HP ProLiant ML370 Generation 5 Server Maintenance and Service Guide Part Number 404682-009 October 2008 (Ninth Edition)
© Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, Windows Server and Windows NT are U.S.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ......................................................................................................................... 6 Illustrated parts catalog ............................................................................................................... 17 Mechanical components.............................................
Battery ................................................................................................................................................... 68 Cabling ..................................................................................................................................... 70 Cabling overview .................................................................................................................................... 70 Diskette drive cabling ...............................
Index.......................................................................................................................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente.
anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío.
periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Customer self repair 16
Illustrated parts catalog Mechanical components Illustrated parts catalog 17
Item Description Assembly part number Spare part number Customer self repair (on page 6) 1 Access panel (top cover) 389059-001 409410-001 Mandatory1 2 Front bezel (tower model only) 389070-001 409411-001 Mandatory1 3 Rack bezel (rack model only) 389064-001 409412-001 Mandatory1 4 Tower configuration panels — 409413-001 — a) Wrap-around panel 389077-001 — Mandatory1 b) Top cover 389078-001 — Mandatory1 5 Center wall 384886-001 409433-001 Mandatory1 6 Removable media bla
Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt.
Illustrated parts catalog 20
System components Item Description Assembly part number Spare part number Customer self repair (on page 6) System components 14 Hot-plug power supply, 1000-W 380622-001 403781-001 Mandatory1 15 Hot-plug fan, 120-mm 384881-001 409421-001 Mandatory1 16 3.
Item Description Assembly part number Spare part number Customer self repair (on page 6) 17 Processor — — — a) Dual-Core, Intel® Xeon® Processor 5050 (3.00-GHz, 667-MHz FSB, 2x2MB L2 cache)† 405176-004 409423-001 Optional2 b) Dual-Core, Intel® Xeon® Processor 5060 (3.20-GHz, 1066-MHz FSB, 2x2-MB L2 cache)*† 398571-002 409424-001 Optional2 c) Dual-Core, Intel® Xeon® Processor 5080 (3.
Item 18 Description Assembly part number Spare part number Customer self repair (on page 6) p) Quad-Core, Intel® Xeon® Processor X5355 (2.66-GHz, 1333-MHz FSB, 4x2-MB L2 cache)*† 432231-001 438363-001 Optional2 q) Quad-Core, Intel® Xeon® Processor X5365 (3.0-GHz, 1333-MHz FSB, 4x2-MB L2 cache)*† 432231-002 436520-001 Optional2 r) Quad-Core, Intel® Xeon® Processor E5405 (2.00-GHz, 1333-MHz FSB, 2x6-MB L2 cache)*† 455274-006 457876-001 Optional2 s) Quad-Core, Intel® Xeon® Processor E5410 (2.
Item Description Assembly part number Spare part number Customer self repair (on page 6) 21 PPM 399854-001 407748-001 Mandatory1 22 Power supply backplane 379125-001 399787-001 Optional2 23 SAS backplane duplex board with drive cage 389056-001 409429-001 Optional2 24 Memory board 012683-001 409430-001 Optional2 Mass storage devices 25 CD-ROM drive, IDE, 48X 266072-004 413383-001 Mandatory1 26 DVD-ROM drive* 290992-MD3 399312-001 Mandatory1 27 Diskette drive* 233327-002
Item Description Assembly part number Spare part number Customer self repair (on page 6) 36 Diskette drive cable* 271946-008 431243-001 Mandatory1 37 Second parallel/serial port cable* 384445-002 418300-001 Mandatory1 FBDIMMs, registered DDR2 — — — a) 1-GB, 2x512-MB* 398705-051 416470-001 Mandatory1 b) 2-GB, 2x1-GB* 398706-051 416471-001 Mandatory1 c) 4-GB, 2x2-GB* 398707-051 416472-001 Mandatory1 d) 8-GB, 2x4-GB* 398708-061 416473-001 Mandatory1 SFF hard drive — — — a
Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (included with the server) • Diagnostics Utility (included on the SmartStart CD-ROM) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 30). If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components. For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.
2. After performing the installation or maintenance procedure, slide the server into the rack by pressing the server rail-release latches. Power down the server WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
3. Extend the server from the rack. Reverse the server installation steps in the documentation that ships with the rack-mounting option. 4. Press the server rail-release latches and remove the server from the rack. 5. Place the server on a sturdy, level surface. Front bezel Tower servers have a removable front bezel that must be unlocked and opened before accessing the hard drive cage, and before removing the access panel. To remove the component: 1. Open the front bezel (tower servers only).
