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WB3S Datasheet

1. Product Overview

WB3S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a

highly integrated RF chip (BK7231T) and several peripheral components, with an

embedded Wi-Fi network protocol stack and robust library functions. WB3S also

contains a low-power Arm Cortex-M4 microcontroller unit (MCU), 1T1R WLAN module,

256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive

peripherals.

WB3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and

TCP/IP protocols. You can develop embedded Wi-Fi products as required.

1.1 Features

 Embedded low-power 32-bit CPU, which can also function as an application

processor

 Clock rate: 120 MHz

 Working voltage: 3.0 V to 3.6 V

 Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART),

and one analog-to-digital converter (ADC)

 Wi-Fi connectivity

 802.11b/g/n

 Channels 1 to 14 at 2.4 GHz

 WPA and WPA2 security modes

 Up to +20 dBm output power in 802.11b mode

 EZ net pairing mode for Android and iOS devices

 Onboard PCB antenna with a gain of 1.5 dBi

Tuya WB3S Wi-Fi Module

Version: 1.0.0 Date: 2019-11-22

No.: 0000000001

Product

Manual

Global Intelligent Platform

Summary of content (21 pages)

PAGE 1
Global Intelligent Platform WB3S Datasheet Tuya WB3S Wi-Fi Module Product Manual Version: 1.0.0 Date: 2019-11-22 No.: 0000000001 1. Product Overview WB3S is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.
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WB3S Datasheet   Working temperature: –20°C to +85°C BT  Support Bluetooth (V4.0)  Maximum output power + 7dBm  Onboard PCB antenna with a gain of 1.5 dBi 1.
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WB3S Datasheet Change History No. Date 1 2019-11-22 Change Description This is the first release. 3 Version After Change 1.0.
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WB3S Datasheet Contents 1. Product Overview ............................................................................................................ 1 1.1 Features.................................................................................................................. 1 1.2 Applications ............................................................................................................ 2 2 Module Interfaces ...............................................................................
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WB3S Datasheet Figures Figure 2-1 WB3S front and rear views ................................................................................ 6 Figure 5-1 Antenna clearance part .................................................................................... 13 Figure 6-1 WB3S mechanical dimensions ........................................................................ 14 Figure 6-2 Side view ..........................................................................................................
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WB3S Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WB3S has two rows of pins with a 2 mm pin spacing. The WB3S dimensions (H x W x D) are 3.5 mm x 16 mm x 24 mm. Figure 2-1 shows the WB3S front and rear views. Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. Figure 2-1 WB3S front and rear views 2.2 Interface Pin Definition Table 2-1 WB3S interface pins Pin No.
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WB3S Datasheet Pin No. Symbol I/O Type 3 EN Input Enabling pin, which is internally pulled up and compatible with other module design 4 P14 I/O Common GPIO, which is connected to the P14 pin on the internal IC 5 PWM5 I/O GPIOP_26, which is connected to the P26 pin on the internal IC 6 PWM4 I/O GPIOP_24, common GPIO, which is connected to the P24 pin on the internal IC 7 PWM0 I/O GPIOP_6, which is connected to the P6 pin on the internal IC 8 VCC P Power supply pin (3.
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WB3S Datasheet Note: 1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 3. UART1 is a user-side serial interface pin, which generates information when the module is powered on and starts. 2.3 Test Pin Definition Table 2-2 WB3S test pins Pin No.
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WB3S Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature –40 150 °C VCC Power supply voltage –0.3 3.6 V Static electricity voltage (human body model) Tamb = 25°C N/A 2 kV Static electricity voltage (machine model) Tamb = 25°C N/A 0.5 kV 3.
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WB3S Datasheet Parameter Description Minimum Value Typical Value Maximum Value Unit 6 15 mA output Imax I/O drive current N/A 3.3 RF Current Consumption Table 3-3 Power consumption during constant transmission and receiving Working Status Parameter Mode Rate Unit TX Power/Receiving Typical Value 802.11b 11 Mbit/s +16 dBm 222 mA 802.11g 54 Mbit/s +14 dBm 195 mA 802.11n MCS7 +12 dBm 185 mA 802.11n HT40 MCS7 +12 dBm 190 mA 802.
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WB3S Datasheet Working Mode Working Status (Ta = 25°C) and operating and the Wi-Fi indicator is steady on. Disconnect ed The module is disconnected from the network, and the Wi-Fi indicator is steady off. Typical Value Peak Value* Unit 60 110 mA 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Frequency band Description BT:2.400 GHz to 2.4835 GHz WIFI:2.412 GHz to 2.484 GHz Wi-Fi standard IEEE 802.
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WB3S Datasheet Parameter Minimum Value Typical Value Maximum Value Unit 802.11b CCK mode Average RF output power, 802.11g OFDM mode 54 Mbit/s N/A 14 N/A dBm Average RF output power, 802.11n OFDM mode MCS7 N/A 13 N/A dBm –2 N/A +2 ppm Frequency error EVM under 802.11b CCK, 11 Mbit/s, 17 dBm –23 dB EVM under 802.11g OFDM, 54 Mbit/s, 11 dBm –26 –27 –29 dB EVM under 802.11n OFDM, MCS7, 10 dBm –26 –27 –29 dB 4.
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WB3S Datasheet 5 Antenna Information 5.1 Antenna Type WB3S uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions, as shown in Figure 5-1.
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WB3S Datasheet 6 Packaging Information and Production Instructions 6.
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WB3S Datasheet Figure 6-2 Side view Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.
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WB3S Datasheet Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii.
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WB3S Datasheet 3. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4.
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WB3S Datasheet 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
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WB3S Datasheet 6.
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WB3S Datasheet Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.
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WB3S Datasheet The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.