COMPANY CONFIDENTIAL Preliminary Datasheet BCM4324 WLAN +BT Combo Module (Foxconn T77H506.00 035) Product Specification Rev 0.
COMPANY CONFIDENTIAL Preliminary Datasheet Index 1. REVISION HISTORY...................................................................................................................................................3 2. INTRODUCTION ..........................................................................................................................................................4 2.1 SCOPE ................................................................................................................
COMPANY CONFIDENTIAL Preliminary Datasheet 1 Revision History Date Change Note Author REV Note 2013-05-07 Initial release Wilmer 0.1 2013-05-20 Modify the RX performance result Wilmer 0.2 2013-05-23 1. Update the TX and RX performance result 2. Modify some pin description. 3. Add Shielding case drawing Wilmer 0.3 Wilmer 0.4 2013-07-02 1. Update the TX and RX SPC in section 3.4 and 3.5. 3. Add interface timing in section 3.6 4. Update the Mechanical drawing in section 4 5.
COMPANY CONFIDENTIAL Preliminary Datasheet 2. Introduction Project Name: 802.11abgn (2X2) + BT4.0 combo module This documentation describes the product specification of the WLAN+BT combo Module. WLAN is Compliant with IEEE 802.11 a/b/g and 2x2 IEEE 802.11n MAC/ baseband/radio, Bluetooth is compliant with Bluetooth 4.0+HS. This module takes advantage of the high throughput and extended range of Broadcom second-generation MIMO solution. It is a confidential document of Foxconn.
COMPANY CONFIDENTIAL Preliminary Datasheet 3. Product Specification 3.1 Hardware Characteristic Form factor Host Interface PCB RF connector 13mmx17mmx1.5mm LGA WLAN: SDIO BT: UART for data, PCM for Audio 6-layer HDI design Two MHF4 RF connector on module 3.2 Hardware Architecture The WLAN+BT combo module is designed base on BROADCOM BCM4324 chip, the Broadcom BCM4324 is a highly integrated single chip solution for single and dual stream dual-band WLAN and BT4.0. Single and dual Antenna support, a 37.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.3 Electrical Specification Absolute Maximum Ratings These specifications indicate levels where permanent damage to the device can occur. Functional operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended can adversely affect long-term reliability of the device. Rating Symbol Value Unit DC supply voltage for the device 3.3V 2.3 to 4.
COMPANY CONFIDENTIAL Preliminary Datasheet Current Consumption * Note: it would be updated after EDVT testing. 3.4 WLAN RF Characteristics 3.4.1 IEEE802.11b Parameter Condition Target Power Spectrum Mask Transmission Spurious Emission-1 Transmission Spurious Emission-2 OBW Spread Bandwidth RF Carrier Suppression Transmit power –on ramp Transmit power –down ramp Center Frequency Tolerance Min. CH1~CH13, 1~11Mbps Type 16.5 18.5 fc-22MHzfc+22MHz f<2.
COMPANY CONFIDENTIAL Preliminary Datasheet Transmission Spurious Emission-1 Transmission Spurious Emission-2 Output Center Frequency Tolerance OBW Output Center Frequency Leakage Output Spectrum Flatness EVM Receiver Minimum Input Level Sensitivity at the Antenna Adjacent Channel Rejection Receiver Maximum Input Level Receiver Spurious +/- 20MHz +/- 30MHz f<2.387GHz 2.387 GHz< f<2.400 GHz 2.4835 GHz2.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.4.3 IEEE802.11gn HT20 Single chain Parameter Target Power Spectrum Mask Transmission Spurious Emission-1 Transmission Spurious Emission-2 Output Center Frequency Tolerance OBW Output Center Frequency Leakage Output Spectrum Flatness EVM Receiver Minimum Input Level Sensitivity at the Antenna Adjacent Channel Rejection Receiver Maximum Input Level Receiver Spurious CH1~CH13,MCS0~MCS4 CH1~CH13,MCS5~MCS7 +/- 11MHz +/- 20MHz +/- 30MHz f<2.387GHz 2.