User Manual
HF-LPB200 Low Power WiFi Module User Manual
Shanghai High-Flying Electronics Technology Co., Ltd
www.hi-flying.com
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5.2.2.23. AT+WSSSID .............................................................................................................. 46
5.2.2.24. AT+WSKEY ............................................................................................................... 46
5.2.2.25. AT+ WANN ................................................................................................................ 47
5.2.2.26. AT+ WSMAC ............................................................................................................. 47
5.2.2.27. AT+ WSLK ................................................................................................................. 48
5.2.2.28. AT+ WSLQ ................................................................................................................ 48
5.2.2.29. AT+WSCAN .............................................................................................................. 48
5.2.2.30. AT+ WSDNS ............................................................................................................. 48
5.2.2.31. AT+ LANN ................................................................................................................. 49
5.2.2.32. AT+WAP .................................................................................................................... 49
5.2.2.33. AT+WAKEY ............................................................................................................... 49
5.2.2.34. AT+WAMAC .............................................................................................................. 50
5.2.2.35. AT+WADHCP ............................................................................................................ 50
5.2.2.36. AT+WADMN .............................................................................................................. 50
5.2.2.37. AT+PLANG ................................................................................................................ 51
5.2.2.38. AT+UPURL ................................................................................................................ 51
5.2.2.39. AT+UPFILE ............................................................................................................... 51
5.2.2.40. AT+UPST .................................................................................................................. 51
5.2.2.41. AT+WEBU ................................................................................................................. 52
5.2.2.42. AT+MSLP .................................................................................................................. 52
5.2.2.43. AT+WRMID ............................................................................................................... 52
5.2.2.44. AT+ASWD ................................................................................................................. 53
6. PACKAGE INFORMATION......................................................................................................... 54
6.1. Recommended Reflow Profile .............................................................................................. 54
6.2. Device Handling Instruction (Module IC SMT Preparation) ............................................... 54
6.3. Shipping Information ............................................................................................................. 55
APPENDIX A: HW REFERENCE DESIGN....................................................................................... 56
APPENDIX B: CONTACT INFORMATION ....................................................................................... 57