Data Sheet

6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
needs to be put into the drying cupboard where the relative humidity is not
greater than 10%; or it needs to be packaged again under vacuum and the
exposure time needs to be recorded (the total exposure time cannot exceed
168 hours).
• (SMT process) SMT devices:
– Mounter
– SPI
– Reflow soldering machine
– Thermal profiler
– Automated optical inspection (AOI) equipment
• (Wave soldering process) Wave soldering devices
– Wave soldering equipment
– Wave soldering fixture
– Constant-temperature soldering iron
– Tin bar, tin wire, and flux
– Thermal profiler
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
3. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
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