Product Specs

M.2-B048-101
Confidential Page 9
3. Thermal Design
In the installation design integrated into the industry equipment, in order to ensure the
stability and reliability of the M.2-B048-101 module, it is necessary to pay attention to the heat
dissipation design of the module. The main heat dissipation measures are as follows:
 The PCB board does not need to be hollowed out.
 The recommended minimum thermal conductivity of the thermal conductive material is
3W/m-k for heat dissipation between the module and the user's bottom board through the
thermal pad pressing. The size of the thermal pad is 42mm x 29.4mm. The height of the
thermal pad is determined by the height of the PCIE M.2 connector selected by the user
and the installation method of the module. When determining the height of the thermal
pad, it is recommended to follow the following rules: After the module is connected to the
user base, the compression ratio of the thermal pad is 15% to 30% of the size of the
thermal pad. Refer to Figure 3-1 below, the height reference value is 2mm.
Figure 3-1 Schematic diagram of M.2-B048-101 module before installation
 A screw hole is reserved on the user backplane to connect to the ground plane of the
backplane. When installing the module, tighten a metal screw to fix the module to the user
backplane. Refer to Figure 3-2 below.