HP ProLiant ML500 Series Generation 2 Server Memory Installation Guide

Memory
1-20 HP ProLiant ML500 Series Generation 2 Server Memory Installation Guide
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Writer: Jim Yurick File Name: b-ch1 Memory.doc
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This process occurs without intervention or server interruption, and enables you to
hot-replace the failed or degraded DIMM at your convenience. Multi-bit errors are
detected at the bank level rather than the DIMM level, so if a multi-bit error occurs,
both DIMMs in the bank must be replaced.
As long as no errors have occurred on the memory board, the system periodically
switches which memory board it reads from to be sure that both memory boards are
monitored for memory errors.
Hot-plug mirrored memory also provides hot-plug replacement capability. The
server’s hot-plug capability enables you to hot-replace a memory board that has a
failed or degraded DIMM on it. You can remove the memory board, replace the
DIMMs, and then reinstall the memory board while the server is running, preventing
server downtime. Once the board is re-installed, the system automatically returns to
mirrored status. You can also perform a non-hot-plug replacement of failed or
degraded DIMMs during a scheduled shutdown.
DIMM Installation Requirements
In addition to the DIMM configuration requirements for advanced ECC memory,
observe the following DIMM configuration requirements when installing DIMMs for
hot-plug mirrored memory:
• Two memory boards must be installed.
• Both memory boards must be configured identically. Corresponding banks (for
instance, bank A on the memory board in slot 1 and bank A on the memory board
in slot 2) must be populated with DIMMs of the same capacity.
Observe the following DIMM configuration requirements when performing a
hot-replacement:
• Do not unlock the memory board unless the “Ready to Hot Plug” LED is green.
• If you replace a DIMM, the new DIMM must be a PC1600 DDR SDRAM
DIMM of the same capacity as the DIMM you are replacing.
For a complete description of a hot-plug procedure, refer to “Installation, Removal,
and Replacement Procedures” in this chapter.