugly in their slots. The cam latch (B in Figure 4) is used to seat and unseat the connectors on the backplane. A label (G) on the disk provides the following information: • • • Disk mechanism height: 1.6 inch (half height) or 1 inch (low profile) Rotational speed: 10K RPM Capacity: 9.1 Gbyte, 18.
BCCs Two Backplane Controller Cards, BCCs, control the disks on one or two buses according to the setting of the Full Bus switch. When the Full Bus switch is set to on, BCC A, in the top slot, accesses the disks in all ten slots. When the Full Bus switch is off, BCC A accesses disks in the even-numbered slots and BCC B accesses disks in the odd-numbered slots. In full bus mode, all ten disks can be accessed through either BCC. However, internally each BCC still manages five disks.
Product Description Each BCC provides two LVD SCSI ports (B in Figure 5) for connection to the controller enclosure. The EEPROM on each BCC stores 2 Kbytes of configuration information and user-defined data, including the manufacturer serial number, World Wide Name, and product number. The following are additional features of the BCC: • LEDs (C in Figure 5) show the status of the BCC and the bus.
Fans Redundant, hot-swappable fans provide cooling for all enclosure components. Each fan has two internal high-speed blowers (A in Figure 6), an LED (B), a pull tab (C), and two locking screws (D). A B C D internal blowers LED pull tab locking screws Figure 6 Fan Internal circuitry senses blower motion and triggers a fault when the speed of either blower falls below a critical level. If a fan failure occurs, the amber fault LED will go on.
Redundant, hot-swappable 450-watt power supplies convert wide-ranging AC voltage from an external main to stable DC output and deliver it to the backplane. Each power supply has two internal blowers, an AC receptacle (A in Figure 7), a cam handle (B) with locking screw, and an LED (C). Internal control prevents the rear DC connector from becoming energized when the power supply is removed from the disk enclosure. NOTE: LED position varies.
Power supplies share the load reciprocally; that is, each supply automatically increases its output to compensate for reduced output from the other. If one power supply fails, the other delivers the entire load. Internal circuitry triggers a fault when a power supply fan or other power supply part fails. If a power supply failure occurs, the amber fault LED will go on.
Product Description Array Controller Enclosure Components The array controller enclosure, like the disk enclosure, consists of several modules that can be easily replaced, plus several additional internal assemblies. See Figure 8. Together, these removable modules and internal assemblies make up the field replaceable units (FRUs). Many modules can be removed and replaced without disrupting disk array operation.
Power Supply Fan Module Power Supply Modules Controller Chassis Controller Fan Controller Module A Controller Module B BBU (Front Cover Not Shown) Figure 8 Controller Enclosure Exploded View During operation, controller enclosure status is indicated by five LEDs on the front left of the controller enclosure. Faults detected by the controller module cause the corresponding controller enclosure fault LED to go on. Additional LEDs on the individual components identify the failed component.
Product Description Figure 9 Controller Enclosure Front View Array Controller Enclosure Components 33
Figure 10 Controller Enclosure Rear View Front Cover The controller enclosure has a removable front cover which contains slots for viewing the main operating LEDs. The cover also contains grills that aid air circulation. The controller modules, controller fan, and battery backup unit are located behind this cover. This cover must be removed to gain access to these modules, and also, to observe the controller status and BBU LEDs.
Product Description Controller Modules The controller enclosure contains two controller modules. See Figure 11. These modules provide the main data and status processing for the Disk Array FC60. The controller modules slide into two controller slots (A and B) and plug directly into the backplane. Two handles lock the modules in place.
Each controller module has ten LEDs. See Figure 12. One LED identifies the controller module’s power status. A second LED indicates when a fault is detected. The remaining eight LEDs provide detailed fault condition status. The most significant LED, the heartbeat, flashes approximately every two seconds beginning 15 seconds after power-on. "Troubleshooting" on page 207 contains additional information on controller LED operation.
Product Description Controller Memory Modules Each controller module contains SIMM and DIMM memory modules. Two 16-Mbyte SIMMs (32 Mbytes total) store controller program and other data required for operation. The controller includes two DIMMs, which provide 256 Mbytes of cache. Cache memory serves as temporary data storage during read and write operations, improving I/O performance. When cache memory contains write data, the Fast Write Cache LED, on the front of the controller enclosure goes on.
Figure 13 Controller Fan Module 38 Array Controller Enclosure Components
Product Description Power Supply Modules Two separate power supplies provide electrical power to the internal components by converting incoming AC voltage to DC voltage. Both power supplies are housed in removable power supply modules that slide into two slots in the back of the controller and plug directly into the power interface board. See Figure 14. Figure 14 Power Supply Modules Each power supply uses a separate power cord. These two power cords are special ferrite bead cords (part no.
Each power supply is equipped with a power switch to disconnect power to the supply. Turning off both switches turns off power to the controller. This should not be performed unless I/O activity to the disk array has been stopped, and the write cache has been flushed as indicated by the Fast Write Cache LED being off. CAUTION The controller power switches should not be turned off unless all I/O activity to the disk array has been suspended from the host.
Product Description Figure 15 Power Supply Fan Module Array Controller Enclosure Components 41
Battery Backup Unit The controller enclosure contains one removable battery backup unit (BBU) that houses two rechargeable internal batteries (A and B) and a battery charger board. The BBU plugs into the front of the controller enclosure where it provides backup power to the controller’s cache memory during a power outage. The BBU will supply power to the controllers for up to five days (120 hrs). All data stored in memory will be preserved as long as the BBU supplies power.
Product Description The BBU contains four LEDs that identify the condition of the battery. Internally, the BBU consists of two batteries or banks, identified as bank “A” and bank “B.” During normal operation both of the Full Charge LEDs (Full Charge-A and Full Charge-B) are on and the two amber Fault LEDs are off. If one or both of the Fault LEDs are on, refer to "Troubleshooting" on page 207 for information on solving the problem. The Full Charge LEDs flash while the BBU is charging.
• 44 If the BBU is removed, do not shut off power to the array unless the Fast Write Cache LED is off. Data in write cache will be posted to disk 10 seconds after the BBU is removed.
Product Description Disk Array High Availability Features High availability systems are designed to provide uninterrupted operation should a hardware failure occur. Disk arrays contribute to high availability by ensuring that user data remains accessible even when a disk or other component within the Disk Array FC60 fails.
The disk array uses hardware mirroring, in which the disk array automatically synchronizes the two disk images, without user or operating system involvement. This is unlike the software mirroring, in which the host operating system software (for example, LVM) synchronizes the disk images. Disk mirroring is used by RAID 1 and RAID 0/1 volume groups. A RAID 1 volume group consists of exactly two disks: a primary disk and a mirror disk.
0 If this bit is now written as 1... Data + 1 Data + 1 Data + 1 Product Description Data Parity + 1 = 0 1 0 0 1 0 0 1 1 1 0 1 0 0 0 1 0 1 0 0 1 0 1 0 0 This bit will also be changed to a 1 so the total still equals 0.
using a 5-disk RAID 5 volume group, a stripe segment size of 32 blocks (16 KB) would ensure that an entire I/O would fit on a single stripe (16 KB on each of the four data disks). The total stripe size is the number of disks in a volume group multiplied by the stripe segment size. For example, if the stripe segment size is 32 blocks and the volume group comprises five disks, the stripe size is 32 X 5, or 160 blocks (81,920 bytes).
Product Description Figure 18 RAID 0 Volume Group RAID 1 RAID 1 uses mirroring to achieve data redundancy. RAID 1 provides high availability and good performance, but at the cost of storage efficiency. Because all data is mirrored, a RAID 1 volume group has a storage efficiency of 50%. A RAID 1 volume group consists of exactly two disks configured as a mirrored pair. One disk is the data disk and the other is the disk mirror.
Figure 19 shows the distribution of data on a RAID 1 volume group. Note that all data on the data disk is replicated on the disk mirror. Figure 19 RAID 1 Volume Group RAID 0/1 RAID 0/1 uses mirroring to achieve data redundancy and disk striping to enhance performance. It combines the speed advantage of block striping with the redundancy advantage of mirroring. Because all data is mirrored, a RAID 0/1 volume group has a storage efficiency of 50%.
Product Description of the pair. If both disks fail or become inaccessible simultaneously, the data on the volume group becomes inaccessible. Figure 20 illustrates the distribution of data in a four-module RAID 0/1 volume group. The disk block addresses in the stripe proceed sequentially from the first pair of mirrored disks (disks 1 and 2) to the second pair of mirrored disks (disks 3 and 4), then again from the first mirrored disks, and so on.
disk. The rebuilt volume group contains an exact replica of the information it would have contained had the disk not failed. Until a failed disk is replaced (or a rebuild on a global hot spare is completed), the volume group operates in degraded mode. The volume group must now use the data and parity on the remaining disks to recreate the content of the failed disk, which reduces performance. In addition, while in degraded mode, the volume group is susceptible to the failure of the second disk.
Product Description RAID 3 works well for single-task applications using large block I/Os. It is not a good choice for transaction processing systems because the dedicated parity drive is a performance bottleneck. Whenever data is written to a data disk, a write must also be performed to the parity drive. On write operations, the parity disk can be written to four times as often as any other disk module in the group.
Figure 22 RAID 5 Volume Group With its individual access characteristics, RAID 5 provides high read throughput for small block-size requests (2 KB to 8 KB) by allowing simultaneous read operations from each disk in the volume group. During a write I/O, the disk array must perform four individual operations, which affects the write performance of a RAID 5 volume group. For each write, the disk array must perform the following steps: 1. Read the existing user data from the disks. 2.
Product Description RAID Level Comparisons To help you decide which RAID level to select for a volume group, the following tables compare the characteristics for the supported RAID levels. Where appropriate, the relative strengths and weakness of each RAID level are noted. Table 1 RAID Level Comparison: Data Redundancy Characteristics Handle multiple disk failures? RAID Level Disk Striping Mirroring Parity RAID 0 Yes No No No. RAID 0 offers no data redundancy or protection against disk failure.
Table 3 RAID Level Comparison: Relative Performance Compared to an Individual Disk* Volume Group Configuration Relative Read Performance Relative Write Performance for Large Sequential Access for Large Sequential Access RAID 0 The read and write performance of a RAID 0 volume group increases as the multiple of the number of disks in the volume group. For example, a 4-disk RAID 0 volume group will achieve close to four times the performance of a single disk. RAID 1 mirrored pair Up to 2.
Product Description Table 4 RAID Level Comparison: General Performance Characteristics RAID Level General Performance Characteristics RAID 0 – Simultaneous access to multiple disks increases I/O performance. In general, the greater the number of mirrored pairs, the greater the increase in performance. RAID 1 – A RAID 1 mirrored pair requires one I/O operation for a read and two I/O operations for a write, one to each disk in the pair.
Table 5 RAID Level Comparison: Application and I/O Pattern Performance Characteristics RAID level Application and I/O Pattern Performance RAID 0 RAID 0 is a good choice in the following situations: – Data protection is not critical. RAID 0 provides no data redundancy for protection against disk failure. – Useful for scratch files or other temporary data whose loss will not seriously impact system operation. – High performance is important.
Product Description Global Hot Spare Disks A global hot spare disk is reserved for use as a replacement disk if a data disk fails. Their role is to provide hardware redundancy for the disks in the array. To achieve the highest level of availability, it is recommended that one global hot spare disk be created for each channel. A global hot spare can be used to replace any failed data disk within the array regardless of what channel it is on.
Settings that give a higher priority to the rebuild process will cause the rebuild to complete sooner, but at the expense of I/O performance. Lower rebuild priority settings favors host I/Os, which will maintain I/O performance but delay the completion of the rebuild. The rebuild priority settings selected reflect the importance of performance versus data availability. The volume group being rebuilt is vulnerable to another disk failure while the rebuild is in progress.
Product Description Data and parity from the remaining disks are used to rebuild the contents of disk 3 on the hot spare disk. The information on the hot spare is copied to the replaced disk, and the hot spare is again available to protect against another disk failure.
Capacity Management Features The disk array uses a number of features to manage its disk capacity efficiently. Volume groups allow you to partition the total disk capacity into smaller, functional entities. Caching improves disk array performance by using controller RAM to temporarily store data during I/Os. Volume Groups The capacity of the disk array can be divided into entities called volume groups. Individual disks are grouped together to form a volume group.
Product Description Disk Array Caching Disk caching is the technique of storing data temporarily in RAM while performing I/Os to the disk array. Using RAM as a temporary storage medium can significantly improve the response time for many types of I/O operations. From the host’s perspective the data transfer is complete, even if the disk media was not involved in the transaction. Both write caching and read caching are always enabled.
In the event of an unexpected disk array shutdown or loss of power, the BBU provides power to cache memory to maintain the cache for 120 hours (5 days). Dynamic Capacity Expansion If slots are available in the disk enclosures, you can increase the capacity of the disk array without disrupting operation. By simply adding new disks to the array and then creating a new volume group, the capacity can be expanded.
2 TOPOLOGY AND ARRAY PLANNING Topology and Array Planning Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Array Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Recommended Disk Array Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Topologies for Windows NT and Windows 2000 . . . . . . . . . . . . . . . . . . . . . . . . .
Overview This chapter provides information to assist you in configuring a storage system that meets your application needs using the Disk Array FC60. In designing the storage system, two things must be considered: the configuration of the disk array and how the array will fit into the system (topology). Factors to be considered when designing an array for a specific application include high availability requirements, performance, storage capacity, and future expandability.
Array Design Considerations • • • • Topology and Array Planning The Disk Array FC60 is a versatile storage system that can be configured to meet varying application storage needs. To meet a specific application need, the array should be configured to optimize the features most important for the application.
Ultra2 SCSI Channel Operations The disk array controller enclosure provides six Ultra2 SCSI channel connections for up to six disk enclosures. Six separate channels provide several options. One is that the disk arrays can be added incrementally as storage capacity is needed. It also allows six disk enclosures to be connected, as mentioned above, to provide a high volume storage capacity array. Finally, multiple Ultra2 SCSI channels increase data throughput.
High Availability • Two controllers connected to separate Fibre Channel loops (using separate Fibre Channel host I/O adaptors) • Two disk enclosures (minimum) • Four disk modules, two in each disk enclosure (minimum) • Volume groups that use only one disk per disk enclosure. Topology and Array Planning If your application requires high availability, you should implement the options discussed here. To configure the array for high availability, there must be no single points of failure.
disk enclosure). This configuration also offers full sequential performance and is more economical to implement. To scale up sequential transfer performance from the host, configure additional disk arrays. This will increase the total I/O bandwidth available to the server. Performance can also be measured by the number of I/O operations per second a system can perform. I/Os per second are important in OLTP (on-line transaction processing) applications.
Storage Capacity Topology and Array Planning For configurations where maximum storage capacity at minimum cost is a requirement, consider configuring the disk array in RAID 5 (using the maximum number of data drives per parity drives) and only supplying one or two hot spare drives per disk array. Also, purchase the lowest cost/Mbyte drive available (typically the largest capacity drives available at the time of purchase). This configuration allows the maximum volume of storage at the lowest cost.
another, two or one disk enclosures, respectively, can be added by using split-bus mode. However, if you are adding up to four, five, or six enclosure, the enclosures configuration will need to be switched from split-bus to full-bus (refer to “Disk Enclosure Bus Configuration” section, earlier in this chapter, for additional information). Note Typically adding only one enclosure does not provide any options for creating volume groups.
Recommended Disk Array Configurations Topology and Array Planning This section presents recommended configurations for disk arrays using one to six disk enclosures. Configurations are provided for achieving high availability/high performance, and maximum capacity. The configuration recommended by Hewlett-Packard is the high availability/ high performance configuration.
• Global hot spares - although none of the configurations use global hot spares, their use is recommended to achieve maximum protection against disk failure. For more information, see "Global Hot Spare Disks" on page 59. • Split bus operation - With three or fewer disk enclosures, increased performance can be achieved by operating the disk enclosures in split bus mode, which increases the number of SCSI busses available for data transfer.
