ISS Technology Update, Volume 7 Number 2 - Newsletter

ISS Technology Update Volume 7, Number 2

Figure 3-3. The processor heat sink that uses the fully ducted

design (left) is more compact than a traditional heat sink in a

1U rack-mount server (right).

This innovative design opens new opportunities for system

designers. For instance, PARSEC architecture empowered

engineers to design heat sinks that closely match the

requirements of particular server blades and processor

architectures. Such was the case for the Intel

Xeon

based HP

BladeSystem BL460c server blade. In this server, HP engineers

were able to use a more compact processor heat sink than that

used in traditional 1U rack-mount servers (Figure 3-3). The new

heat sinks incorporate vapor chamber bases, thinner fins, and

tighter fin pitch than previous designs. This results in the largest

heat transfer surface in the smallest possible package. The

smaller heat sink allows more space for full-size DIMM sockets

and hot plug hard drives for the server blade.

PARSEC architecture and Active Cools fans are only two of the

HP Thermal Logic technologies that enable HP BladeSystems to

significantly reduce the power consumption and required

airflow for data centers. For more information on HP Thermal

Logic technologies, visit

http://h71028.www7.hp.com/enterprise/cache/461770-0-

0-0-121.html?jumpid=go/bladesystem/thermallogic.

Additional resources

For additional information on the topics discussed in this article, visit the following URLs:

Resource URL

“HP BladeSystem c3000 Enclosure

technologies” technology brief

http://h20000.www2.hp.com/bc/docs/support/SupportMa

nual/c01204885/c01204885.pdf

“HP BladeSystem C7000 Enclosure

Technologies, 2nd Edition”

technology brief

http://h20000.www2.hp.com/bc/docs/support/SupportMa

nual/c00816246/c00816246.pdf.

“Power and Cooling in the Data

Center” article by Wade Vinson

www.sustainablefacility.com/CDA/Archives_EPM/BNP_GUI

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