Data Sheet

7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
7.6 Production Instructions
1. Tuya’s stamp hole package module must be mounted by SMT machine within
24 hours after unpacking and programming of firmware. Otherwise, it must be
packaged again under vacuum. The module must be baked before mounting.
A. SMT equipment
a) Reflow soldering machine
b) Automated optical inspection (AOI) equipment
c) Nozzle with a 6 mm to 8 mm diameter B. Baking equipment
d) Cabinet oven
e) Anti-static heat-resistant trays
f) Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows: A. The moisture-proof
bag must be placed in an environment where the temperature is below 30℃
and the relative humidity is lower than 70%. B. The shelf life of a dry-packaged
product is 6 months from the date when the product is packaged and sealed.
C. The package contains a humidity indicator card (HIC).
3. Bake a module based on HIC status as follows when you unpack the module
package: A. If the 30%, 40%, and 50% circles are blue, bake the module for
2 consecutive hours. B. If the 30% circle is pink, bake the module for 4 con-
secutive hours. C. If the 30% and 40% circles are pink, bake the module for
6 consecutive hours. D. If the 30%, 40%, and 50% circles are pink, bake the
module for 12 consecutive hours.
4. Baking settings: A. Baking temperature: 125℃ B. Alarm temperature: 130℃ C.
SMT ready temperature after natural cooling: < 36℃ D. The number of drying
times: 1 E. Rebaking condition: The module is not soldered within 12 hours
after baking
5. Do not use SMT to process modules that have been unpacked for more than
3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs
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