• Data Availability – Not recommended for maximum high availability. – Handles a single disk failure, single BCC failure, a single channel failure, or a single controller failure Topology and Array Planning – Expansion requires powering down the disk array, removing terminators and/or cables from the enclosures, and cabling additional disk enclosures.
Two Disk Enclosure Configurations High Availability/ High Performance • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Two disk enclosures with ten 73 GByte disk modules (20 disks total) – Disk enclosures configured for split-bus mode (two SCSI channels per enclosure) • Volume Group Configuration – Ten RAID 1 volume groups, each comprising two disks (1+1) – Each disk in a volume group is in a separate enclosure • High Availability – Handles a sin
Topology and Array Planning Figure 25 Two Disk Enclosure High Availability/ High Performance Configuration Recommended Disk Array Configurations 77
Maximum Capacity Note • This configuration is not recommended for environments where high availability is critical. To achieve high availability each disk in a volume group should be in a different disk enclosure. This configuration does not achieve that level of protection.
Topology and Array Planning Figure 26 Two Disk Enclosure Maximum Capacity Configuration Recommended Disk Array Configurations 79
Three Disk Enclosure Configurations High Availability/ High Performance • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Three disk enclosures with ten 73 GByte disks each (30 disks total) – Disk enclosures configured for split-bus mode (two SCSI channels per enclosure) • Volume Group Configuration – 15 RAID 1 volume groups, each comprising two disks (1+1) – Each disk in a volume group is in a separate enclosure • High Availability – Handles a si
Topology and Array Planning Figure 27 Three Disk Enclosure High Availability/ High Performance Configuration Recommended Disk Array Configurations 81
Maximum Capacity • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Three disk enclosures with ten 73 GByte disks each (30 disks total) – Disk enclosures configured for split-bus mode (two SCSI channels per enclosure) • Volume Group Configuration – Ten RAID 5 volume groups, each comprising three disks (2 data + 1 parity). – Each disk in a volume group is in a separate enclosure.
Topology and Array Planning Figure 28 Three Disk Enclosure Maximum Capacity Configuration Recommended Disk Array Configurations 83
Four Disk Enclosure Configurations High Availability/High Performance • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Four disk enclosures with ten 73 GByte disks each (40 disks total) – Disk enclosures configured for full-bus mode (one SCSI channel per enclosure) • Volume Group Configuration – Ten RAID 0/1 volume groups, each comprising four disks (2+2) – Each disk in a volume group is in a separate enclosure.
Topology and Array Planning Figure 29 Four Disk Enclosure High Availability/High Performance Configuration Recommended Disk Array Configurations 85
Maximum Capacity • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Four disk enclosures with ten 73 GByte disks each (40 disks total) – Disk enclosures configured for full-bus mode (one SCSI channel per enclosure) • Volume Group Configuration – Ten RAID 5 volume groups, each comprising four disks (3 data + 1 parity) – Each disk in a volume group is in a separate enclosure.
Topology and Array Planning Figure 30 Four Disk Enclosure Maximum Capacity Configuration Recommended Disk Array Configurations 87
Five Disk Enclosure Configurations High Availability/High Performance • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Five disk enclosures with ten 73 GByte disks each (50 disks total) – Disk enclosures configured for full-bus mode (one SCSI channel per enclosure) • Volume Group Configuration – Ten RAID 0/1 volume groups, each comprising four disks (2+2) – Five RAID 1 volume groups, each comprising two disks (1+1) – Each disk in a volume group is
Topology and Array Planning Figure 31 Five Disk Enclosure High Availability/High Performance Configuration Recommended Disk Array Configurations 89
Maximum Capacity • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Five disk enclosures with ten 73 GByte disks each (50 disks total) – Disk enclosures configured for full-bus mode (one SCSI channel per enclosure) • Volume Group Configuration – Ten RAID 5 volume groups, each comprising five disks (4 data + 1 parity) – Each disk in a volume group is in a separate enclosure.
Topology and Array Planning Figure 32 Five Disk Enclosure Maximum Capacity Configuration Recommended Disk Array Configurations 91
Six Disk Enclosure Configurations High Availability/High Performance • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Six disk enclosures with ten 73 GByte disks each (60 disks total) – Disk enclosures configured for full-bus mode (one SCSI channel per enclosure) • Volume Group Configuration – Ten RAID 0/1 volume groups, each comprising six disks (3+3) – Each disk in a volume group is in a separate enclosure • High Availability – Handles a single
Topology and Array Planning Figure 33 Six Disk Enclosure High Availability/High Performance Configuration Recommended Disk Array Configurations 93
Maximum Capacity • Hardware Configuration – Two disk array controllers connected directly to host Fibre Channel adapters – Six disk enclosures with ten 73 GByte disks each (60 disks total) – Disk enclosures configured for full-bus mode (one SCSI channel per enclosure) • Volume Group Configuration – Ten RAID 5 volume groups, each comprising six disks (5 data + 1 parity) – Each disk in a volume group is in a separate enclosure • High Availability – Handles a single disk failure, single disk enclosure/BCC
Topology and Array Planning Figure 34 Six Disk Enclosure High Maximum Capacity Configuration Recommended Disk Array Configurations 95
Total Disk Array Capacity The total capacity provided by the disk array depends on the number and capacity of disks installed in the array, and the RAID levels used. RAID levels are selected to optimize performance or capacity. Table 6 lists the total capacities available when using fully loaded disk enclosures configured for optimum performance. Table 7 lists the same for optimum capacity configurations. The capacities listed reflect the maximum capacity of the volume group.
For high-availability, one disk per SCSI channel is used as a global hot spare. Table 6 Capacities for Optimized Performance Configurations Number of disk enclosures RAID Level No. of LUNs Disks per LUN 2 (split bus) 1 8 2 72.8 GB 145.6 GB 291.2 GB 584 GB 9.1 GB 18.2 GB 36.4 GB 73 GB 3 (split bus) 1 12 2 109.1 GB 218.4 GB 436.8 GB 876 GB 4 (full bus) 0/1 9 4 (2+2) 163.8 GB 327.6 GB 655.2 GB 1314 GB 6 (full bus) 0/1 9 6 (3+3) 245.7 GB 491.4 GB 982.
Topologies for Windows NT and Windows 2000 The topology of a network or a Fibre Channel Arbitrated Loop (Fibre Channel-AL) is the physical layout of the interconnected devices; that is, a map of the connections between the physical devices. The topology of a Fibre Channel-AL is extremely flexible because of the variety and number of devices, or nodes, that can be connected to the Fibre ChannelAL. A node can be a host system or server, a Fibre Channel hub or switch, or the controller modules in a disk array.
Unsupported Windows Topology Topology and Array Planning Because this topology provides four paths from the host to each disk array, it is not supported. Any topology that provides more than two paths from a host to the disk array is not supported.
Non-High Availability Topologies Figure 36 through Figure 38 illustrate non-high availability topologies. These topologies do not achieve the highest level of data availability because they have a hardware component that represents a single point of failure. That is, if the critical component fails, access to the data on the disk array will be interrupted. These topologies are simpler and less expensive to implement than true high availability topologies.
Topology and Array Planning Figure 36 Four Host/Single Hub/ Single Disk Array Non-HA Topology Topologies for Windows NT and Windows 2000 101
Figure 37 Four Host/Cascaded Hubs/ Dual Disk Array Non-HA Topology 102 Topologies for Windows NT and Windows 2000
Topology and Array Planning Figure 38 Four Host/Single Switch/ Dual Disk Array Non-HA Topology Topologies for Windows NT and Windows 2000 103
High Availability Topologies Figure 39 through Figure 42 illustrate high availability topologies. These topologies achieve the highest level of availability because they have fully redundant hardware data paths to each disk array. There are no single points of failure in these topologies. These topologies are more complex and expensive to implement than non-high availability topologies.
Topology and Array Planning Figure 39 Direct Connect Single Host/Single Disk Array HA Topology Topologies for Windows NT and Windows 2000 105
Figure 40 Dual Host/Dual Hub/Four Disk Array HA Topology 106 Topologies for Windows NT and Windows 2000
Topology and Array Planning Figure 41 Four Host/Dual Hub/Dual Disk Array HA Topology Topologies for Windows NT and Windows 2000 107
Figure 42 Four Host/Dual Cascaded-Hubs/Four Disk Array HA Topology 108 Topologies for Windows NT and Windows 2000
Topology and Array Planning Topologies for Windows NT and Windows 2000 109
Topologies for Windows NT and Windows 2000
3 INSTALLATION Host System Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Site Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Power Distribution Units (PDU/PDRU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Installing the Disk Array FC60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overview This chapter explains how to install the Disk Array FC60 enclosures into a cabinet and how to configure and connect the controller enclosure to the disk enclosures. It also covers the Fibre Cable connection to the host. Finally this chapter provides power up instructions and initial software installation requirements for operation of the disk array. Before installing the Disk Array FC60, the topology and array configuration should be established.
Host System Requirements Windows NT and Windows 2000 For information on Windows NT and Windows 2000 host system requirements, see the HP Storage Manager 60 User’s Guide included with the HP Storage Manager 60 software (A5628A).
Site Requirements Environmental Requirements The area around the array must be cooled sufficiently so it does not overheat. Chapter 8, Reference and Regulatory, contains environmental specifications for the Disk Array FC60. Refer to that section for the required environmental specifications. Electrical Requirements The site must be able to provide sufficient power to meet the needs of the devices in the cabinet(s).
Table 8 Total Operating and In-Rush Currents Operating Current @ 110v Operating Current @ 220v In-Rush* Current Power Cords 41.3A 20.4A 124A 14 Controller w/ 5 Disk Enclosures 34.8A 17.2A 104A 12 Controller w/ 4 Disk Enclosures 28.3A 14.0A 84A 10 Controller w/ 3 Disk Enclosures 21.8A 10.8A 64A 8 Controller w/ 2 Disk Enclosures 15.3A 7.6 44A 6 Controller w/ 1 Disk Enclosure 8.8 4.
Table 10 Disk Enclosure Electrical Requirements Measurement Value Voltage – Range – Frequency 220-240V 50-60Hz Current – Typical Maximum Operating – 100 - 120 V – 200 - 240 V – Maximum In-rush * 100 - 127V 2.9 - 3.2A 2.6 - 3.2A 5.3 - 6.7A 20A In-rush current occurs for 10 to 12 milliseconds HP recommends the use of magnetic-type circuit breakers, which are capable of handling large in-rush currents for short durations (10 to 12 milliseconds) and are rated adequately for the steady state currents.
Power Distribution Units (PDU/PDRU) PDUs provide a sufficient number of receptacles for a large number of devices installed in a cabinet. A PDU connects to the site power source and distributes power to its ten receptacles. The disk array power cords are connected to the PDUs and each PDU is connected to a separate UPS. For high availability, two PDUs should be installed and connected to separate site power sources. Installation PDUs come in a variety of heights, from five feet down to 19 inches.
The following tables show recommended PDU/PDRU combinations for one or more components in a rack. Data assumes 220V AC nominal power and redundant PDU/PDRUs. For nonredundant configurations, divide the number of recommended PDU/PDRUs by 2. Table 12 Recommended PDU/PDRUs for HP Legacy Racks Number of Components 1.1-meter (21 U) Rack 1–4 Two 3-foot/16-amp PDUs* Two 5-foot/16-amp PDUs* or or 1.6-meter (32 U) Rack 2.
Installing PDUs Choose PDU/PDRU locations with the following guidelines in mind: Place PDU/PDRUs within the reach of power cords. • Place PDUs vertically whenever possible. See sample installations in Figure 43 and Figure 44. Installing PDUs horizontally can interfere with accessibility to units behind the PDU. (PDRUs must be installed vertically, as per the installation instructions.
PDU 16 Amp or PDRU 30 Amp Figure 43 PDU Placement in 1.
Installation PDU (16 Amp) or PDRU (30 Amp) PDU (16 Amp)or PDRU (30 Amp) Figure 44 PDRU Placement in 2.
Installing the Disk Array FC60 Installation of the Disk Array FC60 consists of installing the controller enclosure and up to six disk enclosures. Before performing this installation you should have determined the configuration for the array (as described in chapter 2, Array Planning and Topology). You should also review this section prior to performing the installation. The Disk Array FC60 is supported in the System/E racks and in the HP legacy (original) cabinets.
Table 15 EIA Spacing for Racks and Array Enclosures Component Legacy Cabinets Measure (EIA Units) (1 EIA Unit = 1.75”) 1.1 Meter Cabinet 21 EIA Units, Total Available 1.6 Meter Cabinet 32 EIA Units, Total Available 2.0 Meter Cabinet 41 EIA Units, Total Available Controller Enclosure FC60 Disk Enclosure SC10 5 EIA Units Used (includes 1/2 rail space below and remaining 1/2 EIA unit above enclosure) 4 EIA Units Used (3.5 disk enclosure plus 1/2 rail space) System/E Racks (1 EIA Unit = 1.
installation to utilize 1/2 EIA units available from the disk system SC10’s 3.5 EIA unit height. Figure 46 shows rack locations for installation of six disk enclosures and one controller enclosure (positioned on top) for legacy racks. When disk enclosures are installed in legacy racks, an unusable 1/2-EIA space is left at the bottom of the enclosures. This space must be filled with a 1/2-EIA unit filler for each enclosure installed.
Installation Figure 45 Enclosure EIA Positions for System/E Racks Installing the Disk Array FC60 125
Figure 46 Enclosure EIA Positions for Legacy Cabinets 126 Installing the Disk Array FC60
Installing the Disk Enclosures Disk enclosures should be installed in the rack starting at the bottom and proceeding upward. When all disk enclosures are installed, the controller enclosure is installed at the top, directly above the disk enclosure. Installation instructions for the disk enclosure SC10 are provided below; installation instructions for the controller enclosure FC60 follow this section.
Figure 47 Disk Enclosure Contents 128 Installing the Disk Enclosures
Step 3: Install Mounting Rails Select the rail kit for the appropriate rack and follow the instructions included with the rail kit to install the rails in the rack. The following rail kits are available for use with the disk enclosure: • HP A5250A for legacy HP Racks (C2785A, C2786A, C2787A A1896A, or A1897A) • HP A5251A for HP Rack System/E • HP 5656A for Rittal 9000 racks Step 4: Install the Disk Enclosure CAUTION Installation 1.
A Front Mounting Ears B Chassis C Rail D Rail clamp Figure 48 Mounting the Disk Enclosure (Rack System/E shown) 130 Installing the Disk Enclosures
CAUTION 3. To protect the door, do not lift or move the disk enclosure with the door open. Unlock and open the disk enclosure door, using a thin flat-blade screwdriver to turn the lock (Figure 49). Installation Figure 49 Door Lock 4. Ensure that one hole in each mounting ear (A in Figure 48) aligns with the sheet metal nuts previously installed on the rack front columns. 5. Insert two screws (A in Figure 48) through the matching holes in the disk enclosure mounting ears and rack front columns.
7. If using an HP rack, fasten the back of the disk enclosure to the rails using the rear hold-down clamps from the rail kit. a. If you are installing the disk enclosure in an HP legacy rack, set the clamp (A in Figure 50) on top of the rail (B) so that the tabs point up and the screw holes are on the slotted side of the rail. Skip to step c. b. If you are installing the disk enclosure in an HP Rack System/E, set the clamp (D in Figure 48) c. Push the clamp tight against the back of the disk enclosure.
Step 5: Install Disks and Fillers CAUTION Touching exposed areas on the disk can cause electrical discharge and disable the disk. Be sure you are grounded and be careful not to touch exposed circuits. Disks are fragile and ESD sensitive. Dropping one end of the disk two inches is enough to cause permanent damage. Static electricity can destroy the magnetic properties of recording surfaces. Grip disks only by their handles (B in Figure 51) and carriers, and follow strict ESD procedures.
1. Open the disk enclosure door. 2. Put on the ESD strap (provided with the accessories) and insert the end into the ESD plug-in (D in Figure 51) near the upper left corner of the disk enclosure. CAUTION 3. Disks are fragile. Handle them carefully. Remove the bagged disk from the disk pack. CAUTION Do not touch exposed circuit board side of the disk module. 4. Remove the disk from the ESD bag, grasping the disk by its handle (B). 5.
