Data Sheet

o
r solder skips may occur. Tuya is not liable for such problems and consequences.
6.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
7.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and
AOI before f
irst SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
batches for visual inspection and AOI.
6.4 Recommended Oven Temperature Curve
Perform SMT placement based on the
highest temperature is 245°C.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
Figure 6
WBR1
17
r solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and
irst SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
batches for visual inspection and AOI.
6.4 Recommended Oven Temperature Curve
Perform SMT placement based on the
following reflow oven temperature curve. The
highest temperature is 245°C.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
Figure 6
-6 Oven temperature curve
WBR1
-IPEX Datasheet
r solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and
irst SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
following reflow oven temperature curve. The
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.