Data Sheet

Figure 6-
4 Layout of the PCB to which
6.3 Production Instructions
1.
Use an SMT placemen
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
onto the PCB.
(1)
SMT placement equipment
i.
Reflow soldering machine
ii.
Automated optical inspection (AOI) equipment
iii.
Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-
static heat
WBR1
15
4 Layout of the PCB to which
WBR1-IPEX
applies
6.3 Production Instructions
Use an SMT placemen
t machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
SMT placement equipment
Reflow soldering machine
Automated optical inspection (AOI) equipment
Nozzle with a 6 mm to 8 mm diameter
static heat
-resistant trays
WBR1
-IPEX Datasheet
applies
t machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it