Datasheet
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures preliminary requirements
- Removal and replacement procedures for Authorized Service Provider parts
- Component replacement procedures
- Unlocking the device and disabling Always On Remote Management (select HP devices only)
- Bottom cover
- Display assembly components (panel, bezel, webcam, microphone)
- Keyboard
- SSD drive
- WLAN module
- Display assembly
- RTC battery
- Heat sink
- Battery
- Fingerprint reader board
- NFC module
- ForcePad (Touchpad)
- System board
- Power button
- Speaker assembly
- Component replacement procedures
- Computer Setup (BIOS), MultiBoot, and HP PC Hardware Diagnostics (UEFI) in Windows 8.1
- Computer Setup (BIOS), MultiBoot, and HP PC Hardware Diagnostics (UEFI) in Windows 7
- Using Setup Utility (BIOS) and HP PC Hardware Diagnostics (UEFI) in Ubuntu Linux
- Specifications
- Backup and recovery in Windows 8.1
- Backup and recovery in Windows 7
- Backing up, restoring, and recovering
- Statement of memory volatility
- Power cord set requirements
- Recycling
- Index
2. Remove the heat sink (2).
CAUTION: Take extreme care when removing the heat sink. The heatpipe is very fragile and can be
easily damaged and bent during removal.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is
included with the heat sink, processor, and system board spare part kits.
The following illustration shows the replacement thermal material locations. Thermal paste is used on
the heat sink (1) and the processor (2).
Reverse this procedure to install the heat sink assembly.
Component replacement procedures 55