Product Specs

M.2-B048-101
Confidential Page 10
Figure 3-2 Schematic diagram of M.2-B048-101 module after installation
Strengthen the air flow around the module. Try not to place any parts on the module
projection area of the user backplane. Do not place heat sensitive components (such as crystals)
or any other components that consume 1.5W or higher power around the module. Choose a
large user baseboard. The thermal pad between the module and the user backplane can
improve the heat dissipation performance of the multilayer backplane. Cover the installation area
of the thermal pad on the user baseboard with copper. Use continuous ground planes on the
user backplane as much as possible, and holes must be used to connect between ground
planes. Therefore, reserve as many holes as possible.
4. Product List
Product Name
QTY
Remark
M.2-B048-101
1
Default