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.4.4 IEEE802.11a Parameter Target Power Spectrum Mask Transmission Spurious Emission-1 Transmission Spurious Emission-2 Output Center Frequency Tolerance OBW Output Center Frequency Leakage Output Spectrum Flatness EVM Receiver Minimum Input Level Sensitivity at the Antenna Adjacent Channel Rejection Receiver Maximum Input Level Receiver Spurious B1,B2,B3,B4,6~24Mbps B1,B2,B3,B4, 36~54Mbps +/- 11MHz +/- 20MHz +/- 30MHz f<2.387GHz 2.387 GHz< f<2.400 GHz 2.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.4.5 IEEE802.11an HT20 Single chain Parameter Target Power Spectrum Mask Transmission Spurious Emission-1 Transmission Spurious Emission-2 Output Center Frequency Tolerance OBW Output Center Frequency Leakage Output Spectrum Flatness EVM Receiver Minimum Input Level Sensitivity at the Antenna Adjacent Channel Rejection Receiver Maximum Input Level Receiver Spurious B1,B2,B3,B4;MCS0~MCS4 B1,B2,B3,B4;MCS5~MCS7 +/- 11MHz +/- 20MHz +/- 30MHz f<2.387GHz 2.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.4.6 IEEE802.11an HT40 Single chain Parameter Target Power Spectrum Mask Transmission Spurious Emission-1 Transmission Spurious Emission-2 Output Center Frequency Tolerance OBW Output Center Frequency Leakage Output Spectrum Flatness EVM Receiver Minimum Input Level Sensitivity at the Antenna Adjacent Channel Rejection Receiver Maximum Input Level Receiver Spurious B1,B2,B3,B4;MCS0~MCS4 B1,B2,B3,B4;MCS5~MCS7 +/- 11MHz +/- 20MHz +/- 30MHz f<2.387GHz 2.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.5 Bluetooth Standard Specifications Bluetooth Core Specification version 4.0: Host interface: UART, baud rates up to 4Mbps Support all Bluetooth 4.0+HS packet types. Operating frequency range: 2400MHz ~2483.
COMPANY CONFIDENTIAL Preliminary Datasheet DEVM 8DPSK ≤ 20 f>f0+3 MHz ≤ -40 f2.
COMPANY CONFIDENTIAL Preliminary Datasheet BER≤0.01% 8DPSK(ch0~78) -85 π/4 DQPSK -20 8DPSK -20 Max input Level dBm Co-ch interface C/Ico C/I Performance at BER≤0.1%(π/4 DQPSK) <13 Adjacent Chanel Sensitivity C/I f=f0±1 MHz Adjacent Chanel Sensitivity C/I f=f0±2 MHz Adjacent Chanel Sensitivity C/I f≥f0±3 MHz <0 <-30 dB < -40 Image Ch interference C/Iimage < -7 Image Ch interference C/Iimage± < -20 1MHz Co-ch interface C/Ico C/I Performance at BER≤0.
COMPANY CONFIDENTIAL Preliminary Datasheet 3.6 Interface timing 3.6.
COMPANY CONFIDENTIAL Preliminary Datasheet SDIO High-Speed Mode Timing 17
COMPANY CONFIDENTIAL Preliminary Datasheet 3.6.2 UART Interface timing 3.6.
COMPANY CONFIDENTIAL Preliminary Datasheet PCM Interface Timing Specifications (Short Frame Sync, Master Mode) Short Frame Sync, Slave Mode PCM Timing Diagram (Short Frame Sync, Slave Mode) PCM Interface Timing Specifications (Short Frame Sync, Slave Mode) 19
COMPANY CONFIDENTIAL Preliminary Datasheet Long Frame Sync, Master Mode PCM Timing Diagram (Long Frame Sync, Master Mode) PCM Interface Timing Specifications (Long Frame Sync, Master Mode) PCM Timing Diagram (Long Frame Sync, Slave Mode) 20
COMPANY CONFIDENTIAL Preliminary Datasheet PCM Interface Timing Specifications (Long Frame Sync, Master Mode) 21
COMPANY CONFIDENTIAL Preliminary Datasheet 3.
COMPANY CONFIDENTIAL Preliminary Datasheet - Pin definition (Module point of view): Pin No. Pin Name 1-3 Type Description Voltage I/O No connection - 4-5 6 7 8*(a) UIM_power_in/GPIO1 UIM_power_out UIM_SWP 3.3V GND Reserved ALERT Power GND I/O - Power voltage input pin Ground Reserved LGA pin No connection 3.
