Site Preparation Guide, HP Integrity rx8640, HP 9000 rp8440 Servers HP Part Number: AB297–9014A Published: September 2007 Edition: Fourth Edition
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Table of Contents About This Document.........................................................................................................9 Book Layout............................................................................................................................................9 Intended Audience.................................................................................................................................9 Publishing History.................................................
Bulk Power Supply Cooling.......................................................................................................38 PCI/Mass Storage Section Cooling.............................................................................................38 Standby Cooling.........................................................................................................................38 Typical HP Integrity rx8640 Server Power Dissipation and Cooling..............................................
List of Figures 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 1-9 1-10 1-11 1-12 1-13 2-1 A-1 A-2 A-3 A-4 16-Socket Server Block Diagram...................................................................................................14 Server (Front View With Bezel).....................................................................................................15 Server (Front View Without Bezel)................................................................................................15 Server (Rear View)...
List of Tables 1-1 1-2 1-3 1-4 1-5 1-6 1-7 1-8 1-9 1-10 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 2-10 2-11 Cell Board CPU Module Load Order............................................................................................19 DIMM Sizes Supported.................................................................................................................20 DIMM Load Order........................................................................................................................
About This Document This document covers the HP Integrity rx8640 and the HP 9000 rp8440 server systems. This document does not describe system software or partition configuration in any detail. For detailed information concerning those topics, refer to the HP System Partitions Guide: Administration for nPartitions.
Related Information You can access other information on HP server hardware management, Microsoft® Windows® administratuon, and diagnostic support tools at the following Web sites: http://docs.hp.com The main Web site for HP technical documentation is http://docs.hp.com. Server Hardware Information: http://docs.hp.com/hpux/hw/ The http://docs.hp.com/hpux/hw/ Web site is the systems hardware portion of docs.hp.com.
Windows Operating System Information You can find information about administration of the Microsoft® Windows® operating system at the following Web sites, among others: • http://docs.hp.com/windows_nt/ • http://www.microsoft.com/technet/ Diagnostics and Event Monitoring: Hardware Support Tools Complete information about HP hardware support tools, including online and offline diagnostics and event monitoring tools, is at the http://docs.hp.com/hpux/diag/ Web site.
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1 HP Integrity rx8640 and HP 9000 rp8440 Server Overview The HP Integrity rx8640 server and the HP 9000 rp8440 server are members of the HP business-critical computing platform family of mid-range, mid-volume servers, positioned between the HP Integrity rx7640, HP 9000 rp7440 and HP Integrity Superdome servers. IMPORTANT: The differences between the HP Integrity rx8640 and the HP 9000 rp8440 servers are identified in Chapter 1 and Chapter 2. See Chapter 2 (page 33).
Figure 1-1 16-Socket Server Block Diagram Cell Board Cell Board memory memory cpu cpu cpu cc cpu Bulk Power Supply Cell Board memory cpu cpu cpu System Backplane cpu LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA LBA PCI-X Backplane cpu cpu I/O EXPANSION CONNECTOR LBA LBA SBA cpu cc cpu Crossbar (XBC) SBA cpu cc cpu clocks memory cpu cc cpu Cell Board lan lan scsi scsi MP MP core I/O core I/O PCI Power Disk Bay Mass Storage Board dvd
Figure 1-2 Server (Front View With Bezel) Figure 1-3 Server (Front View Without Bezel) Removable Media Drives PCI Power Supplies Power Switch Hard Disk Drives Front OLR Fans Bulk Power Supplies Detailed Server Description 15
The server has the following dimensions: • Depth: Defined by cable management constraints to fit into a standard 36-inch deep rack: 25.5 inches from front rack column to PCI connector surface 26.7 inches from front rack column to core I/O card connector surface 30 inches overall package dimension, including 2.7 inches protruding in front of the front rack columns • • Width: 17.5 inches, constrained by EIA standard 19-inch racks Height: 17 U (29.
The PCI card bulkhead connectors are located at the rear top. The PCI X OLR fan modules are located in front of the PCI cards. They are housed in plastic carriers. The 12 rear OLR fans attached outside the chassis house 120-mm exhaust fans. The cell boards are located on the right side of the server behind a removable side cover. For rack mounted servers on slides, the rack front door requires removal if it is hinged on the right side of the rack.
Figure 1-6 Cell Board The server has a 48 V distributed power system and receives the 48 V power from the system backplane board. The cell board contains DC-to-DC converters to generate the required voltage rails. The DC-to-DC converters on the cell board do not provide N+1 redundancy.
Central Processor Units The cell board can hold up to four CPU modules. Each CPU module can contain up to two CPU cores on a single die. Modules are populated in increments of one. On a cell board, the processor modules must be the same family, type, and clock frequencies. Mixing of different processors on a cell or a partition is not supported. See Table 1-1 for the load order that must be maintained when adding processor modules to the cell board.
The memory subsystem comprises four independent quadrants. Each quadrant has its own memory data bus connected from the cell controller to the two buffers for the memory quadrant. Each quadrant also has two memory control buses: one for each buffer.
