Data Sheet

ManualsBrandsHP ManualsElectronicsWireless Module LBEE58D1VF

Preliminary Specification Number : SP-8D1VF-H

Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

W-LAN+Bluetooth Combo Module Data Sheet

Qualcomm Chipset QCA6390

for IEEE802.11a/b/g/n/ac/ax 2*2 MIMO + BT 5.1

Sample P/N : LBEE58D1VF-TEMP

Summary of content (32 pages)

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Preliminary Specification Number : SP-8D1VF-H W-LAN+Bluetooth Combo Module Data Sheet Qualcomm Chipset QCA6390 for IEEE802.11a/b/g/n/ac/ax 2*2 MIMO + BT 5.1 Sample P/N : LBEE58D1VF-TEMP Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 1 / 31 The revision history of the product specification Revised No. - Revised Date 2019.3.5 A 2019.3.29 B 2019.5.29 C 2019.6.3 D 2019.7.1 E 2019.8.23 F 2019.9.10 G 2019.12.15 H 2019.12.26 Note Initial Release 2.1 Block Diagram Updated 3. ABSOLUTE MAXIMUM RATINGS Updated 4. OPERATING CONDITION Updated 5.1 Dimensions Update and 5.2 Pin Layput updated 9. LAND PATTERN (TOP VIEW) Updated Added 5.3. Module PIN Descriptions Added 6.
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Preliminary Specification Number : SP-8D1VF-H 2 / 31 TABLE OF CONTENTS 1. 2. SCOPE ..................................................................................................................................................... 3 KEY FEATURE ...................................................................................................................................... 3 2.1. 2.2. 2.3. 3. 4. 5. Block Diagram ......................................................................................
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Preliminary Specification Number : SP-8D1VF-H 3 / 31 1. SCOPE This specification is applied to the IEEE802.11a/b/g/n/ac/ax W-LAN + BT5.1 combo module. 2. KEY FEATURE - Qualcomm QCA6390 inside - Compliant with IEEE802.11a/b/g/n/ac/ax - Supports W-LAN 2*2 MU-MIMO - DBS(Dual band simultaneous) with dual MAC, up to 1774.5Mbps data rate (2*2 + 2*2, 11ax DBS) - Compliant with BT specification - 5G Rx Splitters inside for ANT sharing w/LAA - Surface mount type 8.75 x 7.0 mm (Typical), H = 1.
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Preliminary Specification Number : SP-8D1VF-H 4 / 31 3. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature RFA0P8_LDO_IN RFA12_LDO_IN RFA17_LDO_IN PCIE0P92_LDO_IN PCIE18_LDO_IN CX_MX_BT_LDO_IN Supply Voltage AON_RFACMN_LDO_IN VDD18_DIG_IO VPH_PA_2G_CH0, VPH_PA_2G_CH1, VPH_PA_5G_CH0, VPH_PA_5G_CH1 min. -40 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 max. 85 Vddx+0.2 Vddx+0.2 Vddx+0.2 Vddx+0.2 Vddx+0.2 Vddx+0.2 Vddx+0.2 Vddx+0.2 Unit deg.C V V V V V V V V -0.3 5.
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Preliminary Specification Number : SP-8D1VF-H 5 / 31 5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS 5.1. Dimensions Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 6 / 31 (Marking information) Lot No Module Type 2D code Murata Logo 1pin mark Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 7 / 31 5.2. Pin Layout Address A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 X 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.325 0.775 0.775 0.775 0.775 0.775 0.775 0.775 0.775 0.775 0.775 0.775 0.775 0.775 Y 0.35 0.8 1.25 1.7 2.15 2.6 3.05 3.5 3.95 4.4 4.85 5.3 5.75 6.2 6.65 0.35 0.8 1.25 1.7 2.15 2.6 3.05 3.5 3.95 4.4 4.85 5.3 5.
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Preliminary Specification Number : SP-8D1VF-H 8 / 31 B14 B15 C1 C2 C14 C15 D1 D2 D14 D15 E1 E2 E14 E15 F1 F2 F14 F15 G1 G2 G14 G15 H1 H2 H14 H15 J1 J2 J14 J15 K1 K2 K14 K15 L1 L2 L14 L15 M1 M2 M14 M15 N1 N2 N14 N15 P1 P2 P14 P15 Q1 0.775 0.775 1.225 1.225 1.225 1.225 1.675 1.675 1.675 1.675 2.125 2.125 2.125 2.125 2.575 2.575 2.575 2.575 3.025 3.025 3.025 3.025 3.475 3.475 3.475 3.475 3.925 3.925 3.925 3.925 4.375 4.375 4.375 4.375 4.825 4.825 4.825 4.825 5.275 5.275 5.275 5.275 5.725 5.725 5.725 5.725 6.