6. Open the cam latch (C Figure 51) by pulling the tab toward you. 7. Align the disk insertion guide (F) with a slot guide (G) and insert the disk into the slot. Typically, install disk modules on the left side of the enclosure and fillers on the right Note Installing disks left to right allows you to insert the disk completely without releasing your grip on the handle. 8. Push the disk all the way into the chassis, letting the internal guides control the angle. 9.
Installing the Controller This procedure describes how to install the Disk Array FC60 controller enclosure into an HP legacy rack or an HP System/E Rack. Step 1: Gather Required Tools • Torx T25 screwdriver • Torx T15 screwdriver • Small flat-blade screwdriver Step 2: Unpack the Product 1. 136 Lift off the overcarton and verify the contents (see Table 17 and Figure 53).
Table 17 Controller Package Contents Figure Label Part Description (See) Controller chassis with pre-installed modules B Filler panel, 1/2 EIA unit, 2ea. C Rail kit (A5251A) for System/E racks D Rail kit (A5656A) for Rittal racks E SCSI Cables (length depends on option ordered) 2 meter (5064-2492) or 5 meter (5064-2470) 2 ea. / 1 disk enclosure 4 ea. / 4 disk enclosures 4 ea. / 2 disk enclosures 5 ea. / 5 disk enclosures 6 ea. / 3 disk enclosures 6 ea.
Figure 53 Controller Enclosure Package Contents 138 Installing the Controller
Step 3: Install Mounting Rails Select the rail kit for the appropriate rack and follow the instructions included with the rail kit to install the rails in the rack. The following rail kits are available for use with the controller enclosure: • HP A5250A for legacy HP Racks ((C2785A, C2786A, C2787A A1896A, or A1897A) • HP A5251A for HP Rack System/E • HP 5656A for Rittal 9000 racks Step 4: Install the Controller Enclosure Note Installation 1.
Figure 54 Mounting the Controller Enclosure 140 Installing the Controller
5. If installing in an HP rack, secure the back of the enclosure to the rails using the two rail clamps from the rail kit. In legacy HP racks: a. Align screw holes and insert the clamp tab into the slot in the upper surface of the rail. b. Insert a screw through the hole in the clamp and the rail and tighten with a Torx T25 screwdriver. In HP Rack System/E racks: a. Set the clamp (E in Figure 54) inside the rail with the holes in the clamp along the slots in the rail. Installation b.
Configuration Switches This section describes the configuration switches on the controller enclosure and the disk enclosures. Configuration switch settings must be set to support the configuration (full-bus ore split-bus) being installed (as planned for from chapter 2, Topology and Array Planning).
Note Note that one BCC is inverted with respect to the other. Thus, the open and closed settings on one BCC are inverted and in reverse order from the other.
Table 18 Disk Enclosure Switches Switch Setting Operation 1 Full-Bus Mode 0 Split-Bus Mode 2 - Stand-Alone/Array Mode 0 Always set to Off (Array Mode) 3 - Bus Reset on Power Fail 0 Must be set to 0 4 - High/Low Bus Addressing 0 Set to 0 (Low addressing) 5 - Not Used 0 Not used; must be set to 0 1 - Full-/Split Bus Mode Full-Bus/Split-Bus (Switch 1) Configuration The disk enclosure’s internal bus connects the disk drives together and to the BCCs.
a low range of IDs (0, 1, 2, 3, and 4) and a high range of IDs (8, 9, 10, 11, and 12). (BCCs are also provided addresses as shown in Table 19). Note that the SCSI IDs do not correspond to the physical slot number. The assignment of the SCSI IDs differs depending on whether the enclosure is operating in full-bus or split-bus mode. When full-bus mode is selected, the low ID range (0 - 4) is assigned to the even disk slots, and the high range (8 - 12) is assigned to the odd slots. See Table 19.
controller module A (Fibre Channel connector J3) and Host ID BD2 SW2 selects the address for controller module B (Fibre Channel connector J4). Each Fibre Channel Host ID DIP switch contains a bank of seven switches that select the address using a binary value, 000 0000 (0) through 111 1111 (126). To set an address, set the switches in the up position for “1” or down for “0” (refer to Table 20 for binary switch settings). Figure 56 illustrates the loop ID switch set to 42 (0101010).
Fibre Channel Host ID Switch ( 0 1 0 1 0 1 0 = 42) Installation Figure 56 Fibre Channel Connectors and Fibre Channel Host (Loop) ID Switches Note Occasionally two or more ports in an arbitrated loop will arbitrate simultaneously. Priorities are decided according to the loop IDs. The higher the loop ID, the higher the priority.
. Table 20 Fibre Channel Addresses Decimal 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 148 Binary 000 0000 000 0001 000 0010 000 0011 000 0100 000 0101 000 0110 000 0111 000 1000 000 1001 000 1010 000 1011 000 1100 000 1101 000 1110 000 1111 001 0000 001 0001 001 0010 001 0011 001 0100 001 0101 001 0110 001 0111 001 1000 001 1001 001 1010 001 1011 001 1100 001 1101 001 1110 001 1111 010 0000 010 0001 010 0010 010 0011 010 0100 010 0101 Decimal
Attaching Power Cords Each enclosure (controller and disk enclosures) contains dual power supplies that must be connected to the power source (PDU). When connecting power cords for high availability installations, connect one enclosure power cord to one source (PDU) and the other power cord to an alternate source (PDU). To complete the power connection, follow the steps below. Set the power switch on the disk enclosures to OFF. The switch is located at the front, top, right corner of the enclosure. 2.
letters among all disk enclosures. “Cascading” refers to overload faults that occur on a backup PDU as a result of power surges after the primary PDU fails. – Serviceability. Choose PDU locations that prevent power cords from interfering with the removal and replacement of serviceable components. Also leave a 6-inch service loop to allow for the rotation of PDRUs. The letters A, B, C, D, E and F in Figure 57 and Figure 58 represent independent PDUs or PDU banks.
30A PDRU D A D A C A C B C B C B D B D C C C C AC IN D D D D Installation A A A A AC IN B B B B A 30A PDRU Figure 57 Wiring Scheme for 1.
30A PDRU A A A A AC IN B B B B 30A PDRU C C C C AC IN D D D D 30A PDRU A E A F A G B E B F B H C F C G C H D G D H Figure 58 Wiring Scheme for 2.
Attaching SCSI Cables and Configuring the Disk Enclosure Switches NOTE! It is critical that all SCSI cables be tightened securely. Use the following steps to ensure the cable connectors are seated properly. 1. Connect the cable to the enclosure connector and tighten the mounting screws finger tight. 2. Push on the connector and retighten the mounting screws. Repeat once more. 3. Use a flat blade screwdriver to tighten the screw 1/4 turn. Do not overtighten or you may strip the mounting screw.
Full-Bus Cabling and Switch Configuration Cabling for a full bus configuration requires connecting one SCSI cable from the controller to the disk enclosure and setting the configuration switches. Figure 60 illustrates full-bus cabling connections for a six disk enclosure array. It is possible to configure any number of disk enclosures, from one to six, using this method. However, full bus is typically used when four or more disk enclosures are installed in the array.
Segment 1 set to “1” All other segments set to “0” Tray ID set to unique value for each enclosure Installation Tray ID set to same value on both BCCs Segment 1 set to “1” Note inverted orientation from upper BCC Figure 59 Full Bus BCC Configuration Switch Settings Attaching SCSI Cables and Configuring the Disk Enclosure Switches 155
Figure 60 Full-Bus Cabling 156 Attaching SCSI Cables and Configuring the Disk Enclosure Switches
Split-Bus Switch and Cabling Configurations Split-bus cabling requires two SCSI cables from each disk enclosure to the controller enclosure. Split-bus cabling is typically used for installations with 3 or fewer disk enclosures. Cabling for a split-bus configuration is shown in Figure 62.
All segments set to “0” Tray ID set to unique value for each enclosure Tray ID set to same value on both BCCs All segments set to “0” Note inverted orientation from upper BCC Figure 61 Split- Bus Configuration Switch Settings 158 Attaching SCSI Cables and Configuring the Disk Enclosure Switches
Installation Figure 62 Split-Bus Cabling Attaching SCSI Cables and Configuring the Disk Enclosure Switches 159
Bus Addressing Examples Each disk module within the disk array is identified by its channel number and SCSI ID. These values will differ depending on which type of configuration is used for the disk array. See "How are disk modules in the array identified?" on page 190 for more information. Figure 63 is an example of split-bus addressing. Figure 64 is an example of full-bus addressing.
Installation Figure 64 Full-Bus Addressing Example Attaching SCSI Cables and Configuring the Disk Enclosure Switches 161
Connecting the Fibre Channel Cables Fibre Channel cables provide the I/O path to the disk array. The Fibre Channel cable connects the controller enclosure directly to a host, or to a hub. For information on Fibre Channel host adapters supported on Windows NT and Windows 2000, check the Host Adapter folder on the HP Storage Manager 60 CD. To connect the Fibre Channel cables to the array, complete the following steps: Note 1. Connect a fibre optic cable to a host or hub.
Installation Figure 65 MIA, RFI Gasket, and Fibre Channel Installation 3. Connect the Fibre Channel connectors to the controller MIAs. a. Remove the optical protectors from the ends of the MIAs and the Fibre Channel cables (Figure 65). b. Insert the Fibre Channel connectors into the MIAs. The fibre optic cable connector is keyed to install only one way.
Applying Power to the Disk Array Once the hardware installation is complete, the disk array can be powered up. It is important that the proper sequence be followed when powering up the components of the disk array. To ensure proper operation, power should be applied to the disk enclosures first and then to the controller enclosure, or all components can be powered up simultaneously. This gives the disks time to spin up, ensuring that the disks are detected when the controller comes on line.
Installation Figure 66 Disk Enclosure Power Switch and System LEDs 3. Check the LEDs on the front of the disk enclosures (see Figure 68). The System Power LED (B in Figure 66) should be on and the Enclosure Fault LED (C) should be off. It is normal for the Enclosure Fault LED (amber) to go on momentarily when the enclosure is first powered on. However, if the Enclosure Fault LED remains on, it indicates that a fault has been detected. Refer to "Troubleshooting" on page 207 for additional information. 4.
Power Switches Figure 67 Controller Enclosure Power Switches 5. Check the controller enclosure LEDs (see Figure 69). The Power LED should be on and the remaining LEDs should be off. If any fault LED is on, an error has been detected. Refer to "Troubleshooting" on page 207, for additional information. 6. Close and lock the disk enclosure doors. 7. If the host was shutdown to install the array, boot the host. 8. Perform an ioscan to verify that the host sees the array.
Table 21 Normal LED Status for the Disk Enclosure Module LED Front Enclosure System Fault Power Supply BCC Module Off System Power On (green) Disk Activity Flashing (green) when disk is being accessed. Disk Fault LED Off Power Supply On (green) Term. Power On (green) Full Bus Off (if split bus) On (green - if single bus) BCC Fault Off Bus Active On (green bus is available for use) Off (Isolator chip disabled & bus not avail.
A B C D E F G H I J K Figure 68 Disk Enclosure LEDs 168 Applying Power to the Disk Array System fault LED System power LED Disk activity LED Disk fault LED Power On LED Term. Pwr.
Table 22 Normal LED Status for Controller Enclosure LED Normal State Controller Enclosure Power On On (green) Power Fault Off Fan Fault Off Controller Fault Off Fast Write Cache On (green) while data is in cache Controller Power On (green) Controller Fault Off Heartbeat Blink (green) Status Green There are 8 status LEDs. The number and pattern of these LEDs depend on how your system is configured.
A B C D E F G H I J K L M N O P Q Figure 69 Controller Enclosure LEDs 170 Applying Power to the Disk Array Power On LED Power Fault LED Fan Fault LED Controller Fault LED Fast Write Cache LED Controller Power LED Controller Fault LED Heartbeat LED Status LEDs Fault B LED Full Charge B LED Fault A LED Full Charge A LED Power 1 LED Power 2 LED Fan Power LED Fan Fault LED
Powering Down the Array When powering down the disk array, the controller enclosure should be powered down before the disk enclosures. To power down the disk array: 1. Stop all I/Os from the host to the disk array. 2. Wait for the Fast Write Cache LED to go off, indicating that all data in cache has been written to the disks. 3. Power down the controller enclosure. 4. Power down the disk enclosures.
Verifying Disk Array Connection The HP Storage Manager 60 software is used to verify that the disk array is visible to the Windows host. See the HP Storage Manager 60 User’s Guide for instructions on installing and using the HP Storage Manager 60 software.
Configuring the Disk Array Windows NT and Windows 2000 Perform the following steps to configure the disk for operation on a Windows NT or Windows 2000 host. Refer to the HP Storage Manager 60 User’s Guide for detailed instructions on performing each of these tasks. Add the disk array to the SM60 management topology. 2. Set up any alert notifications. 3. Rename the disk array. 4. Create the desired volume structure. Replace the default 10 Mbyte volume if necessary. 5. Add hot spares as required. 6.
Adding Disk Enclosures to Increase Capacity Scalability is an important part of the design of the HP SureStore E Disk Array FC60. The capacity of the disk array can be increased in a variety of ways to meet growing storage needs. See "Adding Capacity to the Disk Array" on page 200 for more information on scalability options. Adding disk array enclosure(s) is the most effective way of significantly increasing the capacity of the disk array. It is also the most involved.
• Consider Adding More Than One Disk Enclosure - Because the process of adding disk enclosures involves backing up data and powering off the disk array, you should consider adding more than one enclosure to meet your future capacity needs. This will avoid having to redo the procedure each time you add another disk enclosure. And the addition of a single enclosure provides limited flexibility for configuring volume groups on the disk array.
2. Identify the expanded disk array layout by performing the following tasks: a. Create a detailed diagram of the expanded HP FC60 array layout. Include all Fibre Channel and SCSI cabling connections. This diagram will serve as your configuration guide as you add the new enclosures. The Capacity Expansion Map on page 185 should assist you in identifying where disk will be moved in the new configuration. b.
CAUTION 3. Do not proceed to the next step if any volume group is not in an optimal state and you intend to move any of the disks which comprise the volume group. Contact HP Support if the volume groups cannot be made OPTIMAL before the moving disk drives. If you intend to move any global hot spares, remove them from the hot spare group as follows: a. Verify that the hot spare disk to be moved is not in use. b. Remove the disk from the hot spare group. 4.
5. Configure the necessary disk enclosures for full-bus operation. See "Configuration Switches" on page 142. Set the disk enclosure DIP switches on both BCC A and BCC B to the following settings for full-bus operation: sw1=1 (This switch is set to 0 for split-bus mode.) sw2=0 sw3=0 sw4=0 sw5=0 6. Install SCSI terminators on each disk enclosure. Install a SCSI Terminator on the right-most connector on both the BBC A and BCC B cards. CAUTION 7.
8. Set the disk Enclosure (Tray) ID switches. See "Disk Enclosure (Tray) ID Switch" on page 142. a. Set the Enclosure ID switches on both BCC A and BCC B cards to identify the disk enclosure. The Enclosure ID switch setting must be the same for both BCC A and BCC B. b. The Enclosure ID switch settings are made as follows for the disk enclosures installed. The enclosure connected to channel 1 should be set to 0. The enclosure connected to channel 2 should be set to 1.
Step 5. Completing the Expansion CAUTION The disk array components must be powered up in the specified sequence disk enclosures first, followed by the controller enclosure. Failure to follow the proper sequence may result in the host not recognizing volume groups on the disk array. 1. Ensure all power cables are connected to the controller enclosure and disk enclosures. 2. Power up the disk array in the following sequence: a. Power up all the disk enclosures.
taken not to cross the cables, as this may cause problems with applications that depend on a specific path. This completes the process of expanding the disk array. You can now make the capacity provided by the new disks available to the host by creating volume groups.
