Information

1. Wave Soldering
Recommend flow soldering temperature Profile


Soldering
Most components are wave soldered with solder at 230 to 250 C. Adequate care must be taken to
prevent the potential of thermal cracks in the ceramic capacitors. Refer to the soldering methods below
for optimum soldering benefits.
Soldering Method Change in Temp.(
)
1206 and Under
∆T ≤100~130 max.
To optimize the result of soldering, proper preheating is essential:
1) Preheat temperature is too low
a. Flux flows to easily
b. Possibility of thermal cracks
2) Preheat temperature is too high
a. Flux deteriorates even when oxide film is removed
b. Causes warping of circuit board
c. Loss of reliability in chip and other components
2. Reflow Soldering
Preheat to the reflow temperature is recommended to decrease the potential of thermal cracking in the
components. The recommended heating rate depends on the size of component, however it should not
exceed 3
C/Sec.
Recommend reflow profile for Lead-Free soldering temperature Profile (MIL-STD-202G #210F)
Soldering Method Change in Temp.( )
1206 and Under
∆T ≤190
1210 and Over
∆T ≤130
Cooling Condition:
Natural cooling in air is recommended. Forced cooling should be avoided, however if the chips are
dipped into a solvent for cleaning, the temperature difference ( T ) between the solvent and the chips
must be less than 100 C.
Temperature (°C)
217
260max.
150
C /60sec. Min.
70 to 90 sec.
Pre-heating
Soldering
Cooling
∆T
260 C max./ 10 sec.
120seconds or more
2 to 3 sec.
60seconds or more
∆T
Temperature (°C)
200
250
300
Pre-heating
Soldering
Cooling
230
The cycles of soldering : Twice (Max.)
Precautionary Information
Holy Stone
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