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Preliminary Specification Number : SP-8D1VF-H 9 / 31 Q2 Q14 Q15 R1 R2 R14 R15 S1 S2 S14 S15 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 V1 V2 V3 V4 V5 V6 V7 V8 V9 V10 V11 V12 V13 V14 V15 6.625 6.625 6.625 7.075 7.075 7.075 7.075 7.525 7.525 7.525 7.525 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 7.975 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 8.425 0.8 6.2 6.65 0.35 0.8 6.2 6.65 0.35 0.8 6.2 6.65 0.35 0.8 1.25 1.7 2.
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Preliminary Specification Number : SP-8D1VF-H 10 / 31 5.3. Module PIN Descriptions No.
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Preliminary Specification Number : SP-8D1VF-H 11 / 31 C2 GND GND C14 P C15 AON_RFACMN_LDO _IN GND GND - D1 LF_CLK_IN I/O GPIO GPIO_14 D2 PCIE_RST# I/O GPIO GPIO_57 D14 GND GND - D15 RFA17_LDO_IN P E1 I/O GPIO I/O GPIO GPIO_7 E14 BT_I2S0_SDO/EDL_ MODE BT_I2S0_SCK/BT_SL IMBUS_CLK CLK_REQ_IN VDD19_PMU_ RFA_I GPIO_6 E15 GND GND - F1 I/O GPIO GPIO_4 F2 BT_I2S0_SDI/BT_SLI MBUS_DATA BT_I2S0_WS I/O GPIO GPIO_5 F14 GND GND - F15 WLAN_EN I G1 BT_SENS_RXD I/O G
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Preliminary Specification Number : SP-8D1VF-H 12 / 31 M14 I/O GPIO GPIO_47 I/O GPIO GPIO_56 I/O GPIO GPIO_11 N2 GPS_COEX/PBL_BO OTSPEED_0 CLK_REQ_OUT/PBL _FAST_BOOT COEX_TXD/BOOT_F ROM_ROM COEX_RXD I/O GPIO GPIO_10 N14 WL_UART_RXD I/O GPIO GPIO_49 N15 WL_UART_RTS/PBL_ AUTH_EN HST_SLM_CH0_CTL 0/CLK_REQ_0 HST_SLM_CH0_CTL 1/CLK_REQ_1 GND I/O GPIO GPIO_52 I/O GPIO GPIO_36 I/O GPIO GPIO_37 GND - I/O GPIO GPIO_50 I/O GPIO GPIO_38 I/O GPIO GPIO_39 Q14 WL_UART_TXD/WD OG_DI
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Preliminary Specification Number : SP-8D1VF-H 13 / 31 T13 GND GND - T14 GND GND - T15 GND GND - V1 GND GND - V2 GND GND - V3 VPH_PA_2G_CH0 P V4 GND GND - V5 2G_CH0 RF RF V6 GND GND - V7 GND GND - V8 5G_CH0 RF RF V9 GND GND - V10 RF RF V11 5G_CH1_LTE-U_RX_ AS GND GND - V12 VPH_PA_2G_CH1 P V13 GND GND - V14 5G_CH1 RF RF V15 GND GND - Power from Battery for 2G_CH0_PA ANT ANT Antenna sharing 5G_CH1 and LTE-U Power from Battery for 2G_CH1_PA A
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Preliminary Specification Number : SP-8D1VF-H 14 / 31 6. POWER OF SEQUENCE Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 15 / 31 7. REFERENCE CIRCUIT Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 16 / 31 8. ELECTORICAL CHARACTERISTICS (Chain 0/1) 8.1. 8.2. DC/RF Characteristics for IEEE802.11b - 2.4GHz Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” 11Mbps mode unless otherwise specified. Items Contents Specification IEEE802.11b-2.4GHz Mode CCK Channel frequency (spacing) 2412 to 2472 MHz (5MHz) Current Consumption Min. Typ. Max. (a) Tx mode 350 (b) Rx mode 90 Transmitter Min. Typ. Max.
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Preliminary Specification Number : SP-8D1VF-H 17 / 31 8.3. DC/RF Characteristics for IEEE802.11n - 2.4GHz Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” 65Mbps (MCS7) mode unless otherwise specified. Items Contents Specification IEEE802.11n-2.4GHz Mode OFDM Channel frequency (spacing) 2412 to 2472 MHz (5MHz) Current Consumption Min. Typ. Max. (a) Tx mode 300 (b) Rx mode 90 Transmitter Min. Typ. Max. Power Levels (Power setting :16dBm) 13.5 16 18.
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Preliminary Specification Number : SP-8D1VF-H 18 / 31 8.5. 8.6. DC/RF Characteristics for IEEE802.11a - 5GHz Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” 54Mbps mode unless otherwise specified. Items Contents Specification IEEE802.11a-5GHz Mode OFDM Channel frequency (spacing) 5180MHz to 5825MHz Current Consumption min. Typ. Max. (a) Tx mode 360 (b) Rx mode 100 Transmitter min. Typ. Max. Power Levels (Power setting : 18dBm) 15.5 18 20.
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Preliminary Specification Number : SP-8D1VF-H 19 / 31 8.7. DC/RF Characteristics for IEEE802.11n(HT40MHz) - 5GHz Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” MCS7 mode unless otherwise specified. Items Contents Specification IEEE802.11n-5GHz Mode OFDM Channel frequency 5190MHz to 5795MHz Current Consumption min. Typ. Max. (b) Tx mode 300 (b) Rx mode 100 Transmitter min. Typ. Max. Power Levels(Power setting : 16dBm) 13.5 16 18.
