HP ProLiant DL385p Gen8 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
© Copyright 2012, 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft®, Windows®, and Windows Server® are U.S.
Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ......................................................................................................................... 6 Illustrated parts catalog ............................................................................................................... 16 Mechanical components..............................................
Heatsink ................................................................................................................................................. 57 Processor ............................................................................................................................................... 59 DIMMs................................................................................................................................................... 63 System battery ..........................
Documentation feedback ........................................................................................................... 104 Index .......................................................................................................................................
Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory.
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti.
defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).
enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.
No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
Customer self repair 13
Customer self repair 14
Customer self repair 15
Illustrated parts catalog Mechanical components Item Description Spare part number Customer self repair (on page 6) 1 Access panel — — a) Access panel, 8 drive SFF, 8 drive LFF 691272-001 Mandatory1 b) Access panel, 25 drive SFF, 12 drive LFF* 691273-001 Mandatory1 Illustrated parts catalog 16
Item Description Spare part number Customer self repair (on page 6) 2 Fan cage 662518-001 Mandatory1 3 8 drive SFF front end — — a) 8 drive SFF front end, with cables, left and 696955-001 right ears (no backplane) b) 8 drive SFF backplane, with cables 670943-001 Optional2 696956-001 Optional2 696957-001 Optional2 691265-001 Optional2 7 8 drive LFF front end, with cables, left and right ears, with backplane 12 drive LFF front end, with cables, left and right ears, with backplane 25 drive
Item Description Spare part number Customer self repair (on page 6) 22 Friction rail kit* 662536-001 Mandatory1 23 Cable management arm (not supported with the friction rail kit)* 675606-001 Mandatory1 * Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional.
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant.
System components Item Description Spare part number Customer self repair (on page 6) System components — 24 Hot-plug fan 662520-001 25 Power supplies, hot-plug — — a) 460 W, 92% 511777-001 Mandatory1 b) 460 W, Platinum Plus, 94%* 660184-001 Mandatory1 c) 750 W, 92%* 511778-001 Mandatory1 d) 750 W, Platinum Plus, 94%* 660183-001 Mandatory1 e) 750 W 48V DC, 92%* 675038-001 Mandatory1 f) 1200 W, Platinum Plus, 94%* 660185-001 Mandatory1 Boards — — 26 System board assembly
Item 33 34 Description Spare part number Customer self repair (on page 6) b) HP 10GbE 2-port, 530FLR Adapter FIO Kit* 649869-001 Mandatory1 c) HP Ff 10Gb 2-port, 554FLR-SFP+ Adapter FIO Kit* 634026-001 Mandatory1 d) HP InfiniBand FDR/EN 10/40Gb 2-port, 544FLR-QSFP Adapter* e) HP InfiniBand QDR/EN 10Gb 2-port, 544FLR-QSFP Adapter* Memory 656090-001 Mandatory1 656091-001 Mandatory1 — — DIMMs — — a) 4-GB, 1Rx4 PC3U-10600R-9 687457-001 Mandatory1 b) 4-GB, 1Rx4 PC3L-10600R-9 687458-001
Item 35 36 37 Description Spare part number Customer self repair (on page 6) n) 2.80-GHz AMD Opteron processor 6320, 8c, 115W* o) 2.80-GHz AMD Opteron processor 6348, 12c, 115W* p) 2.80-GHz AMD Opteron processor 6386SE, 16c, 140W* q) 3.00-GHz AMD Opteron processor 6220, 115W* 705223-001 Optional2 705220-001 Optional2 705216-001 Optional2 662839-001 Optional2 r) 3.20-GHz AMD Opteron processor 6328, 8c, 115W* s) 3.
Item Description Spare part number Customer self repair (on page 6) d) 100-GB, LFF, MLC, 3G 653968-001 Mandatory1 e) 200-GB, LFF, MLC, 3G 653969-001 Mandatory1 f) 400-GB, LFF, MLC, 3G 653970-001 Mandatory1 Hot-plug solid state SAS* — — a) 200-GB, SFF, SLC 653961-001 Mandatory1 b) 200-GB, SFF, SC, MLC 691025-001 Mandatory1 c) 400-GB, SFF, SLC 653962-001 Mandatory1 d) 400-GB, SFF, MLC 653963-001 Mandatory1 e) 400-GB, SFF, SC, MLC 691026-001 Mandatory1 f) 800-GB, SFF, MLC 653964
Item Description Spare part number Customer self repair (on page 6) c) HP Smart Array P420 633538-001 Optional2 *Not shown **All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption. 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional.
Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant.
Removal and replacement procedures Required tools You need the following item for some procedures: • T-10/T-15 Torx screwdriver • HP Insight Diagnostics software ("HP Insight Diagnostics" on page 78) Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Extend the server from the rack (on page 27).
• Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode. This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown. • Use a virtual power button selection through HP iLO. This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.
Remove the server from the rack To remove the server from an HP, Compaq branded, telco, or third-party rack: 1. Power down the server (on page 26). 2. Extend the server from the rack (on page 27). 3. Disconnect the cabling and remove the server from the rack. For more information, refer to the documentation that ships with the rack mounting option. 4. Place the server on a sturdy, level surface.
2. After the display fully ejects, rotate the display downward to view the LEDs. Access the product rear panel Opening the cable management arm IMPORTANT: The cable management arm is not supported with the friction rail kit. To access the server rear panel: 1. Release the cable management arm.
2. Open the cable management arm. Note that the cable management arm can be right-mounted or left-mounted. Release the full-length expansion board retainer The air baffle has full-length expansion board retainers for both the primary and secondary PCIe riser cages. To release the components: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
5. Release the full-length expansion board retainers. To replace the component, reverse the removal procedure. Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices.
This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. To remove the component: 1.
7. Remove the air baffle. To install the component, reverse the removal procedure. 2U rack bezel To remove the component: Unlock the 2U rack bezel, press the latch on the 2U rack bezel, and then remove the 2U rack bezel. To replace the component, reverse the removal procedure. PCIe riser blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed.
To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 4. Remove the access panel ("Access panel" on page 32). 5. Remove the PCIe riser blank. To replace the component, reverse the removal procedure.
6. Remove the PCIe riser cage. To install the component, reverse the removal procedure. Remove the secondary PCIe riser cage CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCIe riser cage. To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
5. If a full-length expansion board is installed in slot 4, release the full-length expansion board retainer, and then remove the PCIe riser cage. To install the component, reverse the removal procedure. PCIe riser board To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
8. Remove the PCIe riser board. To replace the component, reverse the removal procedure. Drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Remove the drive blank. To replace the component, slide the component into the bay until it clicks. Hot-plug drive CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.
3. Remove the drive. To replace the component, reverse the removal procedure. Power supply blank Remove the blank. To replace the component, reverse the removal procedure. AC power supply CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it. To replace the component, reverse the removal procedure. Optical drive To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
7. Disconnect the optical drive cable. 8. Remove the optical drive. To replace the component, reverse the removal procedure. Power supply backplane To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove all power supplies ("AC power supply" on page 39).
4. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 5. Remove the access panel ("Access panel" on page 32). 6. Disconnect the SATA cable. 7. Remove the power supply backplane. To replace the component, reverse the removal procedure. Hot-plug fan The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server.
o The BIOS suspends the server for 5 minutes if it detects a cautionary temperature level. If the cautionary temperature level is still detected after 5 minutes, the BIOS performs an orderly shutdown and enters Standby mode. o The BIOS performs an orderly shutdown if two or more fans have failed. o The server performs an immediate shutdown if it detects a critical temperature level. IMPORTANT: An immediate shutdown is a hardware-controlled function and it overrides any firmware or software actions.
Fan cage To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 4. Remove the access panel ("Access panel" on page 32). 5. Remove the air baffle ("Air baffle" on page 33). 6. Remove the fan cage.
2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove any attached network cables. 4. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 5. Remove the access panel ("Access panel" on page 32). 6. Remove the primary PCIe riser cage (on page 35). 7. Loosen the thumbscrew. 8. Remove the existing FlexibleLOM.
To replace the component: 1. Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew. 2. Install the PCIe riser cage ("Remove the primary PCIe riser cage" on page 35). 3. Install the access panel ("Access panel" on page 32). 4. Slide the server into the rack. 5. Connect the LAN segment cables. 6. Connect each power cord to the server. 7. Connect each power cord to the power source. 8. Power up the server. SFF hard drive cage To remove the component: 1.
9. Remove the hard drive cage. To replace the component, reverse the removal procedure. Systems Insight Display To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 4. Remove the access panel ("Access panel" on page 32). 5.
c. Remove the Systems Insight Display. To replace the component, reverse the removal procedure. Front panel assembly To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the server from the rack (on page 28). 4. Remove the access panel ("Access panel" on page 32). 5. Remove the serial label pull tab, and retain it for the new front panel assembly.