2. Lift up the front bezel and remove it from the chassis. To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.
3. Loosen the two thumbscrews that secure the rack bezel to the chassis. 4. Remove the rack bezel. To replace the component, reverse the removal procedure. Feet NOTE: This procedure applies to tower servers only. To remove the component: 1. Power down the server (on page 31). 2. Place the server on its side.
3. Remove the feet. To replace the component, slide it back into the locking slot. Be sure that the foot clicks securely into the chassis. Repeat with the remaining feet, as necessary. Tower configuration panels To remove the component: 1. Power down the server (on page 31). 2. Remove the tower feet ("Feet" on page 34). 3. Remove the tower configuration panels: a. Use the T-10/T-15 Torx screwdriver to remove the two front panel screws. b. Remove the tower configuration panels.
Rack rails NOTE: This procedure applies to rack servers only. To remove the component: 1. Power down the server (on page 31). 2. Remove the server from the rack (on page 31). 3. Pull the rack rail latch. 4. Slide the rail to the front of the server to release the rail. 5. Remove the rail. 6. Repeat the steps to remove the other rail. To replace the component, reverse the removal procedure.
Remove the component as indicated. To replace the component, reverse the removal procedure. Hot-plug power supply WARNING: To reduce the risk of electric shock, do not disassemble the power supply or attempt to repair it. Replace it only with the specified spare part. CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both bays are populated with power supplies. To remove the component: 1. Disconnect the power cord from the AC source. 2. Remove the power cord.
3. Remove the power supply. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. Hard drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Unlock and open the front bezel ("Front bezel" on page 32) (tower servers only).
To replace the component, reverse the removal procedure. Hard drive To remove the component: CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED combinations" on page 88). 2. Back up all server data on the hard drive. 3. Remove the hard drive.
NOTE: The center wall is removed for illustration purposes only. 7. Disconnect the SAS-SATA cables from the SAS backplane. IMPORTANT: When installing a x3/x1 SAS cable, HP recommends that the x3 part of the x3/x1 cable be linked to the SAS hard drive backplane connector that corresponds to hard drive slots 1 to 4. In this setup, hard drive slot 1 will not be available, but since hard drive slots 2 to 4 will be connected, one continuous volume can be created. 8.
9. Remove the SAS cage. To replace the component, reverse the removal procedure. System fans The server supports redundant hot-plug fans to provide proper airflow to the system if a primary fan fails. In the standard, non-redundant, configuration, fans 1, 2, and 3 cool the server. For the redundant configuration, fans 4, 5, and 6 are added to back up the primary fans. This configuration enables the server to continue operation in non-redundant mode, if a fan failure occurs.
• In the operating system: o The Health Driver performs an orderly shutdown if it detects a cautionary temperature level. If the server detects a critical temperature level before the orderly shutdown occurs, the server performs an immediate shutdown. Additionally, the Health Driver performs an orderly shutdown if more than one fan is failed or removed. o When Thermal Shutdown is disabled in RBSU, the server performs an immediate shutdown if it detects a critical temperature level.
5. Remove the expansion slot cover. Retain the slot cover for future use. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. To replace the component, reverse the removal procedure. Expansion board CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the expansion boards.
5. Release the retainer clip. 6. Press the slot release lever and swing the slot release lever upward. 7. Remove the expansion board. CAUTION: Make a note of board locations. Be sure to install replacements in the same slots. To replace the component, reverse the removal procedure. Slot release lever To remove the component: 1. Power down the server (on page 31). 2. Extend the server from the rack, if applicable ("Extend the server from the rack" on page 30). 3.
4. Remove the expansion slot cover ("Expansion slot cover" on page 42). 5. Remove any expansion board installed in the slot ("Expansion board" on page 43). 6. From the rear of the chassis, push up on the lever locking tab. 7. Pull the release lever forward to disengage the rear tabs from the chassis wall. 8. Remove the slot release lever. To replace the component, reverse the removal procedure. IMPORTANT: Be sure that the lever locking tab is locked into place.