Capacity Expansion Example An example of expanding an Disk Array FC60 is shown in Figure 70. In this example, three new disk enclosures are added to a disk array with three fully loaded enclosures. The disk array is configured with five 6-disk volume groups. The original enclosures were operating in split-bus mode, and have been reconfigured to full-bus mode. The disks have been moved from their original locations to slots with the corresponding channel:ID.
Installation Disks are moved to the slot that corresponds to their original channel:ID. High availability is maintained by having no more than one disk per LUN or volume group on each channel.
Adding Disk Enclosures to Increase Capacity
0 0 8 0 1 1 9 1 2 2 10 2 3 3 11 3 4 4 12 4 Full-bus IDs Split-bus IDs 0 0 8 0 1 1 9 1 2 2 10 2 3 3 11 3 4 4 12 4 Full-bus IDs Split-bus IDs 0 0 8 0 1 1 9 1 2 2 10 2 3 3 11 3 4 4 12 4 Installation Full-bus IDs Split-bus IDs Figure 71 Capacity Expansion Map Adding Disk Enclosures to Increase Capacity 185
Full-bus IDs Split-bus IDs 0 0 8 0 1 1 9 1 2 2 10 2 3 3 11 3 4 4 12 4 Full-bus IDs Split-bus IDs 0 0 8 0 1 1 9 1 2 2 10 2 3 3 11 3 4 4 12 4 Full-bus IDs Split-bus IDs 0 0 8 0 1 1 9 1 2 2 10 2 3 3 11 3 4 4 12 4 Adding Disk Enclosures to Increase Capacity
4 MANAGING THE DISK ARRAY Tools for Managing the Disk Array FC60 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188 Managing Disk Array Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189 Adding Capacity to the Disk Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tools for Managing the Disk Array FC60 On Windows NT and Windows 2000, the disk array is managed using the HP Storage Manager 60 software. See the HP Storage Manager 60 User’s Guide for information on managing the disk array on Windows NT and Windows 2000. The information in this chapter provides supplemental topics that will help you manage the disk array efficiently.
Managing Disk Array Capacity During installation, a volume structure is created on the disk array. This structure may meet your initial storage requirements, but at some point additional capacity may be required. This involves adding disks and creating new volumes. Careful volume planning will ensure that you achieve the desired levels of data protection and performance from your disk array. Configuring Volumes The primary task in managing disk array capacity is creating the volume structure you need.
When selecting disks for a volume group, consider the following: • To maximize high availability, select disks in different disk enclosures or on different channels. Multiple disks in the same enclosure make a RAID 3 or RAID 5 volume group vulnerable to an enclosure failure. A RAID 1 or 0/1 volume group can survive an enclosure failure, as long as both disks of a mirrored pair are not in the same enclosure.
using full-bus configuration, the even-numbered slots are assigned SCSI IDs 0 - 4, and the odd-numbered slots are assigned IDs 8 - 12. (The gap in addresses is necessary for internal management of enclosure components.) If the disk enclosure is configured for split-bus operation, the both the even-numbered slots and the odd-numbered slots are assigned IDs of 0 - 4. • When viewing status information for the disk array, you may also see the disk enclosure number and slot number displayed.
Disk Module Addressing Parameters Disk enclosure ID set to 3 Enclosure connected to channel 2 Slot Numbers 0 SCSI IDs Full bus configuration Split bus configuration 1 0 0 8 0 2 3 4 5 1 1 9 1 2 2 10 2 6 3 3 7 11 3 8 4 4 This disk module uses the following address parameters: Channel 2 SCSI ID 10 (full bus) or 2 (split bus) Enclosure 3 Slot 5 Figure 72 Disk Module Addressing Parameters 192 Managing Disk Array Capacity 9 12 4
Assigning Volume Group Ownership When a volume group is bound, you must identify which disk array controller (A or B) owns the volume group. The controller that is assigned ownership serves as the primary I/O path to the volume group. The other controller serves as the secondary or alternate path to the volume group.
• Storage Efficiency - the storage efficiency can range from 50% for RAID 1 and 0/1 up to > 80% for RAID 5. The higher the efficiency, the less cost per megabyte for storing your data. Global Hot Spares Global hot spares provide additional protection against disk failures. The number of global hot spares you use will reflect how much protection you need. Each global hot spare you add will provide protection against the failure of a single disk.
When setting stripe segment size, consider the following: • Stripe segment size can affect disk array performance. The smaller the stripe segment size, the more efficient the distribution of data read or written across the stripes in the volume. However, if the stripe segment is too small for a single I/O operation, the operation requires access to two disk. Called a stripe crossing, this action reduces performance.
Evaluating Performance Impact Several disk array configuration settings have a direct impact on I/O performance of the array. When selecting a setting, you should understand how it may affect performance. Table 23 identifies the settings that impact disk array performance and what the impact is. Table 23 Performance Impact of Configuration Settings Setting: RAID level Function: Sets the RAID level used by the volume group.
Table 23 Performance Impact of Configuration Settings (cont’d) Setting: Cache flush threshold (default 80%) Function: Sets the level at which the disk array controller begins flushing write cache content to disk media. The setting is specified as the percentage of total available cache that can contain write data before flushing begins. The cache flush threshold can be set independently for each controller. Note that available cache is reduced by half with cache mirroring enabled.
Table 23 Performance Impact of Configuration Settings (cont’d) Setting: Cache flush limit (default 100%) Function: Determines how much data will remain in write cache when flushing stops. It is expressed as a percentage of the cache flush threshold. For optimum performance this value is set to 100% by default. This ensures that the entire amount of cache specified by the cache flush threshold will contain write cache data, increasing the number of write cache hits.
Table 23 Performance Impact of Configuration Settings (cont’d) Setting: Cache read ahead (prefetch) Function: Sets the number of additional sequential blocks transferred into read cache each time a read I/O is performed. Read ahead can be set for each volume. Performance Impact: Read ahead can significantly improve read performance for sequential I/O transactions.
Adding Capacity to the Disk Array As your system storage requirements grow, you may need to increase the capacity of your disk array. Disk array capacity can be increased in any of the following ways: • You can add new disk modules to the disk array if there are empty slots in the disk enclosures. • You can add additional disk enclosures to the disk array. • You can replace existing disk modules with higher capacity modules.
Moving Disks from One Disk Array to Another CAUTION Before moving disks from one array to another, ensure that there is no important data on the disks. All data on the disks will be lost when they are installed in the new disk array. If you have more than one HP SureStore E Disk Array FC60, you can move disks from one array to another to balance capacity. The disks can be installed in the new array with power on and they will be treated as new disks.
To increase capacity by replacing disk modules: 1. Identify the volume group impacted by the replacement of the disk modules. Make sure you replace all the disks in the volume group with the higher-capacity disks. 2. Backup all data on the volume group. 3. From the host, stop all I/O activity to the volume group and unmount the file system. 4. Delete the volume group. 5. Replace the disk modules. See "Disk Enclosure Modules" on page 291 for instructions on replacing disk modules. 6.
Moving a Volume Group from One Disk Array to Another It is possible to move an entire volume group from one HP SureStore E Disk Array FC60 to another by moving all the disk in the volume group. However, this is not the recommended procedure for moving LUN data from one array to another. If possible, the data should be moved to a LUN in the new disk array. If this is not possible, the following procedure can be used to move the LUN disks.
preserved. If the number is already in use on the array, a new number will be assigned. The next lowest available number will be used. Controller Firmware Components The disk array controller firmware includes three components: • Bootware - executed when the unit is powered on, this code tests controller functions and begins execution of the firmware. Bootware is stored in • • Firmware - manages the operation of the controller.
case, the controller with the higher firmware version number will be used as the firmware source and its code will be copied to the other controller. Note Can I use ACS to create the controller firmware configuration I need? It is not recommended that you rely on ACS to alter the firmware on a controller. You should use the firmware download procedures described in Chapter 4 for changing the controller firmware. NVSRAM Behavior The NVSRAM settings control various operating parameters of the disk array.
Note When is the NVSRAM information on the disks overwritten by the NVSRAM settings on the controller? The NVSRAM settings on the controller are copied to the disks in the following situations. Each of these operation initiates a Start-Of-Day process, during which the controller NVSRAM settings are copied to the disks. - Following a syswipe operation. All information is cleared from the disks and the controller NVSRAM settings are written to the disks.
Troubleshooting 5 TROUBLESHOOTING Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 Disk Array Installation/Troubleshooting Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . 211 Power-Up Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 Controller Enclosure Troubleshooting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction The modular design of the Disk Array FC60 simplifies the isolation and replacement of failed hardware components. Most disk array components are hot-swappable Field Replaceable Units (FRUs), which can be replaced while the disk array is operating. Some of the FRUs are customer replaceable. Other array components can be replaced in the field, but only by a trained service representative. A complete list of product and part numbers are included in "Replaceable Parts" on page 366.
Troubleshooting About Field Replaceable Units (FRUs) The Disk Array FC60 consists of a Controller Enclosure and one or more SureStore E Disk System SC10 enclosures. Table 24 identifies the disk array FRUs and whether they are customer replaceable. See "Removal and Replacement" on page 287 for more information.
Windows NT and Windows 2000 Troubleshooting Tools The HP Storage Manager 60 software includes a set of tools for troubleshooting the disk array. See the HP Storage Manager 60-NT User’s Guide for information on using the HP Storage Manager 60 software.
Troubleshooting Disk Array Installation/Troubleshooting Checklist The following checklist is intended to help isolate and solve problems that may occur when installing the disk array.
• Check Fibre Optic and SCSI Cables and SCSI Terminators: – No damaged fibre optic cables – No damaged or loose screws on connectors – All cables tightly secured to the connectors on the Fibre Channel Interconnect PCA – Shortest possible fibre optic cable lengths between disk arrays and host adaptors • Check Disk Array (Pre-Power-Up): – All modules properly seated in the disk array enclosures – Disk modules in their proper slots • Check Disk Array Functionality and Configuration (Following power up) –
Troubleshooting Power-Up Troubleshooting When the disk array is powered up, each component perform an internal self-test, to ensure it is operating properly. Visual indications of power-up are: • The green Power LED on the controller enclosure is on • The green Power LED on each disk enclosures is on • All fans are operating • No Fault LEDs are on. See Figure 74 on page 216 and Figure 89 on page 282.
Note If no LEDs are ON and the fans are not running, it indicates that no AC power is being supplied to the disk array power supply modules. Check the input AC power to the disk array. See "Applying Power to the Disk Array" on page 164 for information on powering up the disk array.
Troubleshooting Controller Enclosure Troubleshooting Introduction This chapter discusses how to identify interface problems, how to identify a controller failure, and how to service the controller modules and the memory modules within the controller enclosure as shown in Figure 73.
Controller Enclosure LEDs Figure 74 shows the locations of the status LEDs for the controller enclosure. Table 25 summarizes the operating LED states for all components within the controller enclosure.
Troubleshooting Table 25 Normal LED Status for Controller Enclosure Module LED Normal State Controller Enclosure Power On On (green) Power Fault Off Fan Fault Off Controller Fault Off Fast Write Cache On (green) while data is in cache Controller Power On (green) Controller Fault Off Heartbeat Blink (green) Status Green There are 8 status LEDs. The number and pattern of these LEDs depend on how your system is configured.
Controller Status LEDs A bank of eight status LEDs plus a Fault LED and a Power LED on the controller module display status information. Each controller module displays only its own status and fault information; it does not display information about the other controller module, if it is installed. Figure 75 shows the location of the controller status LEDs. .
Troubleshooting Errors During Normal Operations It is possible for the controller to encounter errors from which it is unable to recover during normal operations. Specific status LED patterns are used to give a visual indication of any problem. The error pattern returns to the normal setting after the problem has been fixed. These error patterns are listed in Table 30 on page 229.
Hardware Initialization Hardware initialization codes are displayed on the LED bank as the hardware is initialized during a power up or reset sequence. If the controller encounters errors during hardware initialization, error patterns are displayed on the LEDs. These error patterns are listed in Table 30 on page 229. These status codes are displayed only momentarily and are typically not visible if the controller is operating normally.
Kernel Troubleshooting Note These status codes are displayed only momentarily and are typically not visible if the controller is operating normally. They are only visible if the firmware “hangs” while executing these functions. Initialization After the hardware is initialized, and the Boot Menu has been given a chance to be invoked, the controller will initialize the kernel as the final part of the Boot Firmware initialization. Table 30 lists the status codes that are displayed.
0x3F 0x7F 0xFF 0x7F 0x3F 0x1F 0x0F 0x07 0x03 0x01 0x03, etc... LED patterns are also displayed when the controller programs Flash EEPROM with downloaded code. See Table 28. Different patterns are displayed when the download occurs. These LED patterns are also displayed during automatic code synchronization. Note that a ! indicates the LED is On or Flashing.
0x8B Verifying write of file flash segments 0x8C Troubleshooting Verifying erase of file flash segments Controller Start-Of-Day Process During a reset the controller performs a complete internal selftest sequence known as “Start Of Day”. The following is an overview of the processes that occur during a Start-OfDay. 1. Hardware diagnostics: This process performs diagnostics on specific hardware components, and is only performed during a power-on reset.
sense data indicating that a power-on or reset has occurred. The Sense Key, ASC, and ASCQ will be 0x06, 0x29, and 0x00 respectively. 8. Mode Select Commands disabled: The controller will now disable Mode Select Commands until the Start-Of-Day process is complete. This is required so that subsystem configuration changes are prohibited until the controller has finished booting.
Troubleshooting and the appropriate structures are created in memory. If these logical units had dirty data in cache, the controller will flush the data to the drive media. If the controller believes that it’s Battery Backup Unit has failed, it will attempt to recover any mirrored data from the alternate controller. Hosts are now allowed access to these previouslyexisting logical units. Non-Inquiry commands will no longer fail with a Not Ready error. 16.
24. Spin down Failed Drives: Drives that are marked Failed, are now spun down, and their Fault LEDs are lighted. 25. Restart LUN binding: The controller will discover and restart LUNs that were in the process of being bound when the reset or power fail occurred. 26. LUN 0 created: If no LUNs are discovered, a default LUN is created. 27.
Troubleshooting Errors During / After Firmware Download Different patterns are displayed after downloading firmware. The patterns are shown in Table 29. Note Note that a ! indicates the LED is On or Flashing. . Table 29 Firmware Download LEDs Error LED Pattern Download file is lacking header record. 0x61 Download file header fails checksum test. 0x64 Download file header contains unexpected download type. 0x65 The user should attempt to download a known good file.
Table 29 Firmware Download LEDs (cont’d) Kernel missing, or kernel CRC mismatch. The user must download a matching combination of controller Bootware and controller Application Firmware. 0xE7 Application Firmware missing, or Application CRC mismatch. The user must download a version of controller Application Firmware that matches the currently loaded controller Bootware. 0xE8 Controller Fault LED The Controller Fault LED indicates a number of conditions.
Troubleshooting Controller Status LED Codes Summary Table 30 lists a summary of the various controller Status LED codes. Note Note that a ! indicates the LED is On or Flashing. Table 30 Controller Status LEDs codes Code Description Comments Cause / Solution 0x20 Kernel Start Kernel Init.
Table 30 Controller Status LEDs codes (cont’d) Code Description Comments Cause / Solution 0x36 0x00 Processor DRAM diagnostics running HW Diag.
Troubleshooting Table 30 Controller Status LEDs codes (cont’d) Code Description Comments Cause / Solution 0x6B 0x01 Drive SCSI Channel 1 (53C810) diagnostics running HW Diag.
Table 30 Controller Status LEDs codes (cont’d) Code Description Comments Cause / Solution 0x6C 0x01 Drive SCSI Channel 1 Turnaround diagnostics running HW Diag.
Troubleshooting Table 30 Controller Status LEDs codes (cont’d) Code Description Comments Cause / Solution 0x91 Intermodule error call to flash function passed bad flash type Firmware file is bad / Download Firmware with a good file. Attempt to download Firmware again. If the problem persists, replace the controller module. 0x92 Invalid address in flash device 0x93 Length too long for flash device Firmware file is bad / Download Firmware with a good file. Attempt to download Firmware again.
