ISS Technology Update, Volume 7 Number 2 - Newsletter

ISS Technology Update Volume 7, Number 2
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Figure 3-1. Rear view of the HP BladeSystem c7000 self-sealing enclosure
Air ducting in the enclosures optimizes cooling capacity using unique mechanical designs (Figure 3-2). Cool air is pulled
through slots in the front of the enclosure (A). The air moves to the interconnect modules in the rear of the enclosure, and then
into the central plenum where it mixes with the servers’ airflow. The exhaust air exits through the fans at the rear of the
enclosure. Power supplies located on the bottom (B) pull air straight through the enclosure using their own fans. Air is drawn
into the front of half-height (HH) and full-height (FH) servers into the central plenum and then through the fans(C) to be exhausted
at the rear.
Figure 3-2. Air ducting in the c7000 BladeSystem enclosure (side view)