User's Manual

HF-L
PB125 Low Power Wi-Fi Module User Manual
Shang
hai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com) -
12
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2. P
ACKAGE INFORMATION
2.1. Reco
mmended Reflow Profile
Fi
gure 4. Reflow Soldering Profile
Table 11 Reflow Soldering Parameter
Note:
1.
Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
2.2. Device
Handling Instruction (Module IC SMT Preparation)
1. Shelf
life in sealed bag: 12 months, at <30℃ and <60% relative humidity (RH)
2. After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
3. Recommend to oven bake with N2 supplied
4. Recommend end to reflow oven with N2 supplied
5. Baked required with 24 hours at 125+-5℃ before rework process for two modules, one is
new module and two is board with module
6. Recommend to store at ≦10% RH with vacuum packing
7. If SMT process needs twice reflow:
(1) Top side SMT and reflow (2) Bottom side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side processover168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note:
Window
time means from last bake end to next reflow start that has 168 hours space.
NO. Item Tempe
rature (Degree)
Time(Se
c)
1 Reflow Time Time of above 220
35~55 sec
2 Peak-Temp 260 max