Product Manual

TYWE3SE Datasheet

Figure 6-4 PCB encapsulation diagram of TYWE3SE

6.3 Production Instructions

1. Use an SMT placement machine to mount components to the stamp hole module that

Tuya produces within 24 hours after the module is unpacked and the firmware is

burned. If not, vacuum pack the module again. Bake the module before mounting

components to the module.

(1) SMT placement equipment

i. Reflow soldering machine

ii. Automated optical inspection (AOI) equipment

iii. Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment

i. Cabinet oven