6. Remove the air baffle ("Air baffle" on page 33). 7. Remove all drives ("Hot-plug drive" on page 38). 8. If installed, remove the optical drive ("Optical drive" on page 40). 9. Remove the fan cage ("Fan cage" on page 44). 10. Disconnect all cables from the front panel assembly. IMPORTANT: If any cables in the front panel assembly need replacing, the entire front panel assembly must be replaced. 11. Remove the four T-10 Torx screws from each side, and then remove the front panel assembly.
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMM pinout. Do not use the controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data. 1. Back up all data. 2. Close all applications. 3. Power down the server (on page 26). 4. Remove all power: a. Disconnect each power cord from the power source. b.
10. If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the connector on the top of the cache module. To replace the component, reverse the removal procedure. CAUTION: To prevent damage to the cache module during installation, be sure the cache module is fully inserted before pressing down. Flash-backed write cache capacitor pack To remove the component: 1. Back up all data. 2. Close all applications. 3. Power down the server (on page 26). 4.
8. If the capacitor pack is connected to the cache module, disconnect the capacitor pack cable from the connector on the top of the cache module. 9. Disconnect the SAS hard drive backplane ribbon cable, and then remove the right fan bracket. 10. Remove the capacitor pack.
o 8 LFF configuration o 12 LFF or 25 SFF configuration To replace the component, reverse the removal procedure. Recovering data from the flash-backed write cache If the server fails, use the following procedure to recover data temporarily stored in the FBWC. CAUTION: Before starting this procedure, read the information about protecting against electrostatic discharge ("Preventing electrostatic discharge" on page 31). 1.
o Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration. 2. Power down the failed server ("Power down the server" on page 26). 3. Transfer the drives from the failed server to the recovery server station. 4. Perform one of the following: 5.
8. Remove the expansion slot blank. To replace the component, reverse the removal procedure. Expansion boards Half-length expansion board WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. To remove the component: 1.
8. Remove the expansion board. To replace the component, reverse the removal procedure. Full length expansion board WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. To remove the component: 1. Power down the server (on page 26).
7. Release the full-length expansion board retainer, and then remove the PCIe riser cage. 8. Remove the full-length expansion board. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
6. Remove the heatsink. To replace the component: 1. Remove the thermal interface protective cover from the heatsink.
2. Install the heatsink. 3. Install the air baffle ("Air baffle" on page 33). 4. Install the access panel ("Access panel" on page 32). 5. Slide the server into the rack. 6. Connect each power cord to the server. 7. Connect each power cord to the power source. 8. Power up the server. Processor CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server.
6. Open the processor socket retaining bracket and the processor locking lever. 7. Using the processor tool, remove the processor from the system board. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. To replace a processor: IMPORTANT: Be sure the processor remains inside the processor installation tool.
1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area. 2. The processor fits one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Install the spare processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
3. Press the tabs on the processor tool to release the processor, and then remove the processor tool. 4. Close the processor socket retaining bracket and the processor locking lever. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 5. Clean the old thermal grease from the heatsink with the alcohol swab.
6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. 7. Install the heatsink. 8. Install the air baffle ("Air baffle" on page 33). 9. Install the access panel ("Access panel" on page 32). 10. Install the server into the rack. 11. Connect each power cord to the server. 12. Connect each power cord to the power source. 13. Power up the server.
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix these two types causes the server to halt during BIOS initialization. To identify the DIMMs installed in the server, see "DIMM slot locations (on page 91)." To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3.
To remove the component: 1. Power down the server (on page 26). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 4. Remove the access panel ("Access panel" on page 32). 5. If installed, remove the secondary PCIe riser cage (on page 36). 6.
7. Remove the PCIe riser cage ("Remove the primary PCIe riser cage" on page 35, "Remove the secondary PCIe riser cage" on page 36). 8. If installed, remove the secondary PCIe riser cage (on page 36). 9. If installed, remove the FBWC capacitor pack ("Flash-backed write cache capacitor pack" on page 51). 10. If installed, remove the cache module ("Flash-backed write cache module" on page 49). 11. Remove the FlexibleLOM ("FlexibleLOM" on page 44). 12. Remove all DIMMs ("DIMMs" on page 63). 13.
