Datasheet

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Recommended configuration of plated through holes
Due to the high deformation capability and resilience
of
press-in
contacts, they can be easily
and repeatedly removed in case of repairs without
impairment to their functioning.
Today tinned surfaces are widely used as a standard,
the pcb technology trends are moving to low tin or tin
free surfaces. Cu, Pd, Au and Ag are the important
alternatives. Specific parameters and particularly
different friction factors of these surfaces make high
demands on press-in zones.
press-in contacts are extremely versatile
and offer a reliable electrical contact, therefore they
are especially well suited for applications with these
surfaces.
Please contact us for detailed test reports.
Benefits of press-in technology
l
Thermal shocks associated with the soldering
process and the risk of the board malfunction are
avoided.
l
No need for the subsequent cleaning of the
assembled pcb’s
l
Unlimited and efficient processing of partially gold-
plated pins for rear I/O - manual soldering is no
longer necessary!
Recommended configuration of plated through
holes for tinned pcb’s
Diameter of holes: 0.6 ± 0.05 mm
Pcb thickness: 1.4 mm min.
Configuration: Drilling: 0.7 ± 0.02 mm
Cu: 30 - 50 µm
SnPb: 5 - 15 µm
Fig. 1:
Press-in zone
in plated through hole
chem. Sn
pure Cu
Pd
Au
Ag
Fig. 2:
Recommended
configuration of plated
through holes,
valid for
har-bus
®
HM ,
acc. to
IEC 61 076-4-101