Data Sheet

iii. Anti-
static heat
2.
Storage conditions for a delivered module are as
(1) The moisture-
proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
(2)
The shelf life of a dry
product is packaged and sealed.
(3) The p
ackage contains a humidity indicator card (HIC).
3.
Bake a module based on HIC status as follows when you unpack the module
package:
(1)
If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2) If the 30%
circle is pink, bake the module for 4 consecutive hours.
(3)
If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4)
If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
(1)
Baking temperature
(2)
Alarm temperature: 130°C
(3)
SMT placement ready temperature after natural cooling: < 36°C
(4)
Number of drying times: 1
(5)
Rebaking condition: The module is not soldered within 12 hours after baking.
5.
Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
WBR1
16
static heat
-resistant gloves
Storage conditions for a delivered module are as
follows:
proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
The shelf life of a dry
-
packaged product is six months from the date when the
product is packaged and sealed.
ackage contains a humidity indicator card (HIC).
Figure 6-5 HIC for WBR1-IPEX
Bake a module based on HIC status as follows when you unpack the module
If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
circle is pink, bake the module for 4 consecutive hours.
If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
Baking temperature
: 125±5°C
Alarm temperature: 130°C
SMT placement ready temperature after natural cooling: < 36°C
Number of drying times: 1
Rebaking condition: The module is not soldered within 12 hours after baking.
Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
WBR1
-IPEX Datasheet
proof bag is placed in an environment where the temperature is
packaged product is six months from the date when the
Bake a module based on HIC status as follows when you unpack the module
If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
circle is pink, bake the module for 4 consecutive hours.
If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
Rebaking condition: The module is not soldered within 12 hours after baking.
Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints