User's Manual

+)/37/RZ3RZHU:L)L0RGXOH8VHU0DQXDO
+LJK)O\LQJ(OHFWURQLFV7HFKQRORJ\&R/WGZZZKLIO\LQJFRP
- 50 -
5. PACKAGE INFORMATION
5.1. Recommended Reflow Profile
)LJXUH 5HIORZ6ROGHULQJ3URILOH
7DEOH  5HIORZ6ROGHULQJ3DUDPHWHU
Note:5HFRPPHQGWRVXSSO\1IRUUHIORZRYHQ
 1DWPRVSKHUHGXULQJUHIORZ2SSP
5.2. Device Handling Instruction (Module IC SMT Preparation)
 6KHOIOLIHLQVHDOHGEDJPRQWKVDW DQGć UHODWLYHKXPLGLW\5+
 $IWHUEDJLVRSHQHGGHYLFHVWKDWZLOOEHUHEDNHGUHTXLUHGDIWHUODVWEDNHGZLWKZLQGRZWLPH
KRXUV
 5HFRPPHQGWRRYHQEDNHZLWK1VXSSOL
HG

5HFRPPHQGHQGWRUHIORZRYHQZLWK1VXSSOLHG
 %DNHGUHTXLUHGZLWKKRXUVDW EHIRUHUHZRUNSURFHVVć 
 5HFRPPHQGWRVWRUHDW 5+ZLWKYDFXXPSDFNLQJ
 ,I607SURFHVVQHHGVWZLFHUHIORZ
7RSVLGH607DQGUHIORZ ҏ%RWWRPVLGH607DQGUHIORZǂ
&DVH:LILPRGXOHPRXQWHGRQWRSVLGH1HHGWREDNHZKHQERWWRPVLGHSURFHVVRYHU
KRXUVZLQGRZWLPHQRQHHGWREDNHZLWKLQKRXUV
&DVH:LILPRGXOHPRXQWHGRQERWWRPVLGHIROORZQRUPDOEDNHUXOHEHIRUHSURFHVV
Note::LQGRZWLPHPHDQVIURPODVWEDNHHQGWRQH[WUHIORZVWDUWWKDWKDVKRXUVVSDFH
NO. Item Temperature (Degree)
Time(Sec)
 5HIORZ7LPH 7LPHRIDERYH
aVHF
 3HDN7HPS PD[