Product Manual

15
WB8P Datesheet
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30°C
and the relative humidity is lower than 85%.
(2) The shelf life of a dry-packaged product is 12 months from the date when the product is
packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-4 HIC for WB8P
3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for over three months. Electroless
nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for
over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is
not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before
first SMT placement to determine a proper oven temperature and component placement method.
Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.