HP ProLiant DL585 G5/G6 server technology

cache and reduces coherence traffic overload on the HT links, resulting in faster queries in both

cache- and compute-intensive applications.

AMD Dual Dynamic Power Management™

AMD Opteron processors feature AMD Dual Dynamic Power Management. This feature powers the

processor core and memory controller voltage planes independently and delivers increased

performance and improved power management.

AMD Virtualization™ technology

AMD Virtualization (AMD-V) technology is a hardware-based feature that translates virtual to physical

memory addresses using Rapid Virtualization Indexing to provide increased performance and

reduced latency.

AMD Core Select

AMD Core Select uses the BIOS to select the number of software-visible cores per processor.

Compliant operating systems and applications can recognize the reduced core count which decreases

software licensing costs. This can improve performance of applications not written to make use of the

full number of processor cores in the system by giving them access to more cache and greater

memory bandwidth per thread. The DL585 G6 server has a ROM-Based Setup Utility (RBSU) option

(Advanced->Processor Options) that allows two different configurations:

 All cores enabled [default]

 Enable only half of the cores [half disabled] per socket

In a multi-processor configuration the number of active cores per processor must be equal.

Processor socket technology

The latest AMD Opteron processor packages use a processor socket technology called Land Grid

Array (LGA) to support higher CPU bus speeds. The processor package designs no longer have pins.

Instead, the processor package has pads of gold-plated copper that touch processor socket pins on

the motherboard.

The processors must be carefully installed to prevent damaging the delicate processor socket pins.

Because pin damage could require replacing the motherboard, HP engineers developed a special

installation tool to simplify processor installation and reduce the possibility of damaging the socket

pins (Figure 3).