ProLiant ML150 Generation 3 Server Installation Sheet

Installing mass storage devices
The drive bays on the front panel can accommodate up to six hard drives.
The server supports both SAS and SATA hard drives.
CAUTION: Drives can be damaged by static electricity. Before
handling drives, touch an unpainted metal surface to discharge
static electricity.
Hot-Plug SATA and Hot-Plug SAS/SATA HBA model
Non-Hot-Plug SATA
NOTE: Remove the access panel before the following installation
procedure.
NOTE: Additional drives pre-assembled in the proper carriers can
be purchased from HP. Please visit the HP website for additional
information.
Installing the PCI expansion card
The server supports six PCI bus slots.
• Three PCI-X slots (64-bit)
• Two PCI-Express slots
• One PCI slot (32-bit)
NOTE: Refer to “System Board Components” in this document for
the expansion slot locations.
Removing the air baffle
NOTE: Before installing the memory or the processor, remove the
air baffle first.
1. Slightly pull out the blue snap rivet.
2. Move the air baffle to the inside direction of the chassis to unhook the air
baffle from the hooks on the cooler.
3. Take the air baffle out from the chassis.
To reinstall the air baffle, reverse the above procedure.
WARNING! The air baffle covers those areas in dotted line of
system board as shown in the below figure. When removing or
installing the air baffle, make sure the location is correct and do
not interfere with any nearby components.
Installing the memory
The following guidelines must be followed when memory modules are
being added or replaced:
• For 2P system, both physical processors must be of the same type
and speed.
• Use 533/667 MHz ECC FBD (Fully Buffered DIMM).
• Supported DIMM: 512 MB, 1 GB, and 2 GB (Maximum 8 GB system
memory size)
• Supported configurations: Single DIMM in slot 1, one identical pair in
slot 1 & 3, two pairs (4 DIMMs).
CAUTION: DIMMs can be damaged by improper handling.
Always use an anti-static wrist strap and grounding mat, and
discharge static electricity before touching DIMMs.
NOTE: Refer to “System Board Components” in this document for
the DIMM locations.
1. Insert the memory module into the socket.
2. Push both socket latches inward.
Installing the processor
The LGA771 processor socket in the HP ProLiant ML150 Generation 3 server
supports Dual-Core Intel® Xeon® Processor 5000/5100 series and
Quad-Core Intel® Xeon® Processor 5300 series.
WARNING! Align pin 1 on the processor with pin 1 on the
processor socket, or pin damage will occur.
WARNING! Refer to the label on top of the cooler to make sure
the air flow direction is correct.
WARNING! Be sure that the cooler sits squarely on the processor, or
overheating and damage to the processor may occur.
Getting additional documentation
For additional documentation, refer to the HP ProLiant ML150 Generation 3
Server Support CD. You can also access additional information and
documentation from the HP external website, either by connecting directly
or through the Support CD.