Brochure

PH: 513-754-2000
THE HARRIS PRODUCTS GROUP
www.harrisproductsgroup.com
20
PH: 513-754-2000
THE HARRIS PRODUCTS GROUP
www.harrisproductsgroup.com
21
A patented, high-performance, lead-free solder developed by The
Harris Products Group in response to the Federal ban on the use of lead
solders in drinking water systems. This lead-free solder is specially
formulated to fill both tight and loose-fitting connections. The nickel
content in Bridgit
®
solder creates joints that are substantially stronger
than those joints soldered with 50/50, 95/5 or common lead-free
solders. Bridgit
®
has the ability to fill large gaps and “cap” joints with
ease. Meets ASTM B32.
Extensive laboratory and field tests show that Bridgit
®
eliminates the
problems associated with 95/5. Bridgit
®
begins to melt at 460˚F, only 40˚
higher than 50/50. Bridgit
®
flux in a one pound spool provides 20%
more wire than a roll of 1/8” diameter 50/50, resulting in 75 more
soldered joints per roll.
Bridgit
®
paste flux and Bridgit
®
water soluble flux are certified to ANSI/
NSF 61 and NSF/ANSI 372 for drinking water systems. Conforms to
lead-free content requirements of the U.S. Safe Drinking Water Act.
Certified to ANSI/NSF 51-Food Equipment Materials.
BRIDGIT
®
PASTE FLUX
Bridgit
®
flux is burn resistant, reducing black carbon formations that
can cause leaks. This flux is unmatched for use in soldering copper,
brass, bronze, galvanized, and other plumbing fittings. Works equally
well with other solders.
BRIDGIT
®
WATER SOLUBLE FLUX
This flux is formulated so water flushing will remove flux residue from
copper tube runs. Water soluble flux conforms to ASTM B813-93, and
meets state and local regulations for use in potable water systems.
BRIDGIT
®
COMMON WIRE
SOLDERS FOR TIN-LEAD
TIN-LEAD 50/50, 40/60, 60/40
Meets ASTM B32. With some exceptions, the tin-lead solders can
be used to solder copper to most copper, lead, high-nickel and steel
alloys.
Tin-lead solders are not recommended for use in high stress or
vibration joints in the cooling industry due to lack of sufficient
elongation properties. Heat sources for use with solder include
soldering guns, irons, and torch applications.
TIN-ANTIMONY 95/5
Meets ASTM B32. The 95/5 tin-antimony solder is useful for
applications where moderately elevated temperature is a factor. It
has a higher electrical conductivity and is sometimes used where
lead contamination must be avoided. The tin-antimony solders are
not recommended for use on brass.
Harris 95/5 is certified to ANSI/NSF 61 and NSF/ANSI 372 for drinking
water systems. Conforms to lead-free content requirements of the
U.S. Safe Drinking Water Act.
FLUX SELECTION FOR TIN-LEAD, AND
TIN-ANTIMONY SOLDERS
Both Stay-Clean
®
paste and liquid soldering fluxes are
recommended, except in electrical or electronic applications that
require the use of a non-corrosive flux.
TIN/LEAD SOLDERS
COMPOSITION/ PROPERTIES
Solder Tin Lead Antimony Solidus Liquidus
*40/60 40 60 - 360˚F (182˚C) 460˚F (238˚C)
*60/40 60 40 - 360˚F (182˚C) 375˚F (191˚C)
*50/50 50 50 - 360˚F (182˚C) 420˚F (216˚C)
95/5 95 - 5 452˚F (233˚C) 464˚F (240˚C)
* 40/60, 60/40, 50/50 solders are available in solid, rosin or acid core.
COMMON
LEAD-FREE SOLDERS
BRIDGIT
®
LEAD-FREE SOLDER