Data Sheet

7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
2. The module developed by Tuya needs to be baked in the following cases:
• Vacuum packaging bag was damaged before unpacking.
• There is no humidity indicator card (HIC) in the vacuum packaging bag.
• After unpacking, 30% and above circles on the HIC become pink.
• Production is not completed within 72 hours after unpacking.
• More than 6 months have passed since the date of sealing the bag.
3. Baking settings:
• Baking temperature: reel packing 65±5℃, pallet packing 125±5℃
• Baking time: reel packing 48 hours, pallet packing 12 hours
• Alarm Temperature: reel packing 70℃, pallet packing 130℃
• Production ready temperature after natural cooling: < 36°C
• The number of drying times: 1
• Rebaking condition: The module is not soldered within 72 hours after bak-
ing
4. Do not use wave soldering to process modules that have been unpacked for
more than 3 months, because electroless nickel/immersion gold (ENIG) is used
for PCBs and they are seriously oxidized after more than 3 months. Wave sol-
dering is very likely to cause pseudo and missing soldering. Tuya is not liable
for such problems and consequences.
5. In the production process, take electrostatic discharge (ESD) protective mea-
sures.
6. To ensure the quality of products, you should pay attention to the amount of
soldering flux, the height of the wave peak, whether the tin slag and copper
content in the wave soldering tank exceed standards, whether the window and
thickness of the wave soldering fixture are appropriate, and whether the wave
soldering oven temperature curve is reasonable.
7.4 Recommended oven temperature curve and temperature
For oven temperature setting, refer to oven temperatures for wave soldering. The
peak temperature is 260℃±5℃. The wave soldering temperature curve is as be-
low:
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