HP 3PAR CIM API Programming Reference (QL226-97722, March 2014)

// ==================================================================
// ProcessorForNode
// ==================================================================
[Association, Aggregation, Composition,
Description (
"NodeCPU aggregated by a NodeSystem.")]
class TPD_ProcessorForNode : CIM_SystemDevice {
[Aggregate, Override ( "GroupComponent" ), Min ( 1 ), Max ( 1 ),
Description (
"The parent Node in the Association.")]
TPD_NodeSystem REF GroupComponent;
[Override ( "PartComponent" ), Weak, Description (
"The NodeCPU that is a component of a Node.")]
TPD_NodeCPU REF PartComponent;
};
// ==================================================================
// TPD Physical Memory (DIMM)
// ==================================================================
[Description (
"HP 3PAR DIMM in Controller Node.")]
class TPD_PhysicalMemory : CIM_PhysicalMemory
{
[Description ("Slot number, memory is inserted in.") ]
uint16 Slot;
[Description ("Slot ID, memory is inserted in.") ]
string SlotID;
[Description ("Type of the cache memory is used for."),
ValueMap {"0", "1"},
Values {"Control (CPU)", "Data (Cluster)"} ]
uint16 CacheType;
[Description ("Single or double sided. Not supported yet."),
ValueMap {"0"},
Values {"Unknown"} ]
uint16 SideType;
[Description ("Standard or stacked chips. Not supported yet."),
ValueMap {"0"},
Values {"Unknown"} ]
uint16 ChipsType;
[Description ("CAS latency. Format: CL
<min>/
<max>, in nS.") ]
string CASLatency;
[Description ("JEDEC ID.") ]
string JedecID;
[Description ("Revision code.") ]
string Revision;
};
// ==================================================================
// TPD NodePackagedMemory
// ==================================================================
[Association, Aggregation, Description (
"A Physical Memory contained by a Node PhysicalPackage.")]
class TPD_NodePackagedMemory : CIM_PackagedComponent {
272 Managed Object Format Files