Valid Memory Configurations The first cell must have one DIMM pair loaded in slots 0A/0B. The server can support as little as 2 GB of main memory using two 1 GB DIMMs installed on one of the cell boards and as much as 512 GB by filling all 16 DIMM slots on all four cell boards with 8 GB DIMMs. The following rules explain the memory configuration: 1. 2. 3. DIMMs must be loaded in pairs (same size within a pair). DIMM pairs must be loaded in slot order (0A/0B, 1A/1B, 2A/2B, ...
Cells and nPartitions An nPartition comprises one or more cells working as a single system. Any I/O chassis that is attached to a cell belonging to an nPartition is also assigned to the nPartition. Each I/O chassis has PCI card slots, I/O cards, attached devices, and a core I/O card assigned to the I/O chassis. On the server, each nPartition has its own dedicated portion of the server hardware which can run a single instance of the operating system.
Table 1-4 Removable Media Drive Path Removable Media Path Slot 0 media 0/0/0/2/1.x1.0 Slot 1 media 1/0/0/2/1.x1.0 1 X equals 2 for a DVD drive while X equals 3 for a DDS-4 DAT drive. Table 1-5 Hard Disk Drive Path Hard Drive Path Slot 0 drive 0/0/0/2/0.6.0 Slot 1 drive 0/0/0/3/0.6.0 Slot 2 drive 1/0/0/2/0.6.0 Slot 3 drive 1/0/0/3/0.6.
The two LBA PCI bus controllers on the system backplane create the PCI bus for the core I/O cards. You must shut down the partition for the core I/O card before removing the card. Having the SCSI connectors on the system backplane allows replacement of the core I/O card without having to remove cables in the process. System Backplane to Cell Board Connectivity The system backplane provides four sets of connectors, one set for each cell board.
and at 266 MT/s for PCI-X mode 2 cards installed in mode 2 capable slots. When cell board 2 and cell board 3 are present, the cell boards attach to their own associated SBA and LBA chips on the PCI-X board in the Server Expansion Unit. Figure 1-12 PCI-X Board to Cell Board Block Diagram Table 1-6 and Table 1-7 list the mapping of PCI-X slots to boot paths. The cell column refers to the cell boards installed in the server.
Table 1-7 PCI-X Slot Boot Paths Cell 1 (continued) Cell PCI Slot Ropes Path 1 4 14/15 1/0/14/1/0 1 5 6/7 1/0/6/1/0 1 6 4/5 1/0/4/1/0 1 7 2/3 1/0/2/1/0 1 8 1 1/0/1/1/0 The server supports two internal SBAs. Each SBA provides the control and interfaces for eight PCI-X slots. The interface is through the rope bus (16 ropes per SBA).
IMPORTANT: Always refer to the PCI card's manufacturer for the specific PCI card performance specifications. PCI, PCI-X mode 1, and PCI-X mode 2 cards are supported at different clock speeds. Select the appropriate PCI-X I/O slot for best performance. Table 1-8 PCI-X Slot Types I/O Partition Slot1 0 Maximum MHz Maximum Peak Ropes Bandwidth Supported Cards PCI Mode Supported 82 66 533 MB/s 001 3.3 V PCI or PCI-X Mode 1 7 133 1.06 GB/s 002/003 3.3 V PCI or PCI-X Mode 1 6 266 2.
Each PCI/PCI-X slot has a host-to-PCI bridge associated with it, and each PCIe slot has a host-to-PCIe bridge associated with it. A dual slot hot swap controller chip and related logic is also associated with each pair of PCI or PCIe slots. The I/O chip on either cell location 0 or 1 is a primary I/O system interface. Upstream, the I/O chips communicate directly with the cell controller ASIC on the host cell board via a high bandwidth logical connection known as the HSS link.
NOTE: • • The differences between the PCI X backplane and the PCIe backplane are as follows: Twelve ropes are bundled in two rope pairs to 6 LBAs to support 6 slots for PCI and PCI-X cards instead of 14. These ropes are capable of 133MHz. Sixteen ropes are bundled into dual fat ropes to 8 LBAs to support 8 additional slots for PCIe cards. These ropes are capable of 266MHz.
Core I/O Boot Paths The servers internal I/O devices are located on the core I/O. The following table outlines the paths assigned to the hard disk and removable media disk bays located on the front of the server chassis. Core I/O card 0 refers to the core I/O located in the upper slot at the rear of the system. Core I/O card 1 refers to the core I/O located in the lower slot at the rear of the system. Core I/O cards 2 and 3 are located in the SEU (if available).
