User's Manual
+)/37/RZ3RZHU:L)L0RGXOH8VHU0DQXDO
+LJK)O\LQJ(OHFWURQLFV7HFKQRORJ\&R/WGZZZKLIO\LQJFRP
- 4 -
$7/$115HVHUYHG
$7:$35HVHUYHG
$7:$.(<5HVHUYHG
$7:$'+&35HVHUYHG
$7:$/.5HVHUYHG
$7:$/.,1'
$7:$30;67$5HVHUYHG
$727$
$7
8
385/5HVHUYHG
$73/$1*5HVHUYHG
$7:(%85HVHUYHG
$7:50,'
$7$6:'
$7607/.
$71'%*/
5. PACKAGE INFORMATION ........................................................................................................50
5.1.
Recommended Reflow Profile .............................................................................................. 50
5.2. Device Handling Instruction (Module IC SMT Preparation) ............................................... 50
5.3. Shipping Information(Reserved) .......................................................................................... 51
APPENDIX A: HW REFERENCE DESIGN ...................................................................................... 52
APPENDIX B: HTTP PROTOCOL TRANSFER ..............................................................................53
B.1. Sending HTTP Raw Data in Throughput Mode ...................................................................... 53
APPENDIX C:REFERENCES ............................................................................................................54
C.1ˊ
ˊ
High-Flying Mass Production Tool ........................................................................................ 54
C.2
ˊ
SmartLink APP V7 Config Tool ..............................................................................................54
APPENDIX D: CONTACT INFORMATION ...................................................................................... 55