4. Remove the processor air baffle. To replace the component, reverse the removal procedure. Center wall To remove the component: 1. Power down the server (on page 31). 2. Extend or remove the server from the rack ("Extend the server from the rack" on page 30, "Remove the server from the rack" on page 31). 3. Remove the access panel. ("Access panel" on page 33) 4. Remove the processor air baffle ("Processor air baffle" on page 45). 5.
7. Remove the center wall. To replace the component, reverse the removal procedure. Media blanks To remove the component: 1. Power down the server (on page 31). 2. Open or remove the tower bezel ("Front bezel" on page 32). CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. 3. Remove the media blanks.
NOTE: HP recommends that you remove all media blanks to facilitate drive installation. Retain the blanks for future use. To replace the component, reverse the removal procedure. Half-height or full-height media devices To remove the component: 1. Power down the server (on page 31). 2. Do one of the following: o Unlock and remove the bezel ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4.
o Unlock and remove the bezel ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4. Press the HP Systems Insight Display ejector button to extend the HP Systems Insight Display. 5. Disconnect the Systems Insight Display cable from the system board ("System board components" on page 84). 6. Remove two T-10 screws on the side of the Systems Insight Display. 7. Remove the Systems Insight Display.
For maximum performance, HP recommends that both memory boards be populated with the same total amount of memory to support 4x1 interleaving across both memory branches. Observe the following warnings when performing a replacement procedure: WARNING: Always comply with all electrostatic and thermal guidelines to prevent bodily injury and ensure a properly functioning system when performing hot-plug operations.
2. Do one of the following: o Open or remove the tower bezel, as needed ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4. Remove the processor air baffle ("Processor air baffle" on page 45). 5. Remove a memory board ("Memory board" on page 50). 6. Remove the FBDIMM. To replace the component, reverse the removal procedure.
IMPORTANT: Processor socket 1 must always be populated. If processor socket 1 is empty, the server does not power up. To remove the component: 1. Power down the server (on page 31). 2. Do one of the following: o Unlock and remove the bezel ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4. Remove the processor air baffle ("Processor air baffle" on page 45). 5. Open the heatsink retaining latches. 6.
8. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor remains inside the processor installation tool. 1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. 2. Align the processor installation tool with the socket and install the spare processor. CAUTION: The processor is designed to fit one way into the socket.
3. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.
4. Close the processor retaining latch and the processor socket retaining bracket. 5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution: 7. Install the heatsink.
8. Close the heatsink retaining latches. 9. Install the processor air baffle. 10. Install the access panel. 11. Do one of the following: 12. o Install and lock the bezel. o Slide the server back into the rack. Power up the server. Heatsink To remove the component: 1. Power down the server (on page 31). 2. Do one of the following: o Unlock and remove the bezel ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3.
6. Remove the heatsink. To replace the heatsink: 1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. 3. Install the heatsink.
4. Close the heatsink retaining latches. 5. Install the processor air baffle. 6. Install the access panel. 7. Do one of the following: 8. o Install and lock the bezel. o Slide the server back into the rack. Power up the server. PPM To remove the component: 1. Power down the server (on page 31). 2. Do one of the following: o Unlock and remove the bezel ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4.
5. Remove the PPM. NOTE: The appearance of compatible PPMs may vary. To replace the component, reverse the removal procedure. CAUTION: Only install a PPM if the processor is installed. Both the PPM and the processor must be installed together, otherwise the system does not boot. IMPORTANT: PPMs do not seat if turned the wrong way. Power supply backplane To remove the component: 1. Power down the server (on page 31). 2. Remove all hot-plug power supplies ("Hot-plug power supply" on page 37). 3.
8. Disconnect the signal cable from the power supply backplane. 9. Disconnect all cables from the system board, as necessary, to access the power supply backplane. 10. Remove the power supply backplane. To replace the component, reverse the removal procedure. IMPORTANT: Be sure to align the two retaining guides on the chassis with the holes on the power supply backplane when replacing it. Video connector To remove the component: 1. Power down the server (on page 31). 2.
o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4. Remove all expansion boards ("Expansion board" on page 43). 5. Remove the processor air baffle ("Processor air baffle" on page 45). 6. Remove the center wall ("Center wall" on page 46). 7. Remove the memory board ("Memory board" on page 50). 8. Disconnect the cable from the internal video connector on the system board. 9. Extend or remove the media bay spacer from the chassis. 10.
BBWC battery pack CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module.