Table 30 Controller Status LEDs codes (cont’d) Code Description Comments Cause / Solution 0xAC Load Boot Menu Boot Funct.
Troubleshooting Table 30 Controller Status LEDs codes (cont’d) Code Description 0xE6 Software load failure 0xE7 Kernel missing, or kernel CRC mismatch 0xE8 Application Firmware missing, or Application CRC mismatch 0xEA Swapped controller 0xF1 Processor set-up 0xF2 CDC chip set-up 0xF3 RAID Parity Assist chip set-up 0xF4 Memory Test 0xF5 Load Boot Firmware 0xF7 Clear Boot memory 0xF8 Enable Protected mode 0xF9 Memory test failure 0xFA Exception error 0xFB Start mode determinatio
Identifying Interface Problems Types of Interface Problems Interface problems include any malfunctions that delay, interrupt, or prevent successful input/output (I/O) activity between the hosts and other devices. This includes transmissions between the controller enclosure and disk enclosures attached to it.
Troubleshooting Hints for Troubleshooting Interface Problems The first step in troubleshooting interface problems is determining whether the problem is caused by hardware or software. The following information should aid in making this determination: • If the problem occurred during or immediately following a software activity, try to undo whatever the software did, then step through each software function (in smaller increments) until the problem occurs again.
• Replacing the disk array controller module (including memory). • Replacing the controller enclosure midplane (controller card cage). Controller Servicing Notes Here are a few suggestions to consider when servicing disk array controller modules: • Always use proper precautions against electrostatic discharge when removing and handling disk array components. • Always read pertinent documentation.
Troubleshooting • A controller fault may be due to a failed memory module. Memory Module Servicing Notes CAUTION Memory modules must be serviced by a trained service technician ONLY. Before replacing a failed SIMM or DIMM, remember the following tips: • Always use proper precautions against electrostatic discharge before removing and handling controller modules, SIMMs, and DIMMs. • Always use the same type and size of memory module to replace a failed module.
Controller Enclosure Troubleshooting Introduction This section describes procedures to troubleshoot the controller enclosure. See Figure 76. For troubleshooting procedures, refer to Table 32 or the "Master Troubleshooting Table" on page 275.
Troubleshooting Table 31 Controller Enclosure Troubleshooting Flowchart (Sheet 1 of 5) Start A Yes Look at the Array Controller's FRONT PANEL LEDs Power LED on? Array Enclosure Power Problem Power is being applied to the Array Enclosure. Fast Write Cache LED on or flashing? Check for: 1. Power Cords 2. Power Switch 3. PDU 4. A/C Breaker 5. Controller Fan module is unplugged 6. BOTH Power Supplies are bad 7. BOTH Power Supplies overheated (Thermal Shutdown) 8. Midplane is bad 9.
Table 31 Controller Enclosure Troubleshooting Flowchart (Sheet 2 of 5) Is the FRONT PANEL Controller Fault LED on? B Yes Contact the Response Center THIS Controller is unseated or has failed: 1. Reseat Controller 2. Replace Controller 3. Replace Midplane 4. Replace Memory 5. Replace Wiring Harness No Controller Fault Fixed? No Is Controller A or B fault LED on? No Yes Yes Go to THIS Controller has failed POST diagnostics: 1. Reseat Controller 2. Replace Controller 3. Replace Midplane 4.
Troubleshooting Table 31 Controller Enclosure Troubleshooting Flowchart (Sheet 3 of 5) C Is the FRONT COVER Fan Fault LED on? Yes No Fan Subsystem FAULT. Is Power Supply Fan Fault LED on? Go To D Yes Bad Power Supply Fan module. Replace the power supply fan module. No Reseat the Power Supply fan Module Front Cover Fan Fault? No Front Cover Fan Fault? No Front Cover Fan Fault? No Yes Controller Fan module has failed. Replace the Controller Fan module.
Table 31 Controller Enclosure Troubleshooting Flowchart (Sheet 4 of 5) D Is the FRONT COVER Power Supply Fault LED on? Yes No Inspect both power supply module power LEDs. Yes Power Supply A power LED on? Yes No Possible Causes: 1. Power Switch on this supply is OFF. 2. No input power to supply. 3. Power Supply Module has failed.
Troubleshooting Table 31 Controller Enclosure Troubleshooting Flowchart (Sheet 5 of 5) Go to A E Yes Is the Fault-A or Fault-B BBU LED on? Yes Yes No BBU Full Charge-A AND Full Charge-B LEDs are on? Has the new BBU fully charged in 7 hours? The BBU has failed. Replace the BBU No Has the BBU been charging for 7 hours? No Wait 7 hours for BBU to fully charge No Yes BBU status is good. Go to 1. Faulty Battery charging circuit or harness a. Replace both Power Supplies b.
Table 32 Controller Troubleshooting Symptom Possible Cause Procedure Controller LED (front cover) is ON and the fan LED is off. A Controller missing or unplugged Check the Power LEDs on both controller modules. If one Power LED is off, make sure that the module is plugged in correctly and its handles are locked in place. B Controller failed If the Fault LED remains ON after replacing the Controller, go to cause C. C One or more memory modules failed Replace the memory modules.
Troubleshooting Controller Midplane Troubleshooting Introduction This section describes procedures to troubleshoot the controller enclosure midplane. See Figure 77. For troubleshooting procedures, refer to Table 33, or the "Master Troubleshooting Table" on page 275.
Controller Enclosure Midplane Servicing Notes CAUTION The controller enclosure’s chassis must be serviced by a trained service technician ONLY. To replace the controller enclosure midplane, replace the entire chassis, not just the board. Servicing the chassis is a major task that requires removing and disassembly.
Troubleshooting Troubleshooting Controller Enclosure Midplane Problems Table 33 Troubleshooting Controller Enclosure Midplane Problems Symptom Possible Cause Power LEDs (front and power supply FRUs) are ON but all other Power LEDs are off A Other FRUs are missing – Check all FRUs in the controller or not installed correctly. enclosure and make sure they are installed securely. If this does not fix the problem, go to cause B.
Table 33 Troubleshooting Controller Enclosure Midplane Problems (cont’d) Symptom Possible Cause Procedure Software errors occur when attempting to access controller or disks A Software function or configuration problems – Check the appropriate software and documentation to make sure the system is set up correctly or that the proper command was executed. B Controller enclosure power switches or main circuit breakers in rackmount cabinet turned off – Make sure that all power switches are turned on.
Troubleshooting Cooling System Introduction This section describes procedures to troubleshoot the controller enclosure cooling system. See Figure 78. For troubleshooting procedures.
Servicing the Cooling System Cooling problems include any malfunctions or obstructions that impede air flow and cause one or more components in the controller enclosure to overheat. To avoid cooling problems, always keep the air vents free of obstructions. Also, make sure that the ambient air temperature is within the environmental limits. Preserving Proper Air Flow The controller enclosure must have proper air circulation throughout the chassis.
Troubleshooting Determining Which Fan Failed If the Fan Fault LED on the front cover is on, one of the fans in the controller enclosure has failed. To determine whether the controller fan module or power supply fan module has failed, check the LEDs on the power supply fan module. – If the power supply fan module Fault LED is off, go to "Controller Fan Module" on page 255. – If the power supply fan module Fault LED is on, go to "Controller Enclosure Power Supply Fan Module" on page 258.
Controller Fan Fault LED Controller Enclosure Power Supply Fan Module Power Supply Fan Fault LED Figure 80 Controller Enclosure and Power Supply Fan Fault LEDs 254 Controller Enclosure Troubleshooting
Troubleshooting Controller Fan Module Introduction This section describes procedures to troubleshoot the controller fan module. See Figure 81. For troubleshooting procedures. refer to Table 34, or the "Master Troubleshooting Table" on page 275.
Servicing Notes • When replacing the controller fan module, make sure you have the replacement module available before removing the defective module. Once you remove the controller fan module, you have approximately 15 minutes to install the new fan module. Operating the disk array without a controller fan module for more than 15 minutes may cause a thermal shutdown. • Both fans in the controller enclosure fan module failing simultaneously is unlikely.
Troubleshooting Troubleshooting Table 34 Troubleshooting Controller Fan Module Problems Symptom Possible Cause Procedure Controller Fan Module Fan Fault LED is on One or both of the fans in the controller fan module has failed. Replace the controller fan module. The power supply fan module is unplugged or has failed. 1. Make sure the power supply fan module is plugged in correctly. Reseat the module if necessary. 2. Check the LEDs on the power supply fan module.
Controller Enclosure Power Supply Fan Module Introduction This section describes procedures to troubleshoot the controller enclosure power supply fan module. See Figure 82. For troubleshooting procedures. refer to the "Master Troubleshooting Table" on page 275. Figure 82 Controller Enclosure Power Supply Fan Module Servicing Notes • 258 When replacing the power supply fan module, make sure you have the replacement module available before removing the defective module.
Troubleshooting • Both fans in the fan module failing simultaneously is unlikely. Such a failure could cause one or both controller enclosure power supply modules to overheat and shutdown. If this occurs, the amber power supply Fault LED on the front cover turns ON, and the Power LED on the overheated power supply turns off. When the air temperature within the enclosure falls to below 70º C (158° F), the power supply modules should automatically turn back on.
Power System Introduction This section describes procedures to troubleshoot the controller enclosure power system. See Figure 83. For troubleshooting procedures. refer to the "Master Troubleshooting Table" on page 275.
Troubleshooting Note The BBU has a two-year life expectancy. The BBU is a sealed unit and must be replaced as an entire assembly. The batteries inside the BBU are not separately replaceable. Types of Power System Problems Some electrical problems are difficult to trace, especially if they involve complex site wiring in a large facility.
Introduction This section describes procedures to troubleshoot the controller enclosure Battery Backup Units (BBU). See Figure 84. For troubleshooting procedures. refer to Table 35 or the "Master Troubleshooting Table" on page 275. Figure 84 Battery Backup Unit (BBU) Servicing Notes The BBU should be replaced every two years, or whenever it fails to hold a charge. The service label on the BBU provides a blank line for recording the date on which the battery was serviced.
Use proper facilities to recycle the used BBUs. The BBU contains lead acid batteries that may be considered a hazardous material. You must handle this unit in accordance with all applicable local and federal regulations. CAUTION The BBU is a sealed unit. There are no user-serviceable parts inside. When servicing the BBU, replace the entire BBU, not individual batteries or parts. Opening the BBU will void your warranty.
Table 35 Troubleshooting BBU Problems (cont’d) Symptom Possible Cause Procedure New BBU will not hold a charge A Battery charger board failure – Replace the BBU. – Allow the system to operate for at least 7 hours in order to properly charge the batteries. If this does not solve the problem, go to cause B. B Faulty battery harness – Replace both power supplies. – Replace the battery harness. A Battery failure. – Replace the BBU.
Troubleshooting Checking the Battery Service Date Note Under normal circumstances, replace the BBU every two years. Operating the disk array in a environment with elevated temperature (above 35º C or 95º F), lowers the life expectancy of the BBU. Under these conditions you may need to replace the battery every six months. To check the service date on the BBU: 1. Remove the front cover from the controller enclosure. 2. Locate the Battery Support Information label on the front of the BBU. See Figure 85.
Check replacement date here Figure 85 Battery FRU Service Label CAUTION 266 If the used BBU is physically damaged and is leaking electrolyte gel, DO NOT ship it to a recycling center. Handle damaged batteries according to your local regulations, which may include procedures for handling batteries as a hazardous waste.
Troubleshooting Power Supply Module Introduction This section describes procedures to troubleshoot the controller enclosure power supply modules. See Figure 86. For troubleshooting procedures, refer to Table 36, or the "Master Troubleshooting Table" on page 275.
Power Supply Thermal Shutdown The power supply module has a built-in temperature sensor designed to prevent the power supply from overheating. If a temperature sensor detects an over-temperature condition (>= 70º C (158º F)) the power supply module automatically shuts down. The remaining power supply module continues operating as long as its sensor does not detect an overtemperature condition.
Troubleshooting Troubleshooting Table 36 Troubleshooting Power Supply Module Problems Symptom Possible Cause Procedure No power to the controller module (all Power LEDs off) Power switches are turned off. Turn on both power switches on the controller enclosure. Turn on the main circuit breakers in the rack, if applicable. Power cords unplugged. Make sure all power cords are plugged in securely. Power supply modules overheated or failed.
CAUTION 270 If the air temperature inside the rack is hot enough to cause the power supplies to shutdown (>= 70º C (158º F), there is a serious problem in the rack. Remove all panels from the rack immediately to help cool the controller enclosure. Take whatever action is necessary to alleviate the over-temperature problem (such as shutting down the power or using external fans to cool the area).
Troubleshooting Battery Harness Introduction This section describes procedures to troubleshoot the controller enclosure battery harness. See Figure 87. For troubleshooting procedures, refer to the "Master Troubleshooting Table" on page 275 Battery Harness Figure 87 Battery Harness Servicing Notes An intermittent or complete loss of battery power to the controller modules or batteries not charging properly may indicate a defective battery harness or controller enclosure midplane.
DC Power Harnesses Introduction This section describes procedures to troubleshoot the controller enclosure DC Power Harness. See Figure 88. For troubleshooting procedures, refer to the "Master Troubleshooting Table" on page 275. DC Power Supply Harnesses Figure 88 DC Power Harnesses Servicing Notes An intermittent or complete loss of power to the controller modules, Battery Backup Unit, or controller enclosure fan module may indicate either a defective power harness or power interface board.
Troubleshooting When replacing a defective DC power harnesses, you must: 1. Stop all host I/O activity to the disk array. 2. Make sure that all data is out of write cache memory. The Fast Cache Write LED will be off when all data has been written from write cache to the disk. 3. Turn OFF all power to the disk array. 4. Remove the controller enclosure from the cabinet. 5. Disassemble the chassis to access the harnesses.
Power Interface Board Introduction This section describes procedures to troubleshoot the controller enclosure power interface board. For troubleshooting procedures, refer to the "Master Troubleshooting Table" on page 275 Servicing Notes CAUTION The controller enclosure’s power supply assembly must be serviced by a trained service technician ONLY. The power supply assembly has a modular design. It is a single, removable unit, that consists of the Power Interface Board and attached sheet metal frame.
Troubleshooting Master Troubleshooting Table Table 37 contains troubleshooting information for the controller enclosure and modules. Table 37 Master Troubleshooting Controller Enclosure Master Troubleshooting Table Symptom Possible Cause Procedure A Controller missing or unplugged Check the power LEDs on both controller modules. If a Power LED is off, make sure that the module is plugged in correctly and its handles are locked in place.
Table 37 Master Troubleshooting Controller Enclosure Master Troubleshooting Table (cont’d) Symptom Possible Cause Procedure Controller enclosure and Fan Fault LED (front cover) are on Controller enclosure fan failure caused one or both controller(s) to overheat 1. Stop all activity to the controller module and turn off the power. 2. Replace the failed controller enclosure fan module. 3. Allow the controller to cool down, then turn on the power. 4. Check both controllers for fault LEDs.
Troubleshooting Table 37 Master Troubleshooting Controller Enclosure Master Troubleshooting Table (cont’d) Symptom Possible Cause Procedure Software errors occur when attempting to access controller or disks A Software function or configuration problems Check the appropriate software and documentation to make sure the system is set up correctly or that the proper command was executed.
Table 37 Master Troubleshooting Controller Enclosure Master Troubleshooting Table (cont’d) Symptom Possible Cause Procedure One or both of the fans in the controller fan module has failed. Replace the controller fan module. The power supply fan module is unplugged or has failed. 1. Make sure the power supply fan module is plugged in correctly. Reseat the module if necessary. Controller Fan Module Fan Fault LED is on 2. Check the LEDs on the power supply fan module.
