Data Sheet

SMT devices:
Mounter
SPI
Reflow soldering machine
Thermal profiler
Automated optical inspection (AOI) equipment
Baking devices:
Cabinet oven
Anti-electrostatic and heat-resistant trays
Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and t
lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and
There is a humidity indicator card (HIC) in the packaging bag.
3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking.
There is no HIC in the packaging bag.
After unpacking, circles of 10% and above on the HIC become pink.
The total exposure time has lasted for over 168 hours since unpacking.
More than 12 months has passed since the sealing of the bag.
4. Baking settings:
Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use
rather than plastic container)
Time: 48 hours for reel package and 12 hours for tray package
Alarm temperature: 65°C for reel package and 135°C for tray package
Production-ready temperature after natural cooling: < 36°C
Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be b
If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Be
Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowab
they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of s
mounting.