5. Remove the battery pack. To replace the component, reverse the removal procedure. System board IMPORTANT: If replacing the system board or clearing NVRAM, you must re-enter the server serial number through RBSU. To remove the component: 1. Power down the server (on page 31). 2. Do one of the following: o Unlock and remove the bezel ("Front bezel" on page 32). o Extend the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 33). 4.
11. Open the processor retaining latch and the processor socket retaining bracket. 12. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket. CAUTION: To avoid damage to the processor: • Handle the processor only by the edges.
15. Lift the system board out of the chassis and tilt it to one side to clear the cable guide. To replace the system board: 1. Install the spare system board in the server before installing the processor. 2. Prepare the processor socket on the spare system board: a. Open the processor retaining latch and the processor socket retaining bracket.
b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the processor socket of the failed system board. The cover protects the socket during shipping when the failed board is returned. 4. Install the processor onto the spare system board. CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.
5. Close the processor retaining latch and the processor socket retaining bracket. 6. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 7. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access RBSU. 2. Select the System Options menu. 3. Select Serial Number. The following warning is displayed: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel.
5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• SAS power cabling Cabling 71
CD-ROM drive cabling Video cabling Cabling 72
Parallel/serial port cabling BBWC option cabling Cabling 73
Internal USB connector Storage device cabling guidelines CAUTION: To prevent damage to the equipment, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded (earthed) AC outlet before installing devices. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Diagnostic tools Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
• Deleting a logical drive configuration If you do not use the utility, ORCA will default to the standard configuration. For more information regarding array controller configuration, refer to the controller user guide. For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD.
IMPORTANT: This utility supports operating systems that may not be supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/support). • Integrates with other software maintenance, deployment, and operating system tools • Automatically checks for hardware, firmware, and operating system dependencies, and installs only the correct ROM upgrades required by each target server To download the tool and for more information, see the HP website (http://www.
HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.
Server component identification Front panel components • Rack model Item Description 1 Hard drive bays 9-16 (optional drive cage) 2 USB connectors 3 HP Systems Insight Display 4 Video connector (rack model only) 5 HP Systems Insight Display ejector button 6 DVD/CD-ROM drive 7 Removable media bays 8 Hard drive bays 1-8 Server component identification 80
• Tower model Item Description 1 Media bay spacer 2 DVD/CD-ROM drive 3 Removable media bays 4 Hard drive bays 1-8 5 Hard drive bays 9-16 (optional drive cage) 6 USB connectors 7 HP Systems Insight Display 8 HP Systems Insight Display ejector button Front panel LEDs and buttons Server component identification 81
Item Description Status 1 UID button — 2 UID LED Blue = Activated Flashing blue = System is being managed remotely Off = Deactivated 3 Internal system health LED Green = Normal (system on) Amber = System health is degraded Red = System health is critical Off = Normal (system off) 4 External system health LED (power supply) Green = Normal (system on) Amber = Redundant power supply failure Red = Power supply failure. No operational power supplies.
Item Description 1 Keyboard connector 2 Mouse connector 3 USB connectors 4 iLO 2 management connector 5 Video connector 6 Serial connector 7 NIC 2 connector 8 PCI expansion slots 9 Hot-plug power supply (primary bay) 10 Hot-plug power supply blank (redundant bay) 11 NIC 1 connector 12 T-10/T-15 Torx screwdriver Rear panel LEDs Item Description Status 1 UID LED Blue = Activated Flashing blue = system is being remotely managed Off = Deactivated 2 iLO 2 activity LED Green or
Item Description Status 5 NIC 2 link LED Green = Linked to network Off = No network connection 6 NIC 1 link LED Green = Linked to network Off = No network connection 7 NIC 1 activity LED Green or flashing green = Network activity Off = No network activity 8 Power supply LED Green = System has AC power and is powered up Off = System has no AC power System board components Item Description 1 PCI Express slot 1, x4 2 PCI-X slot 2, 64-bit/133-MHz 3 PCI-X slot 3, 64-bit/133-MHz 4 PCI Exp
Item Description 12 Memory board connector 1 13 Memory board connector 2 14 PPM 1 15 Processor 1 16 Power connector 17 Fan control/HP Systems Insight Display connector 18 USB tape drive connector 19 IDE connector 20 Processor 2 21 PPM 2 22 Power connector 23 Front video connector 24 Internal USB connector 25 Serial 2 connector 26 Parallel connector 27 Diskette drive connector System maintenance switch Position Default Function S1 Off Off = iLO 2 security is enabled.