20. Remove the system board, using the handle to lift it out of the chassis. To replace the component: 1. Install the spare system board. 2. Prepare the processor socket on the spare system board.
a. Remove the processor socket protective cover. b. Open the processor retaining latch and the processor socket retaining bracket. 3. Install the processor socket cover onto the processor socket of the failed system board. 4. Install the processor on the spare system board. IMPORTANT: Be sure the processor remains inside the processor installation tool.
5. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area. 6. The processor fits one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Install the spare processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
7. Press the tabs on the processor tool to release the processor, and then remove the processor tool. 8. Close the processor socket retaining bracket and the processor locking lever. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 9. Clean the old thermal grease from the heatsink with the alcohol swab.
10. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. 11. Install the heatsink. IMPORTANT: Install all components with the same configuration that was used on the failed system board. 12. Install all components removed from the failed system board. 13. Install the access panel ("Access panel" on page 32). 14. Install the power supplies ("AC power supply" on page 39). 15. Power up the server.
3. Select Service Options. 4. Select Serial Number. The following warning appears: Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis. 5. Press the Enter key to clear the warning. 6. Enter the serial number and press the Enter key. 7. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified service personnel.
2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Extend ("Extend the server from the rack" on page 27) or remove ("Remove the server from the rack" on page 28) the server from the rack. 4. Remove the access panel ("Access panel" on page 32). 5. Remove the air baffle ("Air baffle" on page 33). 6. Remove the fan cage ("Fan cage" on page 44). 7.
Cabling SAS hard drive cabling • SFF hard drive cabling • SFF cabling, with optional drive cage Cabling 74
• LFF hard drive cabling Optical drive cabling Cabling 75
FBWC cabling • 8 or 16 drive SFF • 8 drive LFF Cabling 76
• 12 LFF or 25 SFF • PCIe option Depending on the server configuration, you may need to remove the primary PCIe riser cage (on page 35) before cabling to a PCIe expansion board.
Diagnostic tools Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 78) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos).
USB support and functionality USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM. Legacy USB support provides USB functionality in environments where USB support is not available normally.
Component identification Front panel components • 8 drive SFF configuration Item Description 1 Video connector 2 Quick release levers (2) 3 SATA optical drive bay 4 SFF drive bays 5 Serial number label 6 USB connectors (2) 7 Systems Insight Display • 16 drive SFF configuration (with optional drive cage) Item Description 1 Video connector Component identification 81
Item Description 2 Drive bays (box 1) 3 Drive bays (box 2) 4 Systems Insight Display 5 USB connectors (2) • 25 SFF drive configuration Item Description 1 Video connector 2 Quick release levers (2) 3 Drive bays 4 USB connector • 8 drive LFF configuration Item Description 1 Video connector 2 Quick release levers (2) 3 Drive bays 4 Systems Insight Display 5 USB connector Component identification 82
• 12 drive LFF configuration Item Description 1 Video connector 2 Quick release levers (2) 3 Drive bays 4 USB connector Front panel LEDs and buttons • SFF Component identification 83
• LFF Item Description Status 1 NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 2 Health LED Solid green = Normal Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-flashing red (4 Hz/cycles per sec) = Power fault* 3 Power On/Standby button and system power LED Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby
Systems Insight Display LEDs The HP Systems Insight Display LEDs represent the system board layout. The display, available on 8 SFF, 16 SFF, and 8 LFF configurations, enables diagnosis with the access panel installed. Item Description Status 1 Power cap Off = System is in standby, or no cap is set. Solid green = Power cap applied 2 NIC link/activity Off = No link to network. If the power is off, view the rear panel RJ-45 LEDs for status.
Systems Insight Display LED combinations When the health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED indicate system status. Systems Insight Display Health LED LED and color Processor (amber) Red System power LED Status Amber One or more of the following conditions may exist: • • • • Processor in socket X has failed.
Rear panel components Item Description 1 PCIe slots 1–3 (top to bottom) 2 PCIe slots 4–6, optional (top to bottom) 3 Power supply 1 (PS1) 4 PS1 power connector 5 PS2 power connector, optional 6 Power supply 2 (PS2), optional 7 USB connectors (4) 8 Video connector 9 iLO connector 10 Serial connector 11 FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on right side Rear panel LEDs and buttons Item Description Status 1 UID LED/button Off = Deactivated Solid blue = Activa
Item Description Status 2 Power supply 2 LED Off = System is off or power supply has failed. Solid green = Normal 3 Power supply 1 LED Off = System is off or power supply has failed.
