Technical data
Table Of Contents
- Technical Reference Manual for OEMs HP Models 743, 744, and 748
- Contents
- 1 General Information
- Model 743 and Model 744 VME Board Computers
- Product Description
- Supported Configurations
- Model 743 and Model 744 External Devices
- Keyboard and Mouse
- Model 743 and Model 744 Cables
- Model 743 and Model 744 Functional Description
- Model 744 Block Diagram
- CPU Circuit
- Boot ROM Circuit
- Graphics Circuit
- Model 743 Memory Controller Circuit
- Model 744 Memory Controller Circuit
- LED Displays
- I/O Controller ASIC
- VME Controller ASIC
- I/O Expansion
- I/O Expansion Block Diagrams
- Model 748 Ruggedized Workstation
- Model 743 and Model 744 VME Board Computers
- 2 References
- 3 Quality
- 4 Mechanical Information
- 5 Electrical Information
- Video Connector Pinouts
- Audio Connector Pinouts
- HP Parallel Connector Pinouts
- RS-232 Connector Pinouts
- AUI LAN Connector Pinouts
- Single-Ended SCSI Connector Pinouts
- FW SCSI Connector Pinout
- PS/2 Connector Pinouts
- VME Connector Pinouts
- Real-Time Clock (RTC) Battery Information
- Video Output Signal Specifications
- Video Timing Specifications
- 6 Power Requirements
- 7 Product Design Considerations
- Index
3-10
Quality
Climatic and Dynamic Environmental Ruggedness
Table 3-22 summarizes the vibration tests suite.
Table 3-23 and Table 3-24 summarizes the shock tests suite.
Table 3-22 Vibration Tests While Non-Operating
Standard Level
HP Standard 759 (class B1)(exceeds IEC 654-3/VH2)
7.4 m/s
2
(0.75 g 0-p)
swept sine
Packaging tests
HP Standard 762
4.9 m/s
2
(0.5 g 0-p)
swept sine
Packaging tests
HP Standard 762
0.015 g
2
/Hz (.3 g rms)
random
Table 3-23 Shock Tests While Non-Operational
Standard Level
Bump test
HP Standard 760 (class B)
> 294 m/s
2
(>30g) trapezoidal wave
Packaging drop test
HP Standard 762
IEC 654-3
.61 meters (24 inches)
Table 3-24 Shock Tests During Operation
Standard Level
HP Standard 760 (class B), IEC 654-3 150 cm/s < 3ms 1/2 half sine