User's Manual

COMPANY CONFIDENTIAL
Preliminary Datasheet
28
11. Environmental Requirements and Specifications
11.1 Temperature
11.1.1 Operating Temperature Conditions
The product shall be capable of continuous reliable operation when operating in ambient temperature of
0 °C to +70°C.
11.1.2 Non-Operating Temperature Conditions
Neither subassemblies shall be damaged nor shall the operational performance be degraded when
restored to the operating temperature when exposed to storage temperature in the range of -30°C to +85°C.
11.2 PCB bending
The PCB bending spec shall be keep planeness under 0.1mm for both Foxconn and end assembly
customer.
11.3 Handling environment
ESD
There are semiconductors on the module, please handle the module under ESD protected and
well-controlled environment (<100V).
Terminals Handling Notice
The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.
Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and
real for packaging materials have no heat resistance, please bake the components moved into another
container such as heat resistance trays.
Others
1. Please make sure to avoid mechanical shock and vibration for this module.
2. Please do not drop the module.
3. Please do not clean the module.
11.4 Storage Condition
1. Moisture barrier bag must be stored under 40 ℃, humidity under 90% RH, when the moisture
barrier bag is sealed by Foxconn.
2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.
3. If Moisture barrier bag is open, the component must be stored in an environment of <25±5℃
/10%RH
4. Please keep the module at 30℃/70% RH.
11.5 Baking Condition
If below two conditions happens:
a) Humidity indicator cards read >30%
b) Temp < 30 ℃, Humidity <70%RH, moisture barrier bag open over 96 hours
Products require baking before mounting
Baking condition: 125 ℃, 12-22 hours
Baking times: Max. 2 times