COMPANY CONFIDENTIAL Preliminary Datasheet 49 50 51 52 53 54 SDIO DATA1 SDIO DATA0 SDIO CMD SDIO CLK UART WAKE UART CTS I/O I/O I/O I O I 55 UART TX O 56 UART RX I 58 UART RTS O 58 59 60 61 62 63 PCM FR1 PCMIN PCMOUT PCMCLK GND W_DISABLE#2 I/O I O I/O GND I 64 65 66-67 68 69*(a) 70*(a) 71 72-73 74-76, others LED#2 LED#1 Reserved GND USB_DUSB _D+ GND 3.3V GND GND - 4 lines for SDIO data exchange 4 lines for SDIO data exchange SDIO Command Interface SDIO 3.0 Clock Bluetooth host Wake.
COMPANY CONFIDENTIAL Preliminary Datasheet 4. Mechanical Drawing Foxconn can provide the DXF file for detail dimension as following drawing. (Dimension Tolerance is +-0.
COMPANY CONFIDENTIAL Preliminary Datasheet T77H506.00 035 Shielding Cover Antenna port location as following drawing ((Dimension Tolerance is +-0.
COMPANY CONFIDENTIAL Preliminary Datasheet RF connector: - New RF connector is needed, for lower z-height and smaller footprint - Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable - Cable diameter determines mated height: 1.2mm mated height with 0.81mm cable 4.
COMPANY CONFIDENTIAL Preliminary Datasheet 5. Schematic Reference Design Following is the Evaluation board schematics for reference. BT_HOST_WAKE Module pinout & 32.768kHz VBAT 3.3V 3.
COMPANY CONFIDENTIAL Preliminary Datasheet Specification Clock jitter Clock jitter sine- wave 300Hz-15K Hz - During initial start-up 5 ns 10,000 ppm 3.
COMPANY CONFIDENTIAL Preliminary Datasheet 6. PCB Layout 6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.3+/-0.03mm 7. Software Requirement - Operating System Support Windows 8 Windows Blue or later Android 4.
COMPANY CONFIDENTIAL Preliminary Datasheet - SDP Serial-DevA Serial-DevB BLE (Bluetooth Low Energy) Support Windows 8 Windows Blue or later 31
COMPANY CONFIDENTIAL Preliminary Datasheet 8. Regulatory USA : FCC P15B / FCC P15C / FCC P15E Canada : IC RSS-210 Japan : TELEC EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd BCM4324 module 5GHz power table Typical power (limit is +1/-2dB) (unit:dBm) CH36 HT20 6Mbps CH48 CH52 CH64 CH100 CH120 CH140 CH149 CH165 ANT0 16 16 17.5 17.5 17.5 17.5 17 17.5 17.5 ANT1 16 16 17.5 17.5 17.5 17.5 17 17.5 17.5 16 16 19.5 19.5 19.5 19.5 19.5 19.
COMPANY CONFIDENTIAL Preliminary Datasheet 9. Package reliability test conditions Sine Vibration Shock Test 1.Frequency = 5 ~ 500 ~ 5 HZ 2.Acceleration = 2 Grms 3.Each of x, y, z axis/ 30 min 1.Sine wave ,230G , 3msec 2.Test +/- x, y, z axes : 10. Environmental Requirements and Specifications 10.1 Temperature 9.1.1 Operating Temperature Conditions The product shall be capable of continuous reliable operation when operating in ambient temperature of 0 °C to +70°C. 10.1.
COMPANY CONFIDENTIAL Preliminary Datasheet 10.5 Baking Condition If below two conditions happens: a) Humidity indicator cards read >30% b) Temp < 30 , Humidity <70%RH, moisture barrier bag open over 96 hours Products require baking before mounting Baking condition: 90 , 12-22 hours Baking times: Max. 2 times ℃ ℃ 10.6 Soldering and reflow condition 1) Heating method Conventional Convection or IR/convection 2) Temperature measurement Thermocouple d=0.1mm ~ 0.
COMPANY CONFIDENTIAL Federal Communication Commission Interference Statement 10 Package information This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may TBD not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.