User's Manual

HF-LPD100 Low Power WiFi Module User Manual
2.PACKAGE INFORMATION
2.1. Recommended Reflow Profile
Figure 7. Reflow Soldering Profile
Table7. Reflow Soldering Parameter
Note: 1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
2.2. Device Handling Instruction (Module IC SMT Preparation)
1.
Shelf life in sealed bag: 12 months, at <30℃ and <60% relative humidity
2. After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
3. Recommend to oven bake with N2 supplied
NO. Item Temperature (Degree)
Time(Sec)
1 Reflow Time Time of above 220
35~55 sec
2 Peak-Temp 260 max
High-Flying Electronics Technology Co., Ltd.(www.hi-flying.com)
4. Recommend end to reflow oven with N2 supplied
5.
Baked required with 24 hours at 125+-5. 0℃ before rework process
6.
Recommend to store at ≦10% RH with vacuum packing
7.
If SMT process needs twice reflow:
(1) Top side SMT and reflow
(2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note: Window time means from last bake end to next reflow start that has 168 hours space.