Installation guide

Temperature/humidity

Maintain appropriate temperature and humidity in the equipment room.

 Lasting high relative humidity can cause poor insulation, electricity creepage, mechanical property

change of materials, and metal corrosion.

 Lasting low relative humidity can cause washer contraction and ESD and bring problems including

loose captive screws and circuit failure.

 High temperature can accelerate the aging of insulation materials and significantly lower the reliability

and lifespan of the switch.

For the temperature and humidity requirements of different switch models, see "Support and other

resources."

Cleanness

Dust buildup on the chassis may result in electrostatic adsorption, which causes poor contact of metal

components and contact points, especially when indoor relative humidity is low. In the worst case,

electrostatic adsorption can cause communication failure.

Table 2 Dust concentration limit in the equipment room

Substance

Concentration limit (particles/m³)

Dust

≤ 3 x 10

(no visible dust on the tabletop over three days)

NOTE:

Dust diameter ≥ 5 μm

The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and

premature aging of components, as shown in Table 3.

Table 3 Harmful gas limits in the equipment room

Gas

Maximum concentration (mg/m

)

0.2

0.006

0.05

0.01

EMI

All EMI sources, from outside or inside of the switch and application system, adversely affect the switch in a

conduction pattern of capacitance coupling, inductance coupling, electromagnetic wave radiation, or

common impedance (including the grounding system) coupling. To prevent EMI, take the following actions:

 If AC power is used, use a single-phase three-wire power receptacle with PE to filter interference from

the power grid.

 Keep the switch far away from radio transmitting stations, radar stations, and high-frequency devices.

 Use electromagnetic shielding, for example, shielded interface cables, when necessary.