Administrator's Guide

Table 12 Messaging system replaceable parts (continued)
Replacement type (Cold,
Warm, Hot)CSR availabilityPart numberReplaceable unit (RU)Item
WarmOptional
1
AJ763AHP 82E HBA (Emulex)(Not shown)
WarmOptional
1
AJ764AHP 82Q HBA (Q-Logic)(Not shown)
1
Used only for backup. See www.hp.com/go/ebs for information about tested backup applications.
For more information on removing and replacing components, see Table 13 (page 73) for a list
of individual component documents.
Table 13 Related component documents
GuideComponent nameComponent
HP ProLiant BL460c G7 Server Blade Maintenance
and Service Guide
E5460sb bladesServer blade
HP D2600/D2700 Disk Enclosure User GuideHP E5000 Messaging System 12 TB expansion
disk enclosure and HP E5000 Messaging System
24 TB expansion disk enclosure
Disks in
expansion disk
enclosures
Hot, warm, and cold swap components
Hot or warm swapping a component means removing and replacing it while the main power is
still on. Cold swapping means removing and replacing the component while the main power is
off. Port (purple) colored handles on components like the fan module indicate the component is
hot-swappable.
IMPORTANT: Remove and replace components quickly without interrupting the process.
Preventing electrostatic discharge
CAUTION: Components can be damaged by electrostatic discharge (ESD). Use proper antistatic
protection.
• Always transport and store CSR replaceable parts in an ESD-protective enclosure.
• Do not remove CSR replaceable parts from the ESD-protective enclosure until you are ready
to install it.
• Always use ESD precautions, such as a wrist strap, heel straps on conductive flooring, and
an ESD-protective smock when handling ESD-sensitive equipment.
• Avoid touching all connector pins, leads, or circuitry.
• Do not place ESD-generating material such as paper or non-antistatic (pink) plastic in an
ESD-protective with ESD-sensitive equipment.
Verifying component failure
Use the following methods to verify component failure:
• Analyze any failure messages received. Fault monitoring software from HP provides a
recommended action.
• From the System Manager, select the System Summary tab to check the enclosure health status
or select the Hardware Status tab to identify a failed component. See “Using the System
Manager” (page 42) for more information.
• You can also use the System Management Homepage to identify hardware problems. For
example, to identify the affected enclosure, select Unit Identification Device in the Enclosure
pane and then on the Unit Identification Device window, click On. The blue UID indicator on
Hot, warm, and cold swap components 73