Troubleshooting Table 37 Master Troubleshooting Controller Enclosure Master Troubleshooting Table (cont’d) Symptom Possible Cause Procedure “Battery Low” error issued by software Power turned OFF for extended period and drained battery power. Turn ON the power and allow controller module to run 7 hours to recharge the batteries. If after 7 hours, the battery low error persists, replace the BBU. Batteries are weak and FRU is due for replacement. Check the last service date for the BBU.
Table 37 Master Troubleshooting Controller Enclosure Master Troubleshooting Table (cont’d) Symptom Possible Cause Procedure Power Supply LED (front cover) is on A Power supply module is missing or not plugged in properly. Insert and lock the power supply module into place. If the Fault LED is still on, go to cause B. B Power supply module is overheated or failed.
Troubleshooting SureStore E Disk System SC10 Troubleshooting The following steps should be performed in the indicated sequence when isolating problems with the Disk System SC10 enclosure: 1. Gather information from the following sources: – Hardware Event notifications – LED status indicators – Online status information and error logs (SAM/STM) 2. Isolate the cause of the problem. 3. Correct the problem. If it is necessary to replace a component, see "Removal and Replacement" on page 287. 4.
A B C D E F G H I J K System fault LED System power LED Disk activity LED Disk fault LED Power On LED Term. Pwr. LED Full Bus LED BCC Fault LED Bus Active LED LVD LED Fan Fault LED Figure 89 Disk Enclosure LEDs Table 38 Disk Enclosure LED Functions LED System Power System Fault 282 State Indication Green Power is on. Normal operation.
Troubleshooting Table 38 Disk Enclosure LED Functions (cont’d) LED State Indication BCC Fault Amber Self-test1 / Fault OFF Normal operation Flashing Peer BCC DIP switch settings do not match LVD Term. Pwr. Full Bus Bus Active Fan Power Supply Disk Fault Disk Activity3 1 2 3 Green Bus operating in LVD mode OFF Bus operating in single-ended mode Green Termination power is available from the host. Normal operation. OFF There is no termination power.
Note It is normal for the amber Fault LED on a component to go on briefly when the component initially starts up. However, if the Fault LED remains on for more than a few seconds, a fault has been detected. Isolating Causes Table 39 lists the probable causes and solutions for problems you may detect on the disk enclosure. When more than one problem applies to your situation, investigate the first description that applies.
Troubleshooting Table 39 Disk Enclosure Troubleshooting Table (cont’d) Problem Description LED State Probable Cause/Solution Power Supply LED is amber Amber – An incompatible or defective component caused a temporary fault. – Power supply hardware is faulty. Unplug the power cord and wait for the LED to turn off. Reinsert the power cord. If fault persists, replace the power supply.
SureStore E Disk System SC10 Troubleshooting
6 REMOVAL AND REPLACEMENT Removal and Replacement Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 288 Required Tools and Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 290 Disk Enclosure Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291 Internal Disk Enclosure Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overview This chapter describes removal and replacement procedures for the field replaceable units (FRUs) for both the disk enclosure and the controller enclosure. Replacement procedures for the disk enclosure FRUs are presented first, followed by the controller enclosure. Each section is divided into two subsections: modules which can be replaced without hardware disassembly, followed by internal assemblies which require some disassembly of the enclosure.
Table 40 Field Replaceable Units (FRUs) Hot swappable Disk & Filler Modules Yes Yes Disk Fan Modules Yes Yes Power Supply Modules Yes Yes BCC (Bus Controller Card) Modules No No Removal and Replacement Customer Replaceable Field Replaceable Units Disk Enclosure Disk Enclosure (from rack) No No Front Cover Door No No Top Cover (Enclosure) No No Power Button Assembly No No Backplane/Mezzanine Assembly No No Disk Carrier Assembly No Yes Front Cover Yes Yes Controller Fan Mo
Required Tools and Equipment • Small flat-blade screwdriver • Torx T-10 screwdriver • Torx T-15 screwdriver • Torx T-25 screwdriver • Phillips #1 screwdriver • Phillips #2 screwdriver • ESD wrist strap • ESD mat 290 Required Tools and Equipment
Disk Enclosure Modules Removal and Replacement This section describes the procedures for replacing the hot swappable modules in the disk enclosure. Disk Module or Filler Module " Hot Swappable Component! This procedure describes how to add or replace disk modules and disk slot filler modules. When adding or replacing disk filler modules use the same procedure, ignoring any steps or information that applies to disk modules only.
When a disk module is replaced, the new disk inherits the group properties of the original disk. For example, if you replace a disk that was part of volume group 1, the replacement will also become part of volume group 1. If the disk is a replacement for a global hot spare or an unassigned disk, the replacement will become a global hot spare or an unassigned disk. Note A special feature called drive lockout prevents unsupported disk drives from being used in the disk array.
Removal and Replacement A ESD plug-in B cam latch C handle Figure 90 Disk Module Removal Installing a Disk Module or Filler Module CAUTION Touching the disk circuit board can cause high energy discharge and damage the disk. Disks modules are fragile and should be handled carefully.
Note If the disk module you are installing has been removed from another Disk Array FC60, you should ensure that the module has a status of Unassigned. This is done by deleting the volume group the disk module was a part of in the original disk array. See "Moving Disks from One Disk Array to Another" on page 201. 1. Remove the replacement disk from its ESD bag, being careful to grasp the disk by its handle (A in Figure 92). 2. Pull the cam latch (B) away from the disk module. 3.
5. Close the cam latch to seat the module firmly into the backplane. An audible click indicates the latch is closed properly. 6. Check the LEDs (D in Figure 92) above the disk module for the following behavior: – Both LEDs should turn on briefly. Removal and Replacement – The amber Fault LED should turn off. – The green disk Activity LED should blink for a few seconds and then go out. If the host begins to access the disk, the Activity LED will flash.
Disk Enclosure Fan Module " Hot Swappable Component! A failed fan module should be replaced as soon as possible. There are two fan modules in the enclosure. If a fan fails, the remaining fan module will maintain proper cooling. However, if the remaining fan module fails before the defective fan is replaced, the disk enclosure must be shut down to prevent heat damage. CAUTION Do not remove a disk fan module until you a replacement.
Removal and Replacement A - Locking screw B - Pull tab B Figure 93 Disk Enclosure Fan Module Removal and Replacement Installing the Fan Module 1. Slide the replacement fan module into the empty slot (C in Figure 93). 2. Tighten the locking screws (A). 3. Check the fan module LED for the following behavior: – The Fan Fault LED should flash amber, and then turn green after a few seconds. If the LED does not turn green, refer to "Troubleshooting" on page 207.
Disk Enclosure Power Supply Module " Hot Swappable Component! A failed power supply module should be replaced as soon as possible. When one power supply fails, the remaining power supply will maintain the proper operating voltage for the disk enclosure. However, if the remaining power supply fails before the first power supply is replaced, all power will be lost to the disk enclosure. CAUTION Do not remove a power supply module until you have a replacement.
Removal and Replacement ABCD- cam handle locking screw power supplies power supply slot Figure 94 Disk Enclosure Power Supply Module Removal and Replacement Installing the Power Supply Module 1. With the handle down, slide the replacement power supply into the empty slot (D in Figure 94). The supply begins to engage the backplane with 3/8 inch (8 mm) still exposed. 2. Swing the handle upward to seat the power supply into the backplane. The power supply should be flush with the chassis. 3.
BCC Module Removal/Replacement The BCC is not a hot-swappable component. The disk enclosure must be powered off when removing or replacing the BCC. Powering down the disk enclosure will impact the operation of any LUNs using disks in the enclosure. The loss of the disks may initiate a rebuild for any LUN included on the disks. Note When the BCC replacement is completed and the disk enclosure is powered up, the array may perform a rebuild or copy-back to the disks.
Removal and Replacement A - Locking screw B - Cam Lever C - BCC Slot Figure 95 BCC Removal and Replacement 8. Remove the replacement BCC from its ESD bag. 9. Set the Enclosure (Tray) ID and the DIP configuration switches to the same settings as on the original BCC. See Figure 96. 10. Install the replacement BCC into the slot: a. Open the cam levers by pulling them out and away from the center of the module. b. Insert the BCC into the empty slot.
11. Connect the SCSI cable to the BCC connector. 12. Connect the other end of the SCSI cable to the controller enclosure SCSI connector. 13. Disconnect all disk modules from the disk enclosure backplane connectors by releasing the locking levers and pulling each module out approximately one inch. This step is required to ensure the disk modules return to normal operation. 14. Power up the disk enclosure. 15. Observe the BCC Fault LED. See Figure 96. It should come on briefly and then turn off.
Removal and Replacement C A - Tray ID switch B - DIP switch C - Fault LED Figure 96 BCC Encloser (Tray) ID and DIP Configuration Switches Once the disk enclosure is powered up, check the status of the disk modules using one of the software management tools. Initially the disk modules status will be either “write failed” or “no_response.” Eventually, all the disk modules should return to “replaced” status.
Internal Disk Enclosure Assemblies This section describes removal and replacement procedures for the disk enclosure’s internal assemblies. Prior to replacing any of these assemblies, the disk enclosure will need to be loosened or removed from the rack. This procedure is described first followed by the individual assembly removal procedures. Note The removal and replacement of the assemblies described in this section must be performed by a trained service representative.
Removing the Disk Enclosure To remove the disk enclosure, complete the following steps: Stop all host I/Os to the array. 2. Power down the controller enclosure. Set both switches at the rear of the controller enclosure to off. 3. Use a flat-blade screwdriver to unlock and open all disk enclosure doors (Figure 97). Removal and Replacement 1. Figure 97 Door Lock 4. Power off all disk enclosures by pressing the power button (out position) on each enclosure. 5.
Figure 98 Disk Enclosure Removal/Replacement 8. Close and lock the door. WARNING 9. The disk enclosure weighs approximately 80 lbs. (36kgs.) without disks. If you choose to remove the disk enclosure from the rack, use two people or a lift device. Push the disk enclosure forward then, using two people, lift it out of the rack. If you are removing the front door, you only need to slide the enclosure out of the rack about four inches.
Installing the Disk Enclosure SC10 This procedure provides installation steps to reinstall a disk enclosure into a rack. This procedure is a shortened version of the installation procedure provided in Chapter 3, Installation. To replace the disk enclosure into the rack, complete the steps below. Using two people, lift the enclosure into the rack. Slide the enclosure as far forward as it will go. 2. Unlock and open the front cover door. 3.
Front Cover Door Removal/Replacement The front door is required for regulatory compliance. Replace the door immediately if it is damaged. The door must be replaced by a trained service representative. The disk enclosure will need to be powered down to complete this procedure. Turning the power off and disconnecting power and SCSI cables eliminates the possibility of inadvertently pulling out live cables and causing an unplanned shutdown when you move the disk enclosure forward in the rack.
front mount screws door lock hinge block door flange mounting ears hinge arm Removal and Replacement A B C D E F Figure 99 Disk Enclosure Front Door Removal and Replacement 4. To replace the door, insert the bottom flange (D in Figure 99) of the disk enclosure chassis between the gasket and bottom edge of the new door. 5. Close and lock the door, letting the latch hold the door. 6.
Top Cover Removal/Replacement The disk enclosure top cover is not a replaceable part, however it must be removed when replacing the power button assembly, the backplane, or the mezzanine board. The disk enclosure must be powered down to perform this procedure. The top cover must be replaced by a trained service representative only. CAUTION All disk modules must be removed from the enclosure before removing the top cover. 1. Power off the disk enclosure and slide it out of the rack about 10 inches.
A - cover plate B - power switch C - cover tabs Removal and Replacement Figure 100 Disk Enclosure Top Cover Assembly Removal and Replacement 6. Slide the cover to the middle of the chassis. The push rod automatically engages the internal switch (B in Figure 100). 7. Insert and tighten the Torx T-10 screws along the back and side edges of the cover. 8. Reconnect the disk enclosure. 9. Reinstall disks and fillers.
Power Button Assembly Removal/Replacement The power button assembly is located in the top cover and consists of the on/off button and push rod. These components operate the electrical switch located on the mezzanine board. If the button or rod is broken, replace the power button assembly. If the internal switch is broken, replace the mezzanine board (described following this procedure). The disk enclosure must be powered off to complete this procedure.
on/off button cover plate (bottom view) push rod standoffs Removal and Replacement ABCD- Figure 101 Power Button Assembly Removal and Replacement Internal Disk Enclosure Assemblies 313
Backplane/Mezzanine Removal/Replacement Replace the backplane when troubleshooting determines it is the source of the problem. Disks, BCCs, fans, and power supplies connect to the backplane. The backplane also contains the mezzanine board, which can be replaced independently if it is damaged or the power switch requires replacement. (The mezzanine board contains the power switch.) The backplane and mezzanine boards must be replaced by a trained service representative only.
A - mezzanine board B - backplane C - pin connector Removal and Replacement Figure 102 Disk Enclosure Mezzanine Assembly Removal and Replacement 4. If you are removing the backplane: a. Remove screw from the cam handle, open the handle, and pull power supplies free of the backplane (see p. 298). b. Loosen locking screws, open extractors, and pull BCCs free of the backplane. See "BCC Module Removal/Replacement" on page 300. Note There is no need to loosen the fans. c.
5. To replace the backplane: a. Stand the new backplane inside the chassis and push it over the alignment pins (B in Figure 103). Connectors automatically align with floating fan connectors inside the chassis. b. Insert and tighten ten screws into the backplane and chassis. 6. To replace the mezzanine: a. Attach the new mezzanine to the backplane connector (C in Figure 102). b. Insert and tighten five Torx T-10 screws through the mezzanine and into the backplane. 7. Replace the top cover.
Removal and Replacement A - Torx T-15 screws B - alignment pin C - backplane-mezzanine Figure 103 Disk Enclosure Backplane Assembly Removal and Replacement Internal Disk Enclosure Assemblies 317
Disk Module Carrier Removal/Replacement If the disk module carrier has been damaged, it can be replaced without replacing the disk drive inside. If the damage to the carrier is a result of dropping it, the disk drive inside may be damaged as well. Disk carriers must be replaced by a trained service representative only. CAUTION Touching the disk circuit board can cause high energy discharge and permanently damage the disk.
Removal and Replacement A B C D E F carrier insertion guide cam latch disk drive standoffs bezel Figure 104 Disk Carrier Assembly Removal and Replacement 3. Remove the four screws holding the insertion guides (B) and carrier (A) to the disk. Note Working near the edge of the table improves the angle of the screwdriver. 4. Lift the carrier off the disk drive. 5. With the latch (C in Figure 104) facing up and opposite the connector end of the disk drive, place the new carrier on the disk drive.
6. Align the holes in the carrier with the holes in the disk drive. When properly installed there is about ½ inch between the inside edge of the latch and the disk drive. 7. Set the insertion guides (B) on the sides of the carrier, aligning holes in the guide with holes in the carrier and disk drive. Nubs on the carrier fit dimples on the guides and help to hold the guides in position on the carrier. 8. Insert and tighten two screws and washers through the guide, carrier, and drive on each side.
Controller Enclosure Modules Removal and Replacement This section provides removal and replacement procedures for the controller enclosure modules, plus the controller enclosure front cover. Most controller modules are hot swappable, however certain restrictions need to be observed for some modules, as identified in these descriptions. The controller modules, the controller fan module, and the BBU are accessed from the front of the controller enclosure.
Front Cover Removal/Replacement " Hot Swappable Component! To gain access to the front of the controller module, the controller fan module, or the battery backup unit (BBU), the front cover must be removed. Removing the Front Cover 1. Pull the bottom of the cover out about one inch to release the pins. See Figure 105. 2. Slide the cover down one inch and pull it away from the controller enclosure.
Installing the Front Cover 1. Slide the top edge of the cover up under the lip of the chassis. 2. Push the cover up as far as it will go, then push the bottom in until the pins snap into the mounting holes. Removal and Replacement Controller Fan Module " Hot Swappable Component! CAUTION Do not operate the controller enclosure without adequate ventilation and cooling to the controller modules. Operating without proper cooling to the controller modules may damage them.
