Datasheet

WLAN module (see

WLAN module on page 70)

e. WWAN module (see

WWAN module on page 68)

Fan (see

Fan on page 75)

g. Keyboard (see

Keyboard on page 76)

h. Base enclosure (see

Base enclosure on page 80)

i. System board (see

System board on page 95)

Remove the heat sink:

NOTE: Steps 1 and 2 apply to computer models equipped with a graphics subsystem with discrete

memory. See steps 3 and 4 for heat sink removal information for computer models equipped with a

graphics subsystem with UMA memory.

1. Following the 1, 2, 3, 4, 5, 6 sequence stamped into the heat sink, loosen the six captive Philllips

screws (1) and (2) that secure the heat sink to the system board.

Remove the heat sink (3).

NOTE: Due to the adhesive quality of the thermal material located between the heat sink and

the system board components, it may be necessary to move the heat sink from side to side to

detach it.

NOTE: Steps 3 and 4 apply to computer models equipped with a graphics subsystem with UMA

memory. See steps 1 and 2 for heat sink removal information for computer models equipped with

a graphics subsystem with discrete memory.

100 Chapter 4 Removal and replacement procedures