User's Manual

COMPANY CONFIDENTIAL
Preliminary Datasheet
34
10.5 Baking Condition
If below two conditions happens:
a) Humidity indicator cards read >30%
b) Temp < 30 ℃ , Humidity <70%RH, moisture barrier bag open over 96 hours
Products require baking before mounting
Baking condition: 90 ℃ , 12-22 hours
Baking times: Max. 2 times
10.6 Soldering and reflow condition
1) Heating method
Conventional Convection or IR/convection
2) Temperature measurement
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.
3) Solder paste composition
Sn/3.0Ag/0.5Cu
4) Allowable reflow soldering times: 2 times, based on the below reflow soldering profile
5) Temperature profile
Reflow soldering shall be done according to the below temperature profile.
6) Peak temp: 245 degree C
11 Package information
TBD
Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)