Data Sheet

Shenzhen Holyiot Technology Co.,Ltd
www.holyiot.com [e-mail]
4
 Supported data rates:
o
Bluetooth 5.1 – 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
o
IEEE 802.15.4-2006 – 250 kbps
o
Proprietary 2.4 GHz – 2 Mbps, 1 Mbps
 Angle-of-arrival (AoA) and angle-of-departure (AoD) direction finding using Bluetooth
 Single-ended antenna output (on-chip balun)
 128-bit AES/ECB/CCM/AAR co-processor (on-the-fly packet encryption)
 4.9 mA peak current in TX (0 dBm)
 4.7 mA peak current in RX
 RSSI (1 dB resolution)
• Arm® Cortex®-M4 32-bit processor, 64 MHz
 144 EEMBC CoreMark® score running from flash memory
 33 µA/MHz running CoreMark from flash memory
 33 µA/MHz running CoreMark from RAM
 Serial wire debug (SWD)
Flexible power management
 1.7 V to 5.5 V supply voltage range
 On-chip DC/DC and LDO regulators with automated low current modes
 Automated peripheral power management
 Fast wake-up using 64 MHz internal oscillator
 0.3 µA at 3 V in System OFF mode, no RAM retention
 1.2 µA at 3 V in System ON mode, no RAM retention, wake on RTC
 256 kB flash and 32 kB RAM
 Advanced on-chip interfaces
o USB 2.0 full speed (12 Mbps) controller
o Programmable peripheral interconnect (PPI)
o 18 general purpose I/O pins
o EasyDMA automated data transfer between memory and peripherals
 Nordic SoftDevice ready with support for concurrent multiprotocol
 64 level comparator
 Temperature sensor
 4x 32-bit timer with Counter mode
 Up to 2x SPI master/slave with EasyDMA
 Up to 2x I2C compatible two-wire master/slave
 UART (CTS/RTS) with EasyDMA
 Quadrature decoder (QDEC)
 2x real-time counter (RTC)
 Single crystal operation
 Operating temperature from -40 to 105 °C
 Package variants
o QFN40 package, 5 x 5 mm
o WLCSP package, 2.531 x 2.531 mm