To Remove: Loosen captive screw, pull firmly on handle, and remove CRU. To Install: Push controller fan CRU firmly into slot and tighten captive screw. Figure 106 Controller Fan Module Removal and Replacement Installing the Controller Fan Module. 1. Slide the new module into the slot and tighten the screw. The captive screw is springloaded and will not tighten unless it is inserted all the way into the chassis.
Battery Backup Unit (BBU) Removal/Replacement " Hot Swappable Component! Note Removal and Replacement If the Fast Write Cache LED is on when the BBU is removed from the enclosure (or if the BBU fails), write caching will be disabled and the write cache data will be written to disk. However, if a power outage occurs prior to completing the cache write to disk, data may be lost. Therefore, make sure the Fast Write Cache LED is off before replacing the BBU. Removing the BBU 1.
Figure 107 BBU Removal and Replacement 326 Controller Enclosure Modules
Installing the BBU Unpack the new BBU. Save the shipping material for transporting the used BBU to the disposal facility. 2. Fill in the following information on the “Battery Support Information” label on the front of the battery. See Figure 108. Removal and Replacement 1. a. Record the current date on the blank line next to “Date of Installation.” b. Record the expiration date (two years from the current date) on the line next to “Replacement Date.” 3.
6. Dispose of the old BBU. Note Dispose of the used BBU according to local and federal regulations, which may include hazardous material handling procedures. Power Supply Fan Module Removal/Replacement " Hot Swappable Component! CAUTION Do not operate the enclosure without adequate ventilation and cooling to the power supplies. Operating the power supplies without proper cooling may damage their circuitry.
Removal and Replacement Figure 109 Power Supply Fan Module Removal and Replacement Installing the Power Supply Fan Module 1. Slide the power supply fan module into the enclosure. The latch will snap down when the module is seated properly. If the latch remains up, lift up on the ring/latch and push in on the module until it snaps into place. 2. Check the module LEDs for the following behavior: – The green Fan Power LED should be on and the amber Fan Fault LEDs should be off.
Power Supply Module Removal/Replacement " Hot Swappable Component! A power supply should be replaced as quickly as possible to avoid the possibility of the remaining supply failing and shutting down the disk array. Removing the Power Supply Module 1. Turn off the power switch and unplug the power cord from the failed power supply module. See Figure 110. 2. Lift up on the pull ring to release the latch. See Figure 111. 3. Slide the supply out of the enclosure.
Removal and Replacement Figure 111 Power Supply Module Removal and Replacement Installing the Power Supply Module 1. Slide the supply into the slot until it is fully seated and the latch snaps into place. 2. Plug in the power cord and turn on the power. See Figure 110. 3. Check the power supply module LED for the following behavior: – The Power LED should go on. Once the power supply in installed and operating, there may be a delay of up to several minutes before the Power Fault LED goes off.
Controller Module " Hot Swappable Component! This procedure describes the removal and replacement of the controller modules. This procedure should also be used in the following situations: • When installing the A5278A Controller Module to upgrade a single controller disk array to a dual controller configuration. Replacement of the controller modules must be performed by a trained service representative. Note Replacement controller modules do not contain a cache memory DIMM card.
Removing a Controller Module CAUTION Electrostatic charges can damage sensitive components. Use a grounding wrist strap before removing or handling the controller modules and place the controller module on an antistatic mat when working on it. Removal and Replacement Removing a controller module that is operating normally (not failed) could result in data loss. Only remove a controller module if its Fault LED is on.
Ensure handles are not extended more than 90 degrees when installing the module. Figure 112 Controller Module Removal and Replacement Installing the DIMM Card on the New Controller Note If you are upgrading a single controller disk array by installing an add-on A5278A Controller Module, you do not need to perform the following procedure. Skip to "Installing the Controller Module" on page 336 1.
4. Place the failed controller module next to the replacement module, on the antistatic mat. 5. Transfer the DIMM memory from the failed controller module to the replacement controller module. Removal and Replacement a. Remove the six screws from each controller module cover (see Figure 113), and lift the cover off the module, b. Remove the DIMM by pushing out on the levers on either side of the connector. c. Install the controller DIMM into the same connector in the replacement controller module. d.
DIMM Figure 113 Controller Module DIMM Replacement Installing the Controller Module Note 336 When a new controller module is installed, the resident controller checks the firmware version of the new controller. If the versions do not match, the resident controller downloads its firmware to the new controller module. This procedure, called Auto Code Synchronization (ACS), ensures that both controllers are operating with the same version of firmware.
CAUTION 1. Align the latch handles on the controller module so they form a 90 degree angle with the module. Attempting to install the module with the handles extended beyond this point may cause damage to the handles. 2. Slide the controller module into the slot until the back edge of the handles latch into the frame. See Figure 112 3. Swing the handles inward until the front edge of the handles snap into the tabs. 4. Observe the LEDs to determine the status of the controller modules.
the controller module LEDs do indicate a normal operating state, refer to chapter 6, for troubleshooting information. Figure 114 Identifying the ACS Process SCSI Cables Replacing SCSI cables requires that the disk enclosure be shut down. Shutting down the enclosure will degrade the performance of the array during the replacement.
Remove the SCSI cable from the BCC 5. Connect the SCSI cable to the BCC connector. 6. Connect the other end of the SCSI cable to the controller enclosure SCSI connector. 7. Disconnect all disk modules from the backplane connectors by releasing the locking levers and pulling module out, about one inch. This step is required to ensure the disk modules return to full operation when the enclosure is powered back up. 8. Power up the disk enclosure. 9.
MIA " Hot Swappable Component! This section describes how to replace the MIA. Replacing the MIA requires that the Fibre Channel cable be removed. If the Disk Array FC60 contains two controllers, the system may not need to be shut down provided LVM will route data the through the other fibre channel loop to the other array controller. However, if the disk array contains a single controller module, host I/Os to the disk array must be stopped before performing this procedure.
Removal and Replacement Figure 115 MIA Removal and Replacement Controller Enclosure Modules 341
Internal Controller Enclosure Assemblies This section describes how to replace the controller enclosure internal assemblies. Since removal of these assemblies requires the controller enclosure be powered down and removed from the rack, host I/O activity to the disk array should be stopped before performing this procedure. CAUTION Only a trained service representative should perform the procedures described in this section.
. Removal and Replacement Figure 116 Door Lock 4. Switch off power to the disk enclosures. 5. Disconnect the Fibre Channel cables. Use a label to identify which MIA (upper “A” or lower “B”) the cable is connected to. This will ensure that each cable is reconnected to the correct MIA connector on the controller enclosure. 6. Disconnect the SCSI cables from the controller enclosure. Use a label to identify which SCSI connector the cable is connected to.
WARNING The controller enclosure weighs 75 pounds. Do not attempt to lift the enclosure without the help of another person or a lift device. 11. Remove the enclosure from the rack. Pull the enclosure out about four inches then, using two people, each grab a side of the controller and pull it from the rack. To reinstall the enclosure, perform the above steps in reverse. See Chapter 3, Installation for more information on installing the controller enclosure.
Removal and Replacement Figure 117 Controller Enclosure Removal and Installation Internal Controller Enclosure Assemblies 345
DIMM/SIMM Memory Cards This procedure describes how to remove and replace the DIMM (cache) memory card and SIMM memory card contained in the controller modules. This procedure is required when replacing failed DIMM/SIMM, or transferring the DIMM to a replacement controller module. Replacement controllers contain SIMM but do not include DIMM. When a new controller module is being installed, the DIMM must be removed from the existing controller module and transferred to the new, replacement, module.
Removal and Replacement Figure 118 Controller Module Cover Removal 5. Install the DIMM/SIMM card (Figure 119): – Replace the DIMM - If you are transferring the DIMM to a new replacement module or installing a new DIMM into the existing controller module - by pressing the card into the front DIMM connector until it snaps in place. These cards are keyed and will install in one direction only.
DIMM SIMM Figure 119 Replacing Memory in Controller Module 6. Replace the top plate on the controller modules (Figure 118) by replacing the six cover screws. 7. Replace the controller module into the controller enclosure. Refer to the "Controller Module" on page 332 for the required installation procedure (observe the LEDs, as described in that section, for correct operation.) 8. Replace the controller enclosure front cover.
Harness Cover Plate To gain access to the power harnesses and the battery harness (one end), remove the harness cover plate. This plate must also be removed when removing either the controller cage/midplane assembly or the power supply cage/midplane assembly. Loosen the four screws which secure the harness cover plate to the rear shield. See Figure 120. Because the plate will slip over the screws, the screws can remain in the rear shield. 2.
DC Power Harnesses The controller enclosure contains three DC Power harnesses (Figure 121): two +5 VDC and one +12 VDC. The power harnesses provide power connections between the power interface board and the controller enclosure backpanel (midplane). Removal and replacement of these harnesses requires removal of the controller enclosure from the rack. To replace the DC power harnesses, complete the following steps: +5 VDC Power Harnesses +12 VDC Power Harness Figure 121 DC Power Harnesses 1.
If disconnecting the cable is difficult, the power supply cage/ midplane assembly may need to be loosened and moved forward (Figure 123). To loosen power supply cage: a. Remove the eight screws, four each side, from the power supply cage/ midplane assembly (see Figure 123). 4. Install the new harnesses. 5. Reinstall the power supply cage/ midplane assembly, if removed, by installing the eight screws 6.
Power Supply Cage/Midplane Assembly The power supply cage/ midplane assembly houses both the power supply modules and the power supply fan module. These modules plug into the midplane board located at the back of the power supply cage. The midplane board also provides connectors for the power supply harnesses that distribute power to the controller cable midplane.
3. Remove the power supply cage/ midplane assembly. See Figure 123. a. Remove the eight screws, four each side, from the controller chassis. b. Pull the cage back a couple of inches to gain access to the power harness connectors and disconnect the connectors from the back of the power supply cage. Removal and Replacement c. Remove the cage from the controller chassis. 4. Unpack the new power supply cage/ midplane assembly.
6. Slide the power supply cage/ midplane assembly all the way into the chassis and install the eight screws (four each side). See Figure 123. 7. Install the controller enclosure into the rack (reverse the procedure "Controller Enclosure" on page 342). Battery Harness The controller module contains one battery harness. The battery harness (Figure 124) is a ribbon cable that provides a power connection between the Battery Backup (BBU) module and the controller enclosure midplane.
Controller Cage/ Midplane Assembly / Battery Harness Removal and Replacement Inside the chassis is the controller enclosure cage/midplane assembly (Figure 125), a modular structure consisting of controller module slots and the controller midplane. Both controller modules plug directly into the midplane.
This removal procedure also includes the procedure on the removal and replacement of the battery harness. Disconnect or reconnect harness Figure 126 Removing and Installing the Battery Harness To remove the controller cage/ midplane assembly, or the battery harness, complete the following steps: CAUTION Electrostatic charges can damage sensitive components. Use a grounding wrist strap or other antistatic precautions before removing or handling the components. 1.
4. Remove the eight screws, four from each side, of the controller cage (see Figure 127). Removal and Replacement 2 3 1 Figure 127 Controller Cage/ Midplane Assembly Removal 5. Remove the cage from the chassis: lift the top, front edge of the controller cage/ midplane assembly slightly upward (Figure 127), then pull the cage firmly toward the front until the connectors on the controller backplane exit the holes in the rear shield, and lift the cage out of the chassis.
6. If replacing the battery harness, complete this step; if replacing the controller cage/ midplane assembly, skip to Step 7. (Note, observe the routing of this cable so you can route the new cable in this manner.) a. Disconnect the battery harness from the battery connector bracket, located at the back of the battery compartment by removing the two screw from the battery harness connector and remove the harness. b.
7 REFERENCE / LEGAL / REGULATORY Models and Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 361 PDU/PDRU Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365 Replaceable Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 366 Reference / Legal / Regulatory A5635A Controller Enclosure Specifications . . . . . . . . . . . . . . .
System Requirements Host Systems Windows NT 4.0 and Windows 2000 Any host running Windows NT 4.0 or Windows 2000. Supported Operating Systems • • Windows NT 4.0 (with Service Pack 4, 5, or 6) Windows 2000 Fibre Channel Host Adapters Windows NT 4.0 and /2000 See the HP Storage Manager 60 User’s Guide for a list of supported host adapters.
Models and Options The HP SureStore E Disk Array FC60 consists of two products: theA5635A controller enclosure and theA5636A SureStore E Disk System SC10, or disk enclosure. Each of these products have their own options as indicated below. A5635A Controller Enclosure The A5635A controller enclosure is integrated into the disk array by qualified service trained personnel. The A5636A can be ordered with up to six A5636A. disk enclosures.
Table 42 A5635A Product Options Option Description Host Connect Cable Options 0Z4 2-meter Fibre Channel cable AFY 16-meter Fibre Channel cable 0Z5 50-meter Fibre Channel cable 0Z6 100-meter Fibre Channel cable 701 Replace 1.
A5636A Disk Enclosure SC10 The A5636A Sure Store E Disk System SC10 is integrated into the disk array by servicetrained personnel. This product is ordered in conjunction with A5635A controller enclosure. The A5636A includes the following components: – SC10 Rack-mount enclosure (accommodates 10, 1.
Disk Array FC60 Upgrade and Add-On Products Order the following parts to expand or reconfigure your original purchase: Table 43 Upgrade Products Order No. 364 Description A5637A 9.2-Gbyte disk drive module 10K rpm Ultra 2 LVD A5638A 18.
PDU/PDRU Products Hewlett-Packard offers the following PDUs and PDRUs, with US and international power options, for meeting electrical requirements: Table 44 PDU/PDRU Products Order No.
Replaceable Parts A5635A Controller Enclosure Replaceable Parts Table 45 Controller Enclosure Replaceable Parts Part Number Field Replaceable Units Exchange Part # A5635-60002 Windows NT1 Controller Module w/32 MB SIMM (no cache DIMMs) Includes Windows NT NVSRAM settings A5278-60002 128 MB DIMM n/a A5278-60004 16MB SIMM Module n/a A5277-60009 Battery Backup Module A5277-69009 A5277-60003 Controller Fan Module n/a A5277-60004 Power Supply Modules n/a A5277-60002 Power Supply Fan Module
A5636A Disk Enclosure Replaceable Parts Table 46 Disk Enclosure Replaceable Parts Replacement Part Order No. Part Description Exchange Part Order No. 20 top cover screws 6-32x3/16 T10 n/a 8120-6514 Power cord n/a A5236-60019 Fan cable n/a A5236-60003 Fan n/a A5272-67014 Door assembly n/a A5236-60023 Power supply A5272-67003 Backplane and mezzanine assy.
A5635A Controller Enclosure Specifications Dimensions: Height Width Depth 6.75 inches (17.1 cm) 17.5 inches (44.5 cm) 24 inches (61 cm) Weight: Component Weight of Each (lbs) Quantity Subtotal (lbs) Controller modules 6.6 2 13.2 Controller Fan 1.9 1 1.9 21.4 1 21.4 Power Supply 3.3 2 6.6 Power Supply Fan 1.5 1 1.5 Front Cover 2 1 2 31.6 1 31.
AC Power: AC Voltage and Frequency: • • • 120 VAC (100 - 127 VAC), 50 to 60 Hz single phase 230 VAC (220 - 240 VAC), 50 to 60 Hz single phase Auto-ranging Current: Voltage Maximum Operating Current In-Rush Current 100 - 127 VAC 1.5 A 2.3 A 21.7 A 220 - 240 VAC 0.8 A 1.2 A 42.
Environmental Specifications The HP SureStore E Disk Array FC60 has been tested for proper operation in supported Hewlett-Packard cabinets. If the disk array is installed in an untested rack configuration, care must be taken to ensure that all necessary environmental requirements are met. This includes power, airflow, temperature, and humidity. Failure to meet the required operating specifications may result in product failure.
Non-operating Environmental (shipping and storage): • • • • Temperature: -40º C to 70º C (-40º F to 158º F) Maximum gradient: 20º C per hour (68º F per hour) Relative humidity: 10% to 90% RH @ 28º C (wet bulb) Altitude: 4572 m (0 - 15,000 ft) Acoustics • Meets or exceeds all known international acoustics specifications for computing environments.
A5636A Disk Enclosure Specifications Dimensions: Height Width Depth 5.91 in. (15.0 cm) 18.9 in. (48.0 cm) 27.2 in. (69.1 cm) Weight: Component Weight of Each (lbs) Quantity Subtotal (lbs) Disk Drive (HH) 2.8 10 28 Fan 3 .3 2 7 Power Supply 10.6 2 22 BCC 4.5 2 9 Midplane-Mezzanine 6 1 6 Door 2 1 2 Chassis 35 1 35 Total, Approx. 372 A5636A Disk Enclosure Specifications 110 lbs. (50 kg.
AC Power: AC Voltage and Frequency: • • 100 - 127 VAC, 50 to 60 Hz single phase 220 - 240 VAC, 50 to 60 Hz single phase: Current: Voltage Typical Current Maximum Current 100 - 127 VAC 4.8 a 6.5 a 220 - 240 VAC 2.4 a 3.
Environmental Specifications The HP SureStore E Disk Array FC60 has been tested for proper operation in supported Hewlett-Packard cabinets. If the disk array is installed in an untested rack configuration, care must be taken to ensure that all necessary environmental requirements are met. This includes power, airflow, temperature, and humidity. Failure to meet the required operating specifications may result in product failure.
For continuous, trouble-free operation, the disk enclosure should NOT be operated at its maximum environmental limits for extended periods of time. Operating within the recommended operating range, a less stressful operating environment, ensures maximum reliability. Note The environmental limits in a nonoperating state (shipping and storage) are wider: • • • • Temperature: -40º C to 70º C (-40º F to 158º F) Maximum gradient: 24º C per hour (43.
Warranty and License Information Standard Limited Warranty The HP SureStore E Disk Array FC60 standard warranty includes the following: – Three year limited warranty – Next day on-site service for certain repairs (not available in certain geographic areas) See the "Hewlett-Packard Hardware Limited Warranty" on page 378 for a complete description of the standard warranty.
Preparing for a Support Call If you must call for assistance, gathering the following information before placing the call will expedite the support process: – – – – – Product model name and number Product serial number Applicable error messages from system or diagnostics Operating system type and revision Applicable hardware driver revision levels (for example, the host adapter driver) The call agent will ask questions, may ask you to run HP-supplied configuration and diagnostic programs, and will attemp
Hewlett-Packard Hardware Limited Warranty HP warrants to you, the end-user Customer, that HP SureStore E Disk Array FC60 hardware components and supplies will be free from defects in material and workmanship under normal use after the date of purchase for three years. If HP or Authorized Reseller receives notice of such defects during the warranty period, HP or Authorized Reseller will, at its option, either repair or replace products that prove to be defective.
software warranty terms that may be found in any documentation or other materials contained in the computer product packaging with respect to covered Software. Ninety-Day Limited Software Warranty. HP warrants for a period of NINETY (90) DAYS from the date of the purchase that the Software will execute its programming instructions when all files are properly installed. HP does not warrant that the software will be uninterrupted or error free.
operation or storage outside the environmental specifications for the product, in-transit damage, improper maintenance, or defects resulting from use of third-party software, accessories, media, supplies, consumables, or such items not designed for use with the product. The HP warranty does not cover errors, malfunctions, or problems caused by or related to third-party products that are external to your HP SureStore E Disk Array FC60.
warranty, so the above limitation or exclusion might not apply to you. The warranty gives you specific legal rights and you might also have other rights that vary from country to country, state to state or province to province. THE WARRANTY TERMS CONTAINED HERE, EXCEPT TO THE EXTENT LAWFULLY PERMITTED, DO NOT EXCLUDE, RESTRICT OR MODIFY AND ARE IN ADDITION TO THE MANDATORY STATUTORY RIGHTS APPLICABLE TO THE SALE OF THIS PRODUCT TO YOU.
Ownership. The Software is owned and copyrighted by HP or its third party suppliers. Your license confers no title or ownership and is not a sale of any rights in the Software, its documentation or the media on which they are recorded or printed. Third party suppliers may protect their rights in the Software in the event of any infringement. Copies.
2.) Customer further agree that Software is delivered and Licensed as "Commercial Computer Software" as defined in DFARS 252.227-7013, or "restricted computer software" as defined in FAR 52.227-19 c(1,2) if used, respectively, in the performance of a Department of Defense on non-Department of Defense U.S. Government contract. c. Any term of this Agreement which is held to be invalid will be deleted, but the remainder of the Agreement will not be affected. d.
Regulatory Compliance Safety Certifications: • • • • • UL listed CUL certified TUV certified with GS mark Gost Certified CE-Mark EMC Compliance • • • • • • 384 US FCC, Class A CSA, Class A VCC1, Class A BCIQ, Class A CE-Mark C-Tick Mark Regulatory Compliance
FCC Statements (USA Only) The Federal Communications Commission (in 47 CFR 15.105) has specified that the following notice be brought to the attention of the users of this product. Reference / Legal / Regulatory This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
VCCI Statement (Japan) This equipment is in the Class A category information technology equipment based on the rules of Voluntary Control Council For Interference by Information Technology Equipment (VCCI). When used in a residential area, radio interference may be caused.
Spécification ATI Classe A (France Seulement) DECLARATION D'INSTALLATION ET DE MISE EN EXPLOITATION d'un matèriel de traitement de l'information (ATI), classé A en fonction des niveaux de perturbations radioélectriques émis, définis dans la norme européenne EN 55022 concernant la Compatibilité Electromagnétique.
Geräuschemission (For Germany Only) 388 • • • LpA: 45.0 dB (suchend) • • Alle andere Konfigurationen haben geringere Geräuschpegel. Am fiktiven Arbeitsplatz nach DIN 45635 T. 19. Die Daten sind die Ergebnisse von Typprüfungen an Gerätekonfigurationen mit den höchsten Geräuschemissionen:12 Plattenlaufwerke. Für weitere Angaben siehe unter Umgebungsbedingungen.
Declaration of Conformity according to ISO / IEC Guide 22 and EN 45014 Manufacturer Name: Manufacturer Address: Hewlett-Packard Company Enterprise Storage Business Unit P.O.Box 15 Boise, Idaho U.S.A.
FCC Statements (USA Only)
GLOSSARY adapter A printed circuit assembly that transmits user data (I/Os) between the host system’s internal bus and the external Fibre Channel link and vice versa. Also called an I/O adapter, FC adapter, or host bus adapter (HBA). ArrayID The value used to identify a disk array when using Array Manager 60. The ArrayID can be either the disk array S/N, or an alias assigned to the disk array.
bind The process of configuring unassigned disks into a LUN disk group. Disks can be bound into one of the following LUN disk groups: RAID 5, RAID 1 (single mirrored pair), RAID 0/1 (multiple mirrored pairs). bootware This controller firmware comprises the bring-up or boot code, the kernel or executive under which the firmware executes, the firmware to run hardware diagnostics, initialize the hardware and to upload other controller firmware/software from Flash memory, and the XMODEM download functionality.
Class of Service The types of services provided by the Fibre Channel topology and used by the communicating port. controller A removable unit that contains an array controller. dacstore A region on each disk used to store configuration information. During the Start Of Day process, this information is used to configure controller NVSRAM and to establish other operating parameters, such as the current LUN configuration.
disk array controller A printed-circuit board with memory modules that manages the overall operation of the disk array. The disk array controllers manage all aspects of disk array operation, including I/O transfers, data recovery in the event of a failure, and management of disk array capacity. There are two controllers (A and B) in the disk array enclosure. Both controllers are active, each assuming ownership of LUNs within the disk array.
EPROM Erasable Programmable Read-Only Memory. fabric A Fibre Channel term that describes a crosspoint switched network, which is one of three existing Fibre Channel topologies. A fabric consists of one or more fabric elements, which are switches responsible for frame routing. A fabric can interconnect a maximum of 244 devices. The fabric structure is transparent to the devices connected to it and relieves them from responsibility for station management. FC-AL See Fibre Channel Arbitrated Loop (FC-AL).
25 MB/s (quarter speed), or 12.5 MB/s (eighth speed) over distances of up to 100 m over copper media, or up to 10 km over optical links. The disk array operates at full speed. Fibre Channel Arbitrated Loop (FC-AL) One of three existing Fibre Channel topologies in which two to 126 ports are interconnected serially in a single loop circuit. Access to the FC-AL is controlled by an arbitration scheme.
frame The smallest indivisible unit of application-data transfer used by Fibre Channel. Frame size depends on the hardware implementation and is independent of the application software. Frames begin with a 4-byte Start of Frame (SOF), end with a 4-byte End of Frame (EOF), include a 24-byte frame header and 4-byte Cyclic Redundancy Check (CRC), and can carry a variable data payload from 0 to 2112 bytes, the first 64 of which can be used for optional headers.
host A processor that runs an operating system using a disk array for data storage and retrieval. hot swappable Hot swappable components can be removed and replaced while the disk array is online without disrupting system operation. Disk array controller modules, disk modules, power supply modules, and fan modules are all hot swappable components. I/O operation An operation initiated by a host computer system during which data is either written to or read from a peripheral. image (disk image) See mirroring.
created on the same disk array. A numeric value is assigned to a LUN at the time it is created. LVD-SCSI Low voltage differential implementation of SCSI. Also referred to as Ultra2 SCSI. LVM (Logical Volume Manager) The default disk configuration strategy on HP-UX. In LVM one or more physical disk modules are configured into volume groups that are then configured into logical volumes. loop address The unique ID of a node in Fibre Channel loop topology, sometimes referred to as a Loop ID.
parity A data protection technique that provides data redundancy by creating extra data based on the original data. Parity is calculated on each write I/O by doing a serial binary exclusive OR (XOR) of the data segments in the stripe written to the data disks in the LUN. Parity is used by RAID 5 LUNs to reconstruct data from a failed disk. peripheral device addressing (PDA) The addressing technique used by the host to address the disk array controllers.
and parity to implement data redundancy. The RAID levels supported by the disk array include RAID 1, RAID 3, and RAID 5. RAID 1 A RAID level in which the LUN uses a single mirrored pair of disks. One disk serves as the data disk, and the other serves as the mirror disk. RAID 0/1 A RAID configuration in which the LUN uses both mirroring for redundancy, and disk striping for performance. Half the disks serve as the data disks, and half serve as the mirror disks.
SCSI An acronym for “Small Computer System Interface”, SCSI is an industry-standard protocol for connecting peripherals and hosts over a bus topology. SCSI-2 bus A bus that complies with the SCSI standard. The six channel that connect the disk array controller system to the disk systems are SCSI 2 busses. Each disk system has two internal SCSI-2 busses that can be configured as independent busses that connect five disk slots to each BCC controller. or as a single internal bus.
stripe boundary crossing In disk striping, if the stripe segment size is too small for a single I/O operation, the operation requires access to two stripes. Called a stripe boundary crossing, this event reduces I/O performance. stripe segment size The amount of information simultaneously read from or written to each disk in a LUN using disk striping. The default stripe segment size is set to the same value used for cache page size (4K or 16K).
Uninterruptible Power Supply (UPS) An Uninterruptible Power Supply is a power supply that is capable of maintaining power even if the input ac mains supply loses its source of power. VHDCI Very high density cable interface. volume set addressing (VSA) An enhanced technique for addressing disk array LUNs. VSA overcomes the eight LUN limit imposed by PDA, allowing all 32 LUNs on the disk array to be addressed by the host.
INDEX auto code synchronization described 204 B backpanel. See back cover or controller backpanel backplane controller card.
warranty 263 battery charger See battery backup module battery harness, controller enclosure illustration of 271 removal and replacement 354 service notes 271 battery module illustration of 262 life expectancy 261 BCC module described 26 removal and replacement 300 troubleshooting 284 C cabinets supported 16 cable Fibre Channel 236 handling precautions 238 SCSI 236, 237 SCSI drive 236 troubleshooting 236 cable installation Fibre Channel 162 SCSI 153 cache flush limit impact on performance 198 cache flush th
troubleshooting 253 current disk enclosure 373 inrush 114 steady state 114 total operating and in-rush 115 D data protection during power outage 261 data channel, verifying 172 data parity described 46 data striping described 47 dates on battery backup module 265 DC power harness described 272 illustration of 272 DC power harnesses removal and replacement 350 detecting errors 236 determining fan failures 253 dimensions controller enclosure 368 disk enclosure 372 DIMM 37 installation 334 DIMM/SIMM, controlle
power input specifications 373 power-down sequence 171 power-up sequence 164 rebuild process 59 upgrade and add-on products 364 ventilation 328 disk array capacity maximum 71 disk array configurations five disk enclosure, high availability and performance 88 five disk enclosure, maximum capacity 90 four disk enclosure, high availability and performance 84 four disk enclosure, maximum capacity 86 one disk enclosure, non-high availability 74 recommended 73 six disk enclosure, high availability and performance
electrical 114 power distribution units (PDUs/ PDRUs) 117 recommended European circuit breakers 116 recommended PDU/PDRU for HP System/E racks 118 site 114 environmental specifications 370, 374 error battery backup module low 263 controller fault 257 Errors During Normal Operation 219 LEDs Kernel Initialization 221 ESD strap part number 127 evaluating performance 196 expanding storage capacity adding disk enclosures 174 overview 71 F factory default configurations See recommended array configurations Inde
G global hot spare tips for selecting disks 60 global hot spare disks described 59 H Hardware Event Monitor 281 hardware path interpreting 172 harness cover plate, controller enclosure removal and replacement 349 hazardous waste 266 heat output controller enclosure 369 disk enclosure 373 high availability features 18, 45 planning 69 host connections 36, 240 host adapter 236 host ID controller modules 36 controllers 240 hot spare See global hot spare hot swap 267 controller 238 controller fan module 256 powe
managing disk array capacity 189 memory battery backup for 261 DIMMs 239 servicing notes 239 SIMMs 239 MIA installation 163 removal and replacement 340 mirroring described 45 modules controller enclosure 31 disk enclosure 24 moving a disk enclosure 135 moving a volume group 203 moving disk modules from one array to another 201 within an array 201 N noise level 371 number of days battery will maintain power 261 NVSRAM, behavior 205 O operating environment 374 specifications 370 operating system support 360 o
power supply troubleshooting 285 power supply assembly described 274 illustrated 274 servicing notes 274 power supply cage/midplane assy, controller enclosure removal and replacement 352 power supply fan module hot swapping 258 illustrated 258 power supply fan module, controller enclosure described 40 removal and replacement 328 power supply fanmodule servicing notes 258 power supply module DC power harness for 272 illustrated 247 interchangeable modules 267 interface board 267 LEDs 299 overheating 268 reco
enclosure 349 MIA 340 power button assy, disk enclosure 312 power supply cage/midplane assy, controller enclosure 352 power supply fan module, controller enclosure 328 power supply module, controller enclosure 330 power supply module, disk enclosure 298 SCSI cables 338 top cover, disk enclosure 310 replacing disk modules with higher capacity modules 201 Rittal rack 16 running Array Manager 60 189 S safety compliance 384 safety hazard 266 SCSI drive cables 236 drive connections 36, 240 servicing notes 238 SC
servicing battery backup module 263 battery harness 271 controller backpanel 248 controller card cage 248 controller fan 256 memory 239 power harness 272 power interface board 274 power supply 261, 274 power supply fan 258 power system 260 setting configuration switches 142 stripe segment size 194 SF21 288 SF88 288 SIMMs 37 described 239 replacing 346 servicing notes 239 single-inline memory module.
unsupported Windows 98 troubleshooting battery backup module problems 263 checklist 211 controller backpanel problems 249 controller fan problems 257 controller problems 257 cooling problems 252 fan failures 253, 257 hints for interface problems 237 host ID problems 236 interface problems 236 intermittent power loss 272 isolating causes 284 memory problems 239 overheating problems 252, 268 power shutdown 268 power supply problems 269 power system problems 261 power-up 213 table 284 through software 237 Wind
Index