Internal system health LED combinations When the internal system health LED on the front panel ("Front panel LEDs and buttons" on page 81) illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated HP Systems Insight Display LEDs and the internal health LED indicate system status. NOTE: The system management driver must be installed for the internal system health LED to provide pre-failure and warranty conditions.
SAS and SATA device numbers The server supports a combination of up to 16 SAS and SATA hard drives in two hard drive cages. HP recommends populating hard drive bays starting with the lowest SAS or SATA device number.
Item Description Status 2 Online/activity LED Green = Drive activity Flashing green = High activity on the drive or drive is being configured as part of an array Off = No drive activity SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) On, off, or flashing Alternating amber and The drive has failed, or a predictive failure alert has been blue received for this drive; it also has been selected by a management application.
FBDIMM slots The server supports two memory boards, each containing eight slots with paired banks identified by the letters A through D.
Power supply backplane LED If the power supply backplane LED is illuminated, the power supply backplane has failed.
Systems Insight Display LEDs To view a quick reference for component identification and status, access the Systems Insight Display.
Item Description Status 10 PPM 2 LED Amber = Failure Off = Normal 11 Hot-plug fan LEDs Amber = Failure or fan is not installed Off = Normal 12 Internal system health LED Green = Normal (system on) Amber = System health is degraded Red = System health is critical Off = Normal (system off) 13 External system health LED (power supply) Green = Normal (system on) Amber = Redundant power supply failure Red = Power supply failure. No operational power supplies.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
Specification Value Rated input power 1500 W BTUs per hour 2730 Power supply output Rated steady-state power 800 W (low line), 1000 W (high line) Maximum peak power 1000 W (low line), 1200 W (high line) * 100 to 127 VAC is required for 10 A; 200 to 240 VAC is required for 6.7 A. Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.
Specification Value Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9 Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2 CD-ROM drive specifications Specification Value Disk formats CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA; Photo CD (single/multiple-session), CD-XA
Specification Value Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm Divergence angle 53.5° ± 1.5° Output power 0.
Acronyms and abbreviations ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache BIOS Basic Input/Output System DDR double data rate DIMM dual inline memory module FBDIMM fully buffered DIMM IDE integrated device electronics iLO 2 Integrated Lights-Out 2 IML Integrated Management Log LED light-emitting diode NIC network interface controller Acronyms and abbreviations 97
NMI non-maskable interrupt NVRAM non-volatile memory ORCA Option ROM Configuration for Arrays PCI Express Peripheral Component Interconnect Express PCI-X peripheral component interconnect extended POST Power-On Self Test PPM processor power module RAID redundant array of inexpensive (or independent) disks RBSU ROM-Based Setup Utility RDP Rapid Deployment Pack ROM read-only memory SAS serial attached SCSI SATA serial ATA SCSI small computer system interface Acronyms and abbreviations 98
SIM Systems Insight Manager SNMP Simple Network Management Protocol UID unit identification USB universal serial bus Acronyms and abbreviations 99
Index A AC power supply 83 access panel 33 air baffle 30, 45 ASR (Automatic Server Recovery) 75 Automatic Server Recovery (ASR) 75 Autorun menu 78 B battery 84 battery-backed write cache (BBWC) 73 battery-backed write cache cabling 73 BIOS upgrade 77 buttons 80 C cables 70 cabling 70, 74 cabling, BBWC 70 cabling, storage system 74 CD-ROM drive 72, 95 CD-ROM drive connectors 84 center wall 46 chassis ID switch 84 components 17, 21, 80 components, system board 84 connectors 74, 80, 84 CSR (customer self rep
LEDs, LEDs, LEDs, LEDs, power supply 90 SAS hard drive 87, 88 SATA hard drive 87, 88 Systems Insight Display 91 M management tools 75 mechanical components 17 media drive 48 media drive blank 47 memory boards 50 memory slots 84, 89 N network connector LEDs 83 NIC LEDs 81, 91 O Online ROM Flash Component Utility 77 ORCA (Option ROM Configuration for Arrays) 76 overtemperature LED 91 P part numbers 17, 21 PCI riser cage connector 84 power connectors, internal 84 power LEDs, system 81 Power On/Standby but
USB connectors 80 utilities 75 utilities, deployment 77, 78 V video connector 80 Index 102