Figure 1-13 Mass Storage Block Diagram SCSI TERM SCSI TERM SCSI_1-1 J11 SCSI SCSI_2-1 12V PWR MGR SCSI_1-2 J13 SCA HARD 0-1 DRIVE 1-1 J21 SCSI 12V PWR MGR 5V PWR MGR 5V PWR MGR SCSI TERM SCSI TERM J12 SCSI J14 HARD SCA DRIVE 1-2 0-2 SCSI_2 SCSI_2-2 SCSI 12V PWR MGR V12P0_1 12 VDC_2 J16 DVD-1 DVD POWER PWR V5P0_1 IC_MON_1 J26 DVD-2 DVD POWER PWR 5 VDC_2 J15 PWR IC_FRU J24 HARD SCA DRIVE 2-2 1-2 5V PWR MGR 5V PWR MGR 2 HARD 1-1 DRIVE 2-1 J22 12V PWR MGR 2 J23 SCA J25 PWR FRU I/
2 System Specifications This chapter describes the basic system configuration, physical specifications and requirements for the server. Dimensions and Weights This section provides dimensions and weights of the server and server components. Table 2-1 gives the dimensions and weights for a fully configured server. Table 2-1 Server Dimensions and Weights Standalone Packaged Height - Inches (centimeters) 29.55 (75.00) 86.50 (219.70) Width - Inches (centimeters) 17.50 (44.50) 40.00 (101.
Table 2-3 Example Weight Summary (continued) Component Quantity Multiply Weight (kg) Power supply (BPS) 6 12 lb 72 lb 5.44 kg 32.66 kg 2.2 lb 4.4 lb 1.0 kg 2.0 kg 1.6 lb 6.40 lb 0.73 kg 2.90 kg 131 lb 131 lb 59.42 kg 59.42 kg Total weight 322.36 lb DVD drive Hard disk drive Chassis with skins and front bezel cover 2 4 1 146.
Install a protective earthing (PE) conductor that is identical in size, insulation material, and thickness to the branch-circuit supply conductors. The PE conductor must be green with yellow stripes. The earthing conductor described is to be connected from the unit to the building installation earth or if supplied by a separately derived system, at the supply transformer or motor-generator set grounding point. Circuit Breaker The Marked Electrical for the server is 15 amps per line cord.
Table 2-6 HP Integrity rx8640 and HP 9000 rp8440 AC Power Requirements (continued) Requirements Value Comments Power factor correction >0.98 At all loads of 50%–100% of supply rating. >0.95 At all loads 0f 25%–50% of supply rating Ground leakage current (mA) <3.
Note 3: User Expected Maximum Power: (Input power at the ac input expressed in Watts and Volt-Amps.) The measured maximum worst case power consumption. This number represents the largest power consumption that HP engineers were able to produce for the server with any combination of hardware under laboratory conditions using aggressive software applications designed specifically to work the system at maximum load.
Table 2-9 Example ASHRAE Thermal Report (continued) Condition ASHRAE class Minimum configuration 1 cell board, 2 CPUs, 2 GB, 1 core I/O card Full configuration 4 cell boards, 16 CPUs, 128 GB, 2 core I/O cards, 16 I/O cards, 4 hard disks Typical configuration 2 cell boards, 8 CPUs, 64 GB, 1 core I/O card, 8 I/O cards, 2 hard disks Environmental Temperature Sensor To ensure that the system is operating within the published limits, the ambient operating temperature is measured using a sensor placed on t
the resulting heat from the cabinet. The fans within the power supply will operate at full speed during standby. Typical HP Integrity rx8640 Server Power Dissipation and Cooling Table 2-10 provides calculations for the rx8640 configurations as described in the table.
The air-conditioning data in Table 2-11 are derived using the following equations: • • • Watts x (0.860) = kcal/hour Watts x (3.414) = Btu/hour BTU/hour divided by 12,000 = tons of refrigeration required NOTE: When determining power requirements, you must consider any peripheral equipment that will be installed during initial installation or as a later update. Refer to the applicable documentation for such devices to determine the power and air-conditioning that is required to support these devices.
A Templates This appendix contains blank floor plan grids and equipment templates. Combine the necessary number of floor plan grid sheets to create a scaled version of the computer room floor plan. Figure A-1 illustrates the overall dimensions required for the servers. Figure A-1 Server Space Requirements Equipment Footprint Templates Equipment footprint templates are drawn to the same scale as the floor plan grid (1/4 inch = 1 foot).
2. 3. 4. 5. Cut and join them together (as necessary) to create a scale model floor plan of your computer room. Remove a copy of each applicable equipment footprint template (Figure A-2). Cut out each template selected in step 3; then place it on the floor plan grid created in step 2. Position pieces until you obtain the desired layout, then fasten the pieces to the grid. Mark locations of computer room doors, air-conditioning floor vents, utility outlets, and so on.
Figure A-3 Planning Grid Computer Room Layout Plan 43
Figure A-4 Planning Grid 44 Templates
Index A M AC power specifications, 35 air ducts, 40 illustrated, 40 ASIC, 13 mass storage backplane, 30, 33 memory, 13 subsystem, 18 MP core I/O, 22 B N backplane mass storage, 30, 33 system, 26, 29, 33, 38 N+1, 13 noise emission specifications, 40 C operating environment, 37 cell board, 25, 33, 38 cell controller, 13 circuit breaker, 35 component power requirements, 35 computer system air ducts, 40 controls, 17 cooling, 38 core I/O, 13, 22, 29 D DAT, 13 dimensions and weights, 33 DIMMs, 19 memor
