User Manual

11/04/08
19
PD-60357
IR3802AMPbF
Solder Resist
It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder
resist should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure
NSMD pads.
The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder
resist onto the copper of 0.05mm to accommodate solder resist mis-alignment.
Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due to
the high aspect ratio of the solder resist strip separating the lead lands from the pad land.