System board components Item Description 1 Fan connector 6 2 Systems Insight Display connector 3 Fan connector 5 4 Processor 1 DIMM slots 5 Fan connector 4 6 Front I/O connector 7 Front USB connector 8 Fan connector 3 9 First drive cage 10 Fan connector 2 11 Processor 2 DIMM slots 12 Second drive cage 13 Fan connector 1 14 NMI jumper 15 Front video connector 16 Discovery services connector 17 System maintenance switch 18 SATA optical drive connector 19 SATA drive port
Item Description 22 SD card slot 23 Secondary (processor 2) PCIe riser connector 24 Processor 2 socket 25 System battery 26 TPM connector 27 Primary (processor 1) PCIe riser connector 28 Processor 1 socket 29 FlexibleLOM 30 SAS port 1i 31 SAS port 2i 32 SAS cache module connector System maintenance switch Position Default Function S1 Off Off = HP iLO security is enabled. On = HP iLO security is disabled. S2 Off Off = System configuration can be changed.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.
• 16 SFF device bay numbering • 25 SFF device bay numbering • 8 LFF device bay numbering • 12 LFF device bay numbering Component identification 92
Drive LED definitions Item LED Status 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives.
Status On = AC power is connected. Off = AC power is disconnected. Missing = Riser cage is not installed, or power might not be connected. FBWC module LEDs (P222, P420, P421) The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing.
1 - Amber 2 - Green 3 - Green Interpretation Off Off Off The cache module is not powered. Off Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller. Off Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor pack is charging. Off Off Flashing 1 Hz The cache module is idle, and the capacitor pack is charging.
For a single-processor configuration, four fans and two blanks are required in specific fan bays for redundancy. A fan failure or missing fan causes a loss of redundancy. A second fan failure or missing fan causes an orderly shutdown of the server. Installing more than the required number of fans in a single-processor configuration is not a supported configuration. For a dual-processor configuration, six fans are required for redundancy. A fan failure or missing fan causes a loss of redundancy.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -30°C to 50°C (-22°F to 122°F) Storage -30°C to 60°C (-22°F to 140°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Non-operating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
• HP 750 W CS Platinum Plus power supply (94% efficiency) (on page 99) • HP 750 W 48V CS DC power supply (94% efficiency) (on page 100) • HP 1200 W CS Platinum Plus power supply (90% efficiency) (on page 100) For detailed power supply specifications, see the quickspecs on the HP website (http://h18000.www1.hp.com/products/quickspecs/14209_div/14209_div.html).
input HP 750 W CS Gold power supply (92% efficiency) Specification Value Input requirements — Rated input voltage 100V to 240V AC Rated input frequency 50 to 60 Hz Rated input current 8.9A to 3.
HP 750 W 48V CS DC power supply (94% efficiency) Specification Value Input requirements — Rated input voltage -36V to -72V DC -48V DC, nominal input Rated input frequency DC Rated input current 2.
Rated input frequency 50 Hz to 60 Hz Rated input current 9.1A to 5.
Acronyms and abbreviations FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log NMI nonmaskable interrupt NVRAM nonvolatile memory PCIe peripheral component interconnect express POST Power-On Self Test RBSU ROM-Based Setup Utility SAS serial attached SCSI SATA serial ATA SR semi-rigid STR straight (connector) Acronyms and abbreviations 102
TPM Trusted Platform Module UID unit identification USB universal serial bus Acronyms and abbreviations 103
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Index 1 150W PCIe power cable 72 A AC power supply 39, 98, 99, 100 access panel 32 air baffle 33 B battery 64 blue screen event 90 buttons 81 C cable management arm 29 cables 74 cabling 74, 75 cautions 32 chipset SATA cable 72 components 16, 26, 81 components, identification 16, 81 connectors 81 crash dump analysis 90 CSR (customer self repair) 6 customer self repair (CSR) 6 D data recovery 53 diagnostic tools 78 diagnostics utility 78 DIMM slot locations 91 DIMMs 63, 91 drive LEDs 93 drives 38, 93 E e
LEDs, SAS hard drive 93 LEDs, troubleshooting 93 M management tools 78 mechanical components 16 mechanical specifications 97 memory dump 90 N NIC connectors 87 NMI header 90 O operating system crash 90 optical drive 40, 81 optical drive cable 75 P part numbers 16 PCI expansion slot definitions 88 PCI expansion slots 88 PCIe riser blank 34 PCIe riser cage 35, 36 power cables 72 power supplies 39, 97, 98, 99, 100 power supply 39 power supply backplane 41 power supply blank 39 power supply specifications 9