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Preliminary Specification Number : SP-8D1VF-H 20 / 31 8.8. DC/RF Characteristics for IEEE802. 11ac (VHT80) - 5GHz Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” MCS9 mode unless otherwise specified. Items Contents Specification IEEE802.11ac-5GHz Mode OFDM Channel frequency (spacing) 5210MHz to 5775MHz Current Consumption min. Typ. Max. (a) Tx mode 320 (b) Rx mode 100 Transmitter min. Typ. Max. Power Levels (Power setting : 15dBm) 12.5 15 17.
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Preliminary Specification Number : SP-8D1VF-H 21 / 31 8.9. DC/RF Characteristics for IEEE802. 11ax (HE80MHz) - 5GHz Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” MCS11 mode unless otherwise specified. Items Contents Specification IEEE802.11ax-5GHz Mode OFDM Channel frequency (spacing) 5210MHz to 5775MHz Current Consumption min. Typ. Max. (a) Tx mode 370 (b) Rx mode 120 Transmitter min. Typ. Max. Power Levels (Power setting : 14dBm) 11.5 14 16.
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Preliminary Specification Number : SP-8D1VF-H 22 / 31 8.10. DC/RF Characteristics for Bluetooth Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” Items Contents Bluetooth specification (power class) Class1 Channel frequency (spacing) 2402 to 2480 MHz Transmitter Min. Typ. Max. BDR (PL 10) 12 19 Output Power EDR (PL 10) 8.5 15.5 Frequency range 2400 2483.
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Preliminary Specification Number : SP-8D1VF-H 23 / 31 8.11. DC/RF Characteristics for Bluetooth（LE） Normal Condition : 25deg.C, Supply voltage is typ value in ”4. operating condition” Items Contents Bluetooth specification (power class) LE Channel frequency (spacing) 2402 to 2480 MHz Number of RF Channel 40 Item / Condition Min. Typ. Max. Center Frequency 2402 2480 Channel Spacing 2 Number of RF channel 40 Output power (PL 9) 4.5 11.5 Modulation Characteristics 1) Δf1avg 225 275 2) Δf2max (at 99.
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Preliminary Specification Number : SP-8D1VF-H 24 / 31 9. LAND PATTERN (TOP VIEW) Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 25 / 31 10. TAPE AND REEL PACKING 2.0±0.1 4.0±0.1  1.5+0.1/-0 0.30±0.05 11.5±0.1 9.05±0.05 24.0±0.3 1.75±0.1 (1) Dimensions of Tape (Plastic tape)  2.0+0.1/-0 12.0±0.1 7.3±0.05 1.3 max. feeding direction Unit:mm *1 Cumulative tolerance 10 pitches of the sprocket hole is ± 0.2mm. (2) Dimensions of Reel 25.4±1.0 13.0±0.2 30.4 max. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co.
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Preliminary Specification Number : SP-8D1VF-H 26 / 31 (3) Taping Diagrams [1] Feeding Hole : [2] Hole for chip : [3] Cover tape : [4] Base tape : As specified in (1) As specified in (1) 62 um in thickness As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip (4) Leader and Tail tape Tail tape (No components) Components No components Leader tape (Cover tape alone) 40 to 200 mm 160 mm min. 230 mm min.
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Preliminary Specification Number : SP-8D1VF-H 27 / 31 -The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. -The cover tape and base tape are not adhered at no components area for 250 mm min. -Tear off strength against pulling of cover tape: 5 N min. -Packaging unit: 2000 pcs/ reel - Material: Base tape: Plastic Reel : Plastic Cover tape, cavity tape and reel are made the anti-static processing. - Peeling of force: 1.1N max.
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Preliminary Specification Number : SP-8D1VF-H 28 / 31 11. NOTICE 11.1. Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used.
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Preliminary Specification Number : SP-8D1VF-H 29 / 31 11.5. Soldering Conditions: The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C. Contact Murata before use if concerning other soldering conditions.
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Preliminary Specification Number : SP-8D1VF-H 30 / 31 11.8. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Preliminary & Confidential < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.
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Preliminary Specification Number : SP-8D1VF-H 31 / 31 12. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product.