ZTU-IPEX Module Datasheet Hardware Product Development > Network Modules > Zigbee Module > ZT Series Module Version: 20210308 Online Version
Contents Contents 1 Overview 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2 2 2 2 Module interfaces 2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 5 3 Electrical parameters 3.
Contents 8 Appendix: Statement 23 ii
Contents ZTU-IPEX is a low-power embedded Zigbee module that Tuya has developed. It consists of a highly integrated RF processing chip (TLSR8258F1KAT32), a few peripherals, a built-in 802.15.4 PHYMAC Zigbee network protocol stack, and rich library functions. ZTU-IPEX is embedded with a low-power 32-bit CPU, 1-MB flash program memory, 64-KB RAM, and abundant peripheral resources.
1 OVERVIEW 1 Overview ZTU-IPEX is a FreeRTOS platform that integrates all function libraries of the Zigbee MAC and TCP/IP protocols. You can develop embedded Zigbee products as required. 1.1 Features • • • • Embedded with a low-power 32-bit CPU processor The clock rate: 48 MHz Wide working voltage: 1.8 to 3.6 V Peripherals: 9 general-purpose input/output (GPIO), 1 universal asynchronous receiver/transmitter (UART), and 2 analog-to-digital converters (ADC) • Zigbee connectivity – Support 802.15.
2 MODULE INTERFACES Update date Updated content Version after update 3/8/2021 This is the first release. V1.0.0 2 Module interfaces 2.1 Dimensions and package ZTU-IPEX has 3 rows of pins with a 1.4±0.1 mm pin spacing. The ZTU-IPEX dimensions are 20.3±0.35 mm (W)×15.8±0.35 mm (L) ×3±0.15 mm (H).
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2 MODULE INTERFACES 2.
2 MODULE INTERFACES Pin number Symbol I/O type Function 2 D7 I/O Common I/O pin, which corresponds to D7 (Pin 2) of IC 3 C0 I/O Common I/O pin, which corresponds to C0 (Pin 20) of IC 4 SWS I/O Burning pin, which corresponds to SWS (Pin 5) of IC 5 B6 I/O ADC pin, which corresponds to B6 (Pin 16) of IC 6 A0 I/O Common I/O pin, which corresponds to A0 (Pin 3) of IC 7 A1 I/O Common I/O pin, which corresponds to A1 (Pin 4) of IC 8 C2 I/O Support hardware PWM and correspond to C2
2 MODULE INTERFACES Pin number Symbol I/O type Function 10 D2 I/O Support hardware PWM and correspond to D2 (Pin 31) on the internal IC 11 B4 I/O Support hardware PWM and correspond to B4 (Pin 14) on the internal IC 12 B5 I/O Support hardware PWM and correspond to B5 (Pin 15) on the internal IC 13 GND P Power supply reference ground 14 VCC P Power supply pin (3.
2 MODULE INTERFACES Pin number Symbol I/O type Function 19 C1 I/O Common I/O pin, which corresponds to C1 (Pin 21) of IC 20 D4 I/O Common I/O pin, which corresponds to D4 (Pin 1) of IC 21 NC I/O No connection Note: P indicates a power supply pin and I/O indicates an input/output pin.
3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Minimum value Maximum value Unit Parameter Description Ta Working temperature -40 105 ℃ VBAT Power supply voltage 1.8 3.6 V Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV 3.
3 ELECTRICAL PARAMETERS Minimum value Typical value Maximum value Unit Parameter Description VIL I/O low-level input - - VDD*0.3 V VIH I/O high-level input VDD*0.7 - - V VOL I/O low-level output - - VDD*0.2 V VOH I/O high-level output VDD*0.8 - - V 3.3 TX and RX power consumption Average value Peak value (Typical value) Working status Mode Rate Transmit power/receive Transmit - 250Kbps +0 dBm 4.64 4.73 mA Transmit - 250Kbps +10 dBm 8.
4 Working mode Working status, Ta = 25°C RF PARAMETERS Average value Maximum value (Typical value) Unit Quick network connection state The module is in the fast network connection state 9.5 13.5 mA Network connection state The module is connected to the network 8.9 10.5 mA Deep sleep mode Deep sleep mode, reserve 32KB SRAM 1.4 - uA 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency 2.405 to 2.480 GHz Zigbee standard IEEE 802.15.
4 Minimum value Maximum output power (250 Kbps) RF PARAMETERS Typical value Maximum value Unit - 10 - dBm Minimum output power (250 Kbps) - -25 - dBm Output power adjustment stepping - 0.5 1 dBm Output spectrum adjacent channel suppression - -31 - dBc Frequency error -10 - 10 ppm Minimum value Typical value Maximum value Unit -102 -101 -99 dBm Parameter 4.
5 ANTENNA 5 Antenna 5.1 Antenna type ZTU-IPEX uses only an IPEX antenna. 5.2 Antenna interference reduction To ensure the optimal Zigbee performance when the Zigbee module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.
6 PACKAGING AND PRODUCTION 6 Packaging and production 6.1 Mechanical dimensions The PCB dimensions are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×3±0.15 mm (H).
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6 PACKAGING AND PRODUCTION 6.3 Schematic diagram of a packaging 6.4 PCB Packaging-pin header ZTU-IPEX can choose SMT placement or pin header plug-in.
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6 PACKAGING AND PRODUCTION 6.5 Production instructions 1. Mount Tuya’s stamp hole package module with an SMT machine within 24 hours after unpacking and burning the firmware. Otherwise, the module must be packaged again under vacuum. The module must be baked before mounting.
6 PACKAGING AND PRODUCTION – Reflow soldering machine – Automated optical inspection (AOI) equipment – Nozzle with a 6 to 8 mm diameter • Baking equipment: – Cabinet oven – Anti-static heat-resistant trays – Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows: • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
6 PACKAGING AND PRODUCTION • Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized for over 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and consequences. 6. Before using SMT, take electrostatic discharge (ESD) protective measures. 7.
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8 APPENDIX: STATEMENT 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method ZTU-IPEX 4000 Tape reel The number of modules per reel The number of reels per carton 1000 4 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. This device complies with Part 15 of the FCC Rules.
8 APPENDIX: STATEMENT rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
8 APPENDIX: STATEMENT of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
