User's Manual

COMPANY CONFIDENTIAL
Preliminary Datasheet
2
Index
1 . REVISION HISTORY...................................................................................................................................................3
2. INTRODUCTION ..........................................................................................................................................................4
2.1 S COPE ......................................................................................................................................................................4
2.2 F UNCTION .................................................................................................................................................................4
3. PRODUCT SPECIFICATION .....................................................................................................................................5
3.1 H ARDWARE C HARACTERISTIC .................................................................................................................................5
3.2 H ARDWARE A RCHITECTURE ....................................................................................................................................5
3.3 E LECTRICAL S PECIFICATION ....................................................................................................................................6
3.4 WLAN RF C HARACTERISTICS .................................................................................................................................7
3.4.1 IEEE802.11b ..................................................................................................................................................7
3.4.2 IEEE802.11g (SISO).....................................................................................................................................7
3.4.3 IEEE802.11gn HT20 Single chain ............................................................................................................9
3.4.4 IEEE802.11a ................................................................................................................................................10
3.4.5 IEEE802.11an HT20 Single chain ..........................................................................................................11
3.4.6 IEEE802.11an HT40 Single chain ..........................................................................................................12
3.5 B LUETOOTH S TANDARD S PECIFICATIONS .............................................................................................................13
3.6 I NTERFACE TIMING ..................................................................................................................................................16
3.6.1 SDIO I NTERFACE TIMING ....................................................................................................................................16
3.6.2 UART I NTERFACE TIMING ...................................................................................................................................18
3.6.3 PCM I NTERFACE TIMING .....................................................................................................................................18
4. MECHANICAL DRAWING .......................................................................................................................................25
5. SCHEMATIC REFERENCE DESIGN .....................................................................................................................28
6. PCB LAYOUT.............................................................................................................................................................30
7. SOFTWARE REQUIREMENT..................................................................................................................................30
8. REGULATORY...........................................................................................................................................................32
9. PACKAGE RELIABILITY TEST CONDITIONS ....................................................................................................33
10. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS.....................................................................33
10.1 T EMPERATURE .....................................................................................................................................................33
10.2 PCB BENDING ......................................................................................................................................................33
10.3 H ANDLING ENVIRONMENT ....................................................................................................................................33
10.4 S TORAGE C ONDITION ..........................................................................................................................................33
10.5 B AKING C ONDITION ..............................................................................................................................................34
10.6 S OLDERING AND REFLOW CONDITION ..................................................................................................................34
11 PACKAGE INFORMATION.....................................................................................................................................34