Data Sheet

Preliminary Specification Number : SP-8D1VF-H
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
1. SCOPE
This specification is applied to the IEEE802.11a/b/g/n/ac/ax W-LAN + BT5.1 combo module.
2. KEY FEATURE
- Qualcomm QCA6390 inside
- Compliant with IEEE802.11a/b/g/n/ac/ax
- Supports W-LAN 2*2 MU-MIMO
- DBS(Dual band simultaneous) with dual MAC, up to 1774.5Mbps data rate (2*2 + 2*2, 11ax DBS)
- Compliant with BT specification
- 5G Rx Splitters inside for ANT sharing w/LAA
- Surface mount type 8.75 x 7.0 mm (Typical), H = 1.1 mm (Max)
- Extreme size efficient dual side mount structure with conformal shield.
- Weight : 0.19g
- MSL : 3
2.1. Block Diagram
2.2. Ordering Information
Ordering Part Number
Description
LBEE58D1VF-TEMP
In case of sample order
LBEE58D1VF-TEMP-D
EVK
2.3. RoHS Compliance
This module is compliant with the RoHS directive.