Information

Holy Stone has developed the “Super Term” Series (TX suffix in the part number), which
incorporates a “cushion layer” in the termination structure. This construction effectively absorbs external
forces, reduces the incidence of cracking and improves overall product reliability. Super Term product
applications include: high temperature automotive, power circuits and other critical end products with
extreme processing conditions.
Bending
Ag/Cu
Plating-Sn
Plating-Ni
PCB
Solder
Cushion Layer
force
Crack
Prevention
TX Product
(a) Thermal Shock Comparison ( 0805/X7R)
Reliability/Durability Comparison
(b) Substrate Flexure Comparison ( 0805/X7R)
Thermal shock test on standard termination results in
inception of failure at 500 cycles. Super Term TX Series
reliability improves to over 3000 cycles.
Bending test on Super Term shows an improvement of
about 5.0 mm bend vs. an average of about 2.0 mm. for
standard termination.
Plating : Sn
Plating : Ni
Polymer Ag
Glass Ag
During destructive bending test,
the PCB is subjected to bending
until capacitor failure. With Super
Term there is no cracking damage
in the ceramic. Super Term
effectively prevents ceramic body
cracking during extreme
mechanical stress as simulated by
this test.
No cracking apparent in the ceramic
Super Term failures resulting from destructive bending test tend to occur in the OPEN mode and not
short circuit mode typical of standard termination failures. The Super Term cushion layer material is
a ”polymer silver” material and can be seen in the above photo.
Polymer Ag
Reducing Short Circuit Risks – Super Term
Holy Stone
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