Data Sheet

8 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
8.4 Production Instructions
1. Tuya’s stamp hole package module must be mounted by SMT machine within
24 hours after unpacking and programming of firmware. Otherwise, it must be
packaged again under vacuum. The module must be baked before mounting.
A. SMT equipment
• Reflow soldering machine
• Automated optical inspection (AOI) equipment
• Nozzle with a 6 mm to 8 mm diameter
B. Baking equipment
• Cabinet oven
• Anti-static heat-resistant trays
• Anti-static heat-resistant gloves
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