Data Sheet

Preliminary Specification Number : SP-8D1VF-H
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
TABLE OF CONTENTS
1. SCOPE ..................................................................................................................................................... 3
2. KEY FEATURE ...................................................................................................................................... 3
2.1. Block Diagram .......................................................................................................................... 3
2.2. Ordering Information ............................................................................................................... 3
2.3. RoHS Compliance ..................................................................................................................... 3
3. ABSOLUTE MAXIMUM RATINGS ...................................................................................................... 4
4. OPERATING CONDITION ................................................................................................................... 4
5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 5
5.1. Dimensions ............................................................................................................................... 5
5.2. Pin Layout ................................................................................................................................. 7
5.3. Module PIN Descriptions ....................................................................................................... 10
6. POWER OF SEQUENCE ..................................................................................................................... 14
7. REFERENCE CIRCUIT....................................................................................................................... 15
8. ELECTORICAL CHARACTERISTICS (Chain 0/1) ........................................................................... 16
8.1. DC/RF Characteristics for IEEE802.11b - 2.4GHz .............................................................. 16
8.2. DC/RF Characteristics for IEEE802.11g - 2.4GHz .............................................................. 16
8.3. DC/RF Characteristics for IEEE802.11n - 2.4GHz .............................................................. 17
8.4. DC/RF Characteristics for IEEE802.11ax - 2.4GHz ............................................................ 17
8.5. DC/RF Characteristics for IEEE802.11a - 5GHz ................................................................. 18
8.6. DC/RF Characteristics for IEEE802.11n(HT 20/40MHz) - 5GHz ....................................... 18
8.7. DC/RF Characteristics for IEEE802. 11ac (VHT20/VHT40/VHT80) - 5GHz .................... 20
8.8. DC/RF Characteristics for IEEE802. 11ax (HE20/HE40/HE80) - 5GHz ........................... 21
8.9. DC/RF Characteristics for Bluetooth .................................................................................... 22
8.10. DC/RF Characteristics for Bluetooth（LE） .................................................................... 23
9. LAND PATTERN (TOP VIEW) ............................................................................................................ 24
10. TAPE AND REEL PACKING ........................................................................................................... 25
11. NOTICE ............................................................................................................................................. 28
11.1. Storage Conditions: ............................................................................................................ 28
11.2. Handling Conditions: ......................................................................................................... 28
11.3. Standard PCB Design (Land Pattern and Dimensions): ................................................. 28
11.4. Notice for Chip Placer: ....................................................................................................... 28
11.5. Soldering Conditions: ......................................................................................................... 29
11.6. Cleaning: ............................................................................................................................. 29
11.7. Operational Environment Conditions: .............................................................................. 29
11.8. Input Power Capacity: ........................................................................................................ 30
12. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 31
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of
Murata products and disclaimers thereto appears at the end of this specification sheet.