User's Manual

COMPANY CONFIDENTIAL

Preliminary Datasheet

11.6 Soldering and reflow condition

1) Heating method

Conventional Convection or IR/convection

2) Temperature measurement

Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.

3) Solder paste composition

Sn/3.0Ag/0.5Cu

4) Allowable reflow soldering times: 2 times, based on the below reflow soldering profile

Suggest reflow soldering one time for better reliability.

5) Temperature profile

Reflow soldering shall be done according to the below temperature profile.

6) Peak temp: 245 degree C

Temperature profile for evaluation of solder heat resistance of a

component (at solder joint)