Operating Manual

ManualsBrandsHOVER-1 ManualsElectronicsBluetooth Module

2AANZHELX-Module Guideline Bluetooth module operating manual

Product description:

2AANZHELX-Module Bluetooth module is smart wireless audio data input product, is a low cost

and efficient mono wireless transmission solution. It’s adopt domestic Jieli Bluetooth chip AC6925B.

It’s provides the module with high quality sound and compatibility, and overall performance more

optimized.

2AANZHELX-Module Bluetooth module is using for driveless mode. You only need input the

module to the application products, connect with power, then it can achieve the wireless music

transfer, enjoy the funny of wireless music.

Application fields:

This module is used for short distance music transfer, is easy to connect with smart computer,

phone, PDA etc. Products’ Bluetooth device, to gain the wireless music transfer.

※ Bluetooth speaker

※ Bluetooth headphone

※ Hands-free calls

※ Wireless transfer audio.

Product Specification:

Item No. 2AANZHELX-Module

Bluetooth version Bluetooth V5.0+EDR

Support bluetooth

agreement:

AVRCP 1.0，GAVDP 1.0，AVDTP 1.0，A2DP 1.2，

Hands-Free Profile 1.5，Headset Profile v1.1

Working Ampere

≤30mA

Standby Voltage < 300uA

Working Voltage 3.3V-5.5V

Temperature Range

-40ºC to +80ºC

Wireless Range

>10 M

Transmit Power Class2 Max 4dB

Summary of content (11 pages)

PAGE 1
2AANZHELX-Module Guideline Bluetooth module operating manual Product description: 2AANZHELX-Module Bluetooth module is smart wireless audio data input product, is a low cost and efficient mono wireless transmission solution. It’s adopt domestic Jieli Bluetooth chip AC6925B. It’s provides the module with high quality sound and compatibility, and overall performance more optimized. 2AANZHELX-Module Bluetooth module is using for driveless mode.
PAGE 2
Sensitivity -80dBm@0.1%BER Frequency Range 2.402GHz-2.480GHz External interface PIO，UART Audio Performance High quality music Audio signal to noise ratio ≥75dB Distortion ≤0.1% Module size 46．00X35.00X1.
PAGE 3
Warning： This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions : (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
PAGE 4
Antenna Specification Summary ITEM ANT SPEC Model Name 2.4G ANT Horizontal Center Frequency Vertical 2400MHz 2400MHz 2500MHz 2400MHz 2400MHz 2500MHz -1.26 -0.76 -0.58 -5.25 -2.46 -1.86 MAX. Gain -0.58dB Polarization Horizontal and Vertical Azimuth Beam Pattern Omni-directional Impedance 50 Ohm Antenna Length 38.20mm Manufacture ZHUHAI JIELI TECHNOLOGY CO.
PAGE 5
Horizontal: 2400 MHz 2450 MHz 2500 MHz Power (dBm) Max: 0 Min: -40 Scale: 5/div Frequency (MHz) Max Min Avg 2400 -1.26174 -30.0801 -7.18716 2450 -0.765802 -36.5604 -7.48023 2500 -0.585582 -22.0315 -6.
PAGE 6
Vertical: 2400 MHz 2450 MHz 2500 MHz Power (dBm) Max: 0 Min: -30 Scale: 5/div Frequency (MHz) Gain(dB) Max Min Avg 2400 -5.2537 -22.1424 -12.4294 2450 -2.4652 -24.5837 -10.4702 2500 -1.86120 -29.5214 -9.20432 ANT Test Labs：Attestation of Global Compliance Co., Ltd.
PAGE 7
Hardware Design Guidance Power supply、ground wire 1、 Ground wire The bluetooth ground wire are divided into AGND、PGND、and GND： a） AGND and GND must be strictly distinguished, connected at the battery entrance or in the front of IC ground side; in the case of limited PCB board space, priority should be given to ensuring the connectivity of GND and the battery ground circuit, and the route must be thick .
PAGE 8
+1.5V power supply should as thick as possible and ,routing should first pass the capacitor then go into IC,it is not allow to through the hole connect IC after passing capacitor . 3、LDOIN LDOIN decoupling capacitor C5 is placed as close as possible to the pin of the chip and connected to PGND, same time LDOIN should be as thick as possible, routing should first pass the capacitor then go into IC 4、VDDIO The decoupling capacitor C6 of VDDIO should place as close as possible to the chip 2 pin side.
PAGE 9
a）RF try place at the PCB side, can not have metal components on both front and back sides, use three side hollow-out way (top,left and right like picture 4). Picture5. b）RF and DAC circuit must in 1800 layout to minimize the interference from RF to DAC . c）If PCB have enough space be sure to use inverted F-shaped antenna. d）Try to place RF like I -shaped. 3、DAC、MIC、VCOM、DACVDD a） DAC circuits and solder joints must be placed 180 degrees with RF to reduce the radiation and interference from RF.
PAGE 10
Additions Picture7. DAC restrain RF interference circuit 1、RF antenna、TDD radiation noise a）Picture7 is the circuit of DAC retrain RF antenna and TDD interference，itisrecommendedtoreserve,ifhas limitedspacethencanjustreserveR6/R7/R8. b)DAC、power supply lead and speaker cavity should avoid the RF position, the back of RF is the best position for speaker and battery connection point.
PAGE 11
Version information Date 2016.03.30 Description Version No. V1.0 Original version 1、 increased +1.5V power supply description 2016.04.28 V1.1 2、increased LDOIN power supply description 3、 increased crystal oscillator description（ point b ） 4、 increased RF layout description（point d ） 5、 increased DAC description（point c and d ） 2016.05.18 V1.2 1、 increased ground description. 2、 the decoupling capacitor of LDOIN connect PGND. 3、 